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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/2402Laminated

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,948,891
- Issue date Apr 2, 2024
- NEPES CO., LTD.
- Sang Yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,810,883
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component-embedded substrate and method of making the same
- Patent number 11,735,560
- Issue date Aug 22, 2023
- Shinko Electric Industries Co., Ltd.
- Yoichi Nishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and manufacturing method thereof
- Patent number 11,646,270
- Issue date May 9, 2023
- Industrial Technology Research Institute
- Ang-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure with landing pads and manufacturing...
- Patent number 11,437,336
- Issue date Sep 6, 2022
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aligning component carrier structure with known-good sections and c...
- Patent number 11,430,703
- Issue date Aug 30, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, semiconductor package and method of fabric...
- Patent number 11,342,296
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,127,708
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a semiconductor body and a method for producing...
- Patent number 10,903,406
- Issue date Jan 26, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of light-emitting diode package structure
- Patent number 10,886,264
- Issue date Jan 5, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, semiconductor device and method of fabricating t...
- Patent number 10,854,569
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,833,041
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Jun Oh Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit battery attachment devices, systems, and methods
- Patent number 10,750,620
- Issue date Aug 18, 2020
- PHILIPS HEALTHCARE INFORMATICS, INC.
- Robert Ganton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode package structure and manufacturing method the...
- Patent number 10,700,049
- Issue date Jun 30, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,510,706
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,504,865
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable fabrication techniques and circuit packaging devices
- Patent number 10,506,715
- Issue date Dec 10, 2019
- The Regents of the University of California
- Todd Prentice Coleman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,438,927
- Issue date Oct 8, 2019
- Samsung Electronics Co, Ltd.
- Ha Yong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a circuit board element
- Patent number 10,426,040
- Issue date Sep 24, 2019
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate and making method
- Patent number 10,373,903
- Issue date Aug 6, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Yasuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer board and electronic device
- Patent number 10,354,939
- Issue date Jul 16, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,332,856
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an embedded SoP fan-out...
- Patent number 10,217,702
- Issue date Feb 26, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package for sensor applications
- Patent number 10,055,631
- Issue date Aug 21, 2018
- Synaptics Incorporated
- Shengmin Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded electronic packaging and associated methods
- Patent number 9,892,984
- Issue date Feb 13, 2018
- Harris Corporation
- Michael Raymond Weatherspoon
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240387434
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...
- Publication number 20230411263
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SooHan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230369273
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME
- Publication number 20230245992
- Publication date Aug 3, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS
- Publication number 20230230949
- Publication date Jul 20, 2023
- STMicroelectronics Pte Ltd
- Yong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20230178508
- Publication date Jun 8, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS
- Publication number 20230094820
- Publication date Mar 30, 2023
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA WIRING FORMATION SUBSTRATE, MANUFACTURING METHOD FOR VIA WIRING...
- Publication number 20210407950
- Publication date Dec 30, 2021
- SAN-EI KAGAKU CO., LTD.
- Hiroyuki KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210343674
- Publication date Nov 4, 2021
- Powertech Technology Inc.
- Jeffrey Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210313274
- Publication date Oct 7, 2021
- NEPES CO., LTD.
- Sang Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...
- Publication number 20210104653
- Publication date Apr 8, 2021
- OSRAM OLED GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRIC...
- Publication number 20210074665
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aligning Component Carrier Structure With Known-Good Sections and C...
- Publication number 20200357706
- Publication date Nov 12, 2020
- Marco Gavagnin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE
- Publication number 20200266181
- Publication date Aug 20, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20200118993
- Publication date Apr 16, 2020
- Samsung Electronics Co., Ltd.
- Tae-Ho KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20200118960
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200075526
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20200075564
- Publication date Mar 5, 2020
- Unimicron Technology Corp.
- Wei-Ti Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190312004
- Publication date Oct 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190244943
- Publication date Aug 8, 2019
- Powertech Technology Inc.
- Wen-Jeng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190189589
- Publication date Jun 20, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Ha Yong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190139924
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096841
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20190035758
- Publication date Jan 31, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Jun Oh HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND ELECTRONIC DEVICE
- Publication number 20180233429
- Publication date Aug 16, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPONENT AND COMPONENT
- Publication number 20180219145
- Publication date Aug 2, 2018
- Osram Opto Semiconductors GmbH
- Martin Unterburger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20180122789
- Publication date May 3, 2018
- Samsung Electronics Co., Ltd.
- Tae-Ho KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20180033762
- Publication date Feb 1, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor package and method of manufacturing the semiconductor...

Package structure

Electronic-component-embedded substrate and method of making the same

Multi-chip package and manufacturing method thereof

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor package structure with landing pads and manufacturing...

Aligning component carrier structure with known-good sections and c...

Semiconductor structure, semiconductor package and method of fabric...

Package structure and method of manufacturing the same

Housing comprising a semiconductor body and a method for producing...

Manufacturing method of light-emitting diode package structure

Package structure, semiconductor device and method of fabricating t...

Fan-out semiconductor package

Flexible circuit battery attachment devices, systems, and methods

Stacked electronics package and method of manufacturing thereof

Light-emitting diode package structure and manufacturing method the...

Ultra-thin embedded semiconductor device package and method of manu...

Package structure and method of fabricating the same

Package structure and method of manufacturing the same

Scalable fabrication techniques and circuit packaging devices

Fan-out semiconductor package

Method for producing a circuit board element

Laminate and making method

Multilayer board and electronic device

Package structure and method of fabricating the same

Semiconductor device and method of forming an embedded SoP fan-out...

Conductive connections, structures with such connections, and metho...

Semiconductor package for sensor applications

Embedded electronic packaging and associated methods

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

MODULAR SEMICONDUCTOR DEVICES AND ELECTRONIC DEVICES INCORPORATING...

PACKAGE STRUCTURE

INTEGRATED CIRCUIT CHIP PACKAGE THAT DOES NOT UTILIZE A LEADFRAME

SEMICONDUCTOR PACKAGE WITH EXPOSED ELECTRICAL CONTACTS

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

MICROELECTRONIC PACKAGES WITH EMBEDDED INTERPOSERS

VIA WIRING FORMATION SUBSTRATE, MANUFACTURING METHOD FOR VIA WIRING...

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

HOUSING COMPRISING A SEMICONDUCTOR BODY AND A METHOD FOR PRODUCING...

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRIC...

Aligning Component Carrier Structure With Known-Good Sections and C...

MANUFACTURING METHOD OF LIGHT-EMITTING DIODE PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THE...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

FAN-OUT SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

MULTILAYER BOARD AND ELECTRONIC DEVICE

METHOD FOR PRODUCING A COMPONENT AND COMPONENT

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...