Joining of semiconductor bodies for junction formation

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H01L21/185

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/185Joining of semiconductor bodies for junction formation

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Joining of semiconductor bodies for junction formation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pseudo-substrate with improved efficiency of usage of single crysta...

Bonding method, bonding device, and holding member

Methods for processing a wide band gap semiconductor wafer using a...

Semiconductor memory device including integrated control circuit an...

Three-dimensionally stretchable single crystalline semiconductor me...

Semiconductor device having a pad proximate to a step structure sec...

System and method for a transducer in an EWLB package

SiC composite substrate and method for manufacturing same

Semiconductor module and power conversion device

Bonding method, bonding device, and holding member

Semiconductor substrate structure and power semiconductor device

Method of forming and transferring thin film using SOI wafer and he...

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Pseudo-substrate with improved efficiency of usage of single crysta...

Semiconductor memory device having a bonded circuit chip including...

Semiconductor memory device having an array chip bonded to a circui...

Laser bonding apparatus, method of bonding semiconductor devices, a...

Method for hybrid wafer-to-wafer bonding

SiC composite substrate and method for manufacturing same

Solid-state wafer bonding of functional materials on substrates and...

System and method for a transducer in an eWLB package

Metal-metal direct bonding method

Wafer stacking to form a multi-wafer-bonded structure

Semiconductor device and method for fabricating the same

Semiconductor memory device having bonding metal between an array c...

Quasi-vertical diode with integrated ohmic contact base and related...

III-V semiconductor diode

System and method for a transducer in an eWLB package

Method for permanently bonding wafers by a connecting layer by mean...

Semiconductor devices with cavities

Patents Applicationslast 30 patents

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

STACKED SUBSTRATE FOR LASER LIFT-OFF, SUBSTRATE PROCESSING METHOD,...

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING...

TRANSISTOR WITH A BODY AND BACK GATE STRUCTURE IN DIFFERENT MATERIA...

SEMICONDUCTOR MEMORY DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

SUBSTRATE FOR AN ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

METHOD OF FORMING AND TRANSFERRING THIN FILM USING SOI WAFER AND HE...

SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

SiC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

THREE-DIMENSIONALLY STRETCHABLE SINGLE CRYSTALLINE SEMICONDUCTOR ME...

METHODS FOR PROCESSING A SUBSTRATE

SYSTEM AND METHOD FOR A TRANSDUCER IN AN EWLB PACKAGE

SEMICONDUCTOR SUBSTRATE STRUCTURE AND POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR MEMORY DEVICE

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

LASER BONDING APPARATUS, METHOD OF BONDING SEMICONDUCTOR DEVICES, A...

METHOD FOR HYBRID WAFER-TO-WAFER BONDING

System and Method for a Transducer in an eWLB Package