Laminated device

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CPC
Y10T29/5317

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/5317Laminated device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 12,165,895
- Issue date Dec 10, 2024
- Cowles Semi, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-transferring system and chip-transferring method
- Patent number 12,125,719
- Issue date Oct 22, 2024
- Skilleux Electricity Inc.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component feeder mechanism with floating frame
- Patent number 12,114,430
- Issue date Oct 8, 2024
- Automation Technical Service Inc
- Kelvin Wiley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape feeder and mount device
- Patent number 12,096,565
- Issue date Sep 17, 2024
- FUJI CORPORATION
- Keita Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component replenishment management apparatus, component mounting sy...
- Patent number 12,041,725
- Issue date Jul 16, 2024
- Yamaha Hatsudoki Kabushiki Kaisha
- Yuichi Matsushita
- G05 - CONTROLLING REGULATING
Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for surface mounting electronic components on a printed cir...
- Patent number 12,010,800
- Issue date Jun 11, 2024
- IO Tech Group Ltd.
- Michael Zenou
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate work machine
- Patent number 12,010,801
- Issue date Jun 11, 2024
- FUJI CORPORATION
- Hisahiro Torii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular-design component handling device with component gripping to...
- Patent number 11,956,901
- Issue date Apr 9, 2024
- ASMPT GMBH & CO. KG
- Sebastian Lohmeier
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Information processing device, information processing method, and p...
- Patent number 11,950,370
- Issue date Apr 2, 2024
- FUJI CORPORATION
- Hiroko Tokunaga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electric component supply device, and electric component supply method
- Patent number 11,903,136
- Issue date Feb 13, 2024
- FUJI CORPORATION
- Takaji Mukohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal delivery in stacked device
- Patent number 11,887,969
- Issue date Jan 30, 2024
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component
- Patent number 11,848,147
- Issue date Dec 19, 2023
- Murata Manufacturing Co., Ltd.
- Yoshifumi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a camera for a vision system of a vehicle
- Patent number 11,812,563
- Issue date Nov 7, 2023
- Magna Electronics Inc.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electrical element transfer apparatus
- Patent number 11,805,633
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Hyun-Tae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Article management apparatus and article management method
- Patent number 11,778,800
- Issue date Oct 3, 2023
- FUJI CORPORATION
- Kazuya Fukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support pin arrangement determination assisting apparatus
- Patent number 11,778,796
- Issue date Oct 3, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirokazu Takehara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component mounting method
- Patent number 11,770,901
- Issue date Sep 26, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component mounting device
- Patent number 11,751,371
- Issue date Sep 5, 2023
- FUJI CORPORATION
- Kohei Sugihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses for executing a direct transfer of a semiconductor devi...
- Patent number 11,728,195
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,728,189
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil laminate intermediate and method of manufacturing
- Patent number 11,710,886
- Issue date Jul 25, 2023
- AVERY DENNISON RETAIL INFORMATION SERVICES LLC
- Ian J. Forster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repair or refurbishment of limited use medical devices
- Patent number 11,647,996
- Issue date May 16, 2023
- Medline Industries, LP
- Richard Walton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wired circuit board and imaging device
- Patent number 11,627,661
- Issue date Apr 11, 2023
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil component and manufacturing method therefor
- Patent number 11,621,117
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Tetsuya Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component supply device and surface mounting machine
- Patent number 11,606,891
- Issue date Mar 14, 2023
- Yamaha Hatsudoki Kabushiki Kaisha
- Tomoharu Kurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing laminated iron core
- Patent number 11,605,988
- Issue date Mar 14, 2023
- Mitsui High-Tec, Inc.
- Shuichi Nakamura
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Tape feeder and carrier tape loading method
- Patent number 11,596,090
- Issue date Feb 28, 2023
- FUJI CORPORATION
- Hiroyasu Ohashi
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM INTEGRATION
- Publication number 20240128238
- Publication date Apr 18, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT
- Publication number 20240079178
- Publication date Mar 7, 2024
- Murata Manufacturing Co., Ltd.
- Yoshifumi MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses for executing a direct transfer of a semiconductor devi...
- Publication number 20240038564
- Publication date Feb 1, 2024
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS
- Publication number 20230403835
- Publication date Dec 14, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Hirokazu TAKEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20230397341
- Publication date Dec 7, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20230041977
- Publication date Feb 9, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SEMICONDUCTOR STRUCTURES
- Publication number 20230026177
- Publication date Jan 26, 2023
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL DELIVERY IN STACKED DEVICE
- Publication number 20220415855
- Publication date Dec 29, 2022
- Micron Technology, Inc.
- Brent Keeth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF
- Publication number 20220293575
- Publication date Sep 15, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220254636
- Publication date Aug 11, 2022
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20220240392
- Publication date Jul 28, 2022
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
3D INTEGRATIONS AND METHODS OF MAKING THEREOF
- Publication number 20220189864
- Publication date Jun 16, 2022
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS
- Publication number 20220095499
- Publication date Mar 24, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Hirokazu TAKEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Producing Lamination Stacks and Facility for Performing...
- Publication number 20210391775
- Publication date Dec 16, 2021
- Kienle + Spiess GmbH
- Björn Böker
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
COMPONENT FEEDER MECHANISM WITH FLOATING FRAME
- Publication number 20210392801
- Publication date Dec 16, 2021
- Automation Technical Service Inc
- Kelvin Wiley
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method and Apparatus to Increase Transfer Speed of Semiconductor De...
- Publication number 20210375656
- Publication date Dec 2, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...
- Publication number 20210343558
- Publication date Nov 4, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20210289634
- Publication date Sep 16, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
- Publication number 20210242185
- Publication date Aug 5, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE SEMICONDUCTOR INTEGRATION
- Publication number 20210175162
- Publication date Jun 10, 2021
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...
- Publication number 20210035955
- Publication date Feb 4, 2021
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Foil Laminate Intermediate and Method of Manufacturing
- Publication number 20200403291
- Publication date Dec 24, 2020
- Avery Dennison Retail Information Services, LLC
- Ian J. FORSTER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR
- Publication number 20200178397
- Publication date Jun 4, 2020
- MAGNA ELECTRONICS INC.
- Jens Steigerwald
- B60 - VEHICLES IN GENERAL
Information Patent Application
SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION
- Publication number 20200144170
- Publication date May 7, 2020
- BroadPak Corporation
- Farhang YAZDANI
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD OF MANUFACTURING SEPARABLE ELECTROMAGNETIC INDUCTIVE APPARAT...
- Publication number 20200013550
- Publication date Jan 9, 2020
- FerrarisPower Co., Ltd
- Ja-Il Koo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
COMPONENT PLACEMENT DEVICE
- Publication number 20190343006
- Publication date Nov 7, 2019
- Assembleon B.V.
- Roy Brewel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Lamination Stacks and Facility for Performing...
- Publication number 20190157950
- Publication date May 23, 2019
- Kienle + Spiess GmbH
- Björn Böker
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING METHOD
- Publication number 20190150333
- Publication date May 16, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Hirokazu TAKEHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20190141839
- Publication date May 9, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- Norihisa Yamasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Laminated device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatuses for executing a direct transfer of a semiconductor devi...

Chip-transferring system and chip-transferring method

Component feeder mechanism with floating frame

Tape feeder and mount device

3D integrations and methods of making thereof

Component replenishment management apparatus, component mounting sy...

Systems of applying materials to components

Systems for surface mounting electronic components on a printed cir...

Substrate work machine

Modular-design component handling device with component gripping to...

Information processing device, information processing method, and p...

Electric component supply device, and electric component supply method

Stacking integrated circuits containing serializer and deserializer...

Signal delivery in stacked device

Coil component

Method for assembling a camera for a vision system of a vehicle

Electrical element transfer apparatus

Article management apparatus and article management method

Support pin arrangement determination assisting apparatus

Electronic component mounting method

Component mounting device

Apparatuses for executing a direct transfer of a semiconductor devi...

Apparatus to control transfer parameters during transfer of semicon...

Foil laminate intermediate and method of manufacturing

Repair or refurbishment of limited use medical devices

Wired circuit board and imaging device

Coil component and manufacturing method therefor

Component supply device and surface mounting machine

Method for manufacturing laminated iron core

Tape feeder and carrier tape loading method

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

3D SYSTEM INTEGRATION

COIL COMPONENT

Apparatuses for executing a direct transfer of a semiconductor devi...

SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS

ELECTRONIC COMPONENT MOUNTING METHOD

3D HETEROGENEOUS INTEGRATIONS AND METHODS OF MAKING THEREOF

ENHANCED SEMICONDUCTOR STRUCTURES

SIGNAL DELIVERY IN STACKED DEVICE

SECURE SEMICONDUCTOR INTEGRATION AND METHOD FOR MAKING THEREOF

BONDING APPARATUS AND BONDING METHOD

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

3D INTEGRATIONS AND METHODS OF MAKING THEREOF

SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING APPARATUS

Method for Producing Lamination Stacks and Facility for Performing...

COMPONENT FEEDER MECHANISM WITH FLOATING FRAME

Method and Apparatus to Increase Transfer Speed of Semiconductor De...

METHOD AND APPARATUS TO CONTROL TRANSFER PARAMETERS DURING TRANSFER...

ELECTRONIC COMPONENT MOUNTING METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF

SECURE SEMICONDUCTOR INTEGRATION

STACKING INTEGRATED CIRCUITS CONTAINING SERIALIZER AND DESERIALIZER...

Foil Laminate Intermediate and Method of Manufacturing

VEHICULAR VISION SYSTEM CAMERA WITH COAXIAL CABLE CONNECTOR

SCALABLE SEMICONDUCTOR INTERPOSER INTEGRATION

METHOD OF MANUFACTURING SEPARABLE ELECTROMAGNETIC INDUCTIVE APPARAT...

COMPONENT PLACEMENT DEVICE

Method for Producing Lamination Stacks and Facility for Performing...

SUPPORT PIN ARRANGEMENT DETERMINATION ASSISTING METHOD

ELECTRONIC COMPONENT MOUNTING METHOD