Joining of semiconductor bodies for junction formation

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CPC
H01L21/185

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/185Joining of semiconductor bodies for junction formation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
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- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including integrated control circuit an...
- Patent number 11,871,576
- Issue date Jan 9, 2024
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Information Patent Grant
Three-dimensionally stretchable single crystalline semiconductor me...
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- Issue date Jul 11, 2023
- International Business Machines Corporation
- Alexander Reznicek
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a pad proximate to a step structure sec...
- Patent number 11,594,547
- Issue date Feb 28, 2023
- Kioxia Corporation
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a transducer in an EWLB package
- Patent number 11,211,298
- Issue date Dec 28, 2021
- Infineon Technologies AG
- Stephan Pindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC composite substrate and method for manufacturing same
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- Issue date Dec 28, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion device
- Patent number 11,127,603
- Issue date Sep 21, 2021
- Mitsubishi Electric Corporation
- Osamu Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding device, and holding member
- Patent number 11,004,686
- Issue date May 11, 2021
- Nikon Corporation
- Hajime Mitsuishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate structure and power semiconductor device
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- Issue date May 11, 2021
- Rohm Co., Ltd.
- Takuji Maekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming and transferring thin film using SOI wafer and he...
- Patent number 10,957,538
- Issue date Mar 23, 2021
- IUCF-HYU (Industry-University Cooperation Foundation Hanyang University)
- Chang Hwan Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...
- Patent number 10,910,782
- Issue date Feb 2, 2021
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
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- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
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- SOITEC
- Fabrice Letertre
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor memory device having a bonded circuit chip including...
- Patent number 10,892,269
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having an array chip bonded to a circui...
- Patent number 10,892,270
- Issue date Jan 12, 2021
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding apparatus, method of bonding semiconductor devices, a...
- Patent number 10,886,248
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Jun-su Lim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for hybrid wafer-to-wafer bonding
- Patent number 10,796,913
- Issue date Oct 6, 2020
- Shanghai IC R&D Center Co., Ltd.
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiC composite substrate and method for manufacturing same
- Patent number 10,711,373
- Issue date Jul 14, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Kubota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a transducer in an eWLB package
- Patent number 10,546,752
- Issue date Jan 28, 2020
- Infineon Technologies AG
- Stephan Pindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-metal direct bonding method
- Patent number 10,483,111
- Issue date Nov 19, 2019
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer stacking to form a multi-wafer-bonded structure
- Patent number 10,475,664
- Issue date Nov 12, 2019
- Raytheon Company
- Andrew Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,453,864
- Issue date Oct 22, 2019
- Samsung Electronics Co., Ltd.
- Sung Dae Suk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having bonding metal between an array c...
- Patent number 10,403,635
- Issue date Sep 3, 2019
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quasi-vertical diode with integrated ohmic contact base and related...
- Patent number 10,283,363
- Issue date May 7, 2019
- University of Virginia Patent Foundation
- Naser Alijabbari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-V semiconductor diode
- Patent number 10,263,124
- Issue date Apr 16, 2019
- 3-5 Power Electronics GmbH
- Volker Dudek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for a transducer in an eWLB package
- Patent number 10,186,468
- Issue date Jan 22, 2019
- Infineon Technologies AG
- Stephan Pindl
- G01 - MEASURING TESTING
Information Patent Grant
Method for permanently bonding wafers by a connecting layer by mean...
- Patent number 10,163,681
- Issue date Dec 25, 2018
- EV Group E. Thallner GmbH
- Klaus Martinschitz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with cavities
- Patent number 10,153,167
- Issue date Dec 11, 2018
- Great Wall Semiconductor Corporation
- Patrick M. Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer to wafer bonding techniques for III-V wafers and CMOS wafers
- Patent number 10,134,945
- Issue date Nov 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-V semiconductor diode
- Patent number 10,074,540
- Issue date Sep 11, 2018
- 3-5 Power Electronics GmbH
- Volker Dudek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
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- Publication date Dec 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...
- Publication number 20230369095
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- EV GROUP E. THALLNER GMBH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
- Publication number 20230343733
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- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230165009
- Publication date May 25, 2023
- Kioxia Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT
- Publication number 20230134255
- Publication date May 4, 2023
- Mitsubishi Electric Corporation
- Masahiro FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR AN ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20220367188
- Publication date Nov 17, 2022
- Shin-Etsu Handotai Co., Ltd.
- Kazunori HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20210225651
- Publication date Jul 22, 2021
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20210118898
- Publication date Apr 22, 2021
- Toshiba Memory Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210082942
- Publication date Mar 18, 2021
- Toshiba Memory Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...
- Publication number 20210050248
- Publication date Feb 18, 2021
- SOITEC
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF FORMING AND TRANSFERRING THIN FILM USING SOI WAFER AND HE...
- Publication number 20210005457
- Publication date Jan 7, 2021
- IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
- Chang Hwan CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
- Publication number 20200343106
- Publication date Oct 29, 2020
- Mitsubishi Electric Corporation
- Osamu USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200149189
- Publication date May 14, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Kubota
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Information Patent Application
THREE-DIMENSIONALLY STRETCHABLE SINGLE CRYSTALLINE SEMICONDUCTOR ME...
- Publication number 20200123677
- Publication date Apr 23, 2020
- International Business Machines Corporation
- Alexander Reznicek
- C30 - CRYSTAL GROWTH
Information Patent Application
METHODS FOR PROCESSING A SUBSTRATE
- Publication number 20200105569
- Publication date Apr 2, 2020
- Corning Incorporated
- Dongyoung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR A TRANSDUCER IN AN EWLB PACKAGE
- Publication number 20200051824
- Publication date Feb 13, 2020
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE STRUCTURE AND POWER SEMICONDUCTOR DEVICE
- Publication number 20190371894
- Publication date Dec 5, 2019
- Rohm Co., Ltd.
- Takuji MAEKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190333927
- Publication date Oct 31, 2019
- Toshiba Memory Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20190273090
- Publication date Sep 5, 2019
- Toshiba Memory Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER
- Publication number 20190267238
- Publication date Aug 29, 2019
- Nikon Corporation
- Hajime MITSUISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER BONDING APPARATUS, METHOD OF BONDING SEMICONDUCTOR DEVICES, A...
- Publication number 20190214362
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Jun-su LIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR HYBRID WAFER-TO-WAFER BONDING
- Publication number 20190214257
- Publication date Jul 11, 2019
- Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for a Transducer in an eWLB Package
- Publication number 20190148253
- Publication date May 16, 2019
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20180374864
- Publication date Dec 27, 2018
- Toshiba Memory Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180358373
- Publication date Dec 13, 2018
- Toshiba Memory Corporation
- Yoshiaki FUKUZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180175070
- Publication date Jun 21, 2018
- Samsung Electronics Co., Ltd.
- Sung Dae SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-V SEMICONDUCTOR DIODE
- Publication number 20180138320
- Publication date May 17, 2018
- 3-5 Power Electronics GmbH
- Volker DUDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION TOLERANT III-V SEMICONDUCTOR HETEROSTRUCTURES AND DEVICES...
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- Intel Corporation
- HAROLD W. KENNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI-VERTICAL DIODE WITH INTEGRATED OHMIC CONTACT BASE AND RELATED...
- Publication number 20170250083
- Publication date Aug 31, 2017
- University of Virginia
- Naser Alijabbari
- H01 - BASIC ELECTRIC ELEMENTS

Joining of semiconductor bodies for junction formation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for processing a wide band gap semiconductor wafer using a...

Semiconductor memory device including integrated control circuit an...

Three-dimensionally stretchable single crystalline semiconductor me...

Semiconductor device having a pad proximate to a step structure sec...

System and method for a transducer in an EWLB package

SiC composite substrate and method for manufacturing same

Semiconductor module and power conversion device

Bonding method, bonding device, and holding member

Semiconductor substrate structure and power semiconductor device

Method of forming and transferring thin film using SOI wafer and he...

Treatment, before the bonding of a mixed Cu-oxide surface, by a pla...

Pseudo-substrate with improved efficiency of usage of single crysta...

Semiconductor memory device having a bonded circuit chip including...

Semiconductor memory device having an array chip bonded to a circui...

Laser bonding apparatus, method of bonding semiconductor devices, a...

Method for hybrid wafer-to-wafer bonding

SiC composite substrate and method for manufacturing same

Solid-state wafer bonding of functional materials on substrates and...

System and method for a transducer in an eWLB package

Metal-metal direct bonding method

Wafer stacking to form a multi-wafer-bonded structure

Semiconductor device and method for fabricating the same

Semiconductor memory device having bonding metal between an array c...

Quasi-vertical diode with integrated ohmic contact base and related...

III-V semiconductor diode

System and method for a transducer in an eWLB package

Method for permanently bonding wafers by a connecting layer by mean...

Semiconductor devices with cavities

Wafer to wafer bonding techniques for III-V wafers and CMOS wafers

III-V semiconductor diode

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

SUBSTRATE HOLDER AND METHOD FOR PRODUCING A SUBSTRATE HOLDER FOR B...

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT

SUBSTRATE FOR AN ELECTRONIC DEVICE AND METHOD FOR PRODUCING THE SAME

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

METHOD OF FORMING AND TRANSFERRING THIN FILM USING SOI WAFER AND HE...

SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

SiC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

THREE-DIMENSIONALLY STRETCHABLE SINGLE CRYSTALLINE SEMICONDUCTOR ME...

METHODS FOR PROCESSING A SUBSTRATE

SYSTEM AND METHOD FOR A TRANSDUCER IN AN EWLB PACKAGE

SEMICONDUCTOR SUBSTRATE STRUCTURE AND POWER SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR MEMORY DEVICE

BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER

LASER BONDING APPARATUS, METHOD OF BONDING SEMICONDUCTOR DEVICES, A...

METHOD FOR HYBRID WAFER-TO-WAFER BONDING

System and Method for a Transducer in an eWLB Package

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

III-V SEMICONDUCTOR DIODE

DIFFUSION TOLERANT III-V SEMICONDUCTOR HETEROSTRUCTURES AND DEVICES...

QUASI-VERTICAL DIODE WITH INTEGRATED OHMIC CONTACT BASE AND RELATED...