laminating flexible circuit boards using additional insulating adhesive materials between the boards

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CPC
H05K3/4635

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4635laminating flexible circuit boards using additional insulating adhesive materials between the boards

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conformal aperture engine sensors and mesh network
- Patent number 12,146,769
- Issue date Nov 19, 2024
- Fractal Antenna Systems, Inc.
- Nathan Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biphasic material and stretchable circuit board
- Patent number 11,937,372
- Issue date Mar 19, 2024
- Yale University
- Rebecca Kramer-Bottiglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
- Patent number 11,924,980
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transmission circuit board
- Patent number 11,765,818
- Issue date Sep 19, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal aperture engine sensors and mesh network
- Patent number 11,662,233
- Issue date May 30, 2023
- Fractal Antenna Systems, Inc.
- Nathan Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for high-temperature lamination of printed circui...
- Patent number 11,445,619
- Issue date Sep 13, 2022
- Matrix Electronics Limited
- Kieran Healy
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible circuit board and method for manufacturing same
- Patent number 11,445,618
- Issue date Sep 13, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 11,330,709
- Issue date May 10, 2022
- AMOGREENTECH CO., LTD.
- Jeong Sang Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Conformal aperture engine sensors and mesh network
- Patent number 11,268,837
- Issue date Mar 8, 2022
- FRACTAL ANTENNA SYSTEMS, INC.
- Nathan Cohen
- G01 - MEASURING TESTING
Information Patent Grant
Conductor substrate, wiring substrate and method for producing wiri...
- Patent number 11,259,409
- Issue date Feb 22, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Takeshi Masaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transmission circuit board and method for manufacturing the same
- Patent number 11,259,405
- Issue date Feb 22, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming laminated circuit board
- Patent number 11,122,693
- Issue date Sep 14, 2021
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered fabrication processing
- Patent number 11,089,676
- Issue date Aug 10, 2021
- The Charles Stark Draper Laboratory, Inc.
- John R. Burns
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multilayer substrate
- Patent number 11,043,626
- Issue date Jun 22, 2021
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel flexible printed circuit fabrication methods and devices
- Patent number 11,026,332
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure incorporated with resin-based conductive ad...
- Patent number 10,980,113
- Issue date Apr 13, 2021
- Advanced Flexible Circuits Co., Ltd.
- Kuo-Fu Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Treated liquid crystal polymer resin sheet and resin multilayer sub...
- Patent number 10,864,698
- Issue date Dec 15, 2020
- Murata Manufacturing Co., Ltd.
- Syota Chino
- B32 - LAYERED PRODUCTS
Information Patent Grant
Stacked antenna module
- Patent number 10,680,313
- Issue date Jun 9, 2020
- Amotech Co., Ltd.
- Joo-Seung Maeng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible circuit board
- Patent number 10,660,210
- Issue date May 19, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer circuit board
- Patent number 10,660,218
- Issue date May 19, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method of manufacturing the same
- Patent number 10,653,015
- Issue date May 12, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency and high-transmission speed FPC with FRCC and prepar...
- Patent number 10,645,799
- Issue date May 5, 2020
- KUNSHAN APLUS TEC.CORPORATION
- Bo-sian Du
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible printed circuit board
- Patent number 10,624,209
- Issue date Apr 14, 2020
- GigaLane Co., Ltd.
- Ik Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making flexible circuit board
- Patent number 10,575,406
- Issue date Feb 25, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE LAMINATE MATERIAL
- Publication number 20240381528
- Publication date Nov 14, 2024
- THE CHEMOURS COMPANY FC, LLC
- RONG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Foil, Laminate, and Flexible Printed Wiring Board
- Publication number 20240215153
- Publication date Jun 27, 2024
- JX Metals Corporation
- Yuji Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240164027
- Publication date May 16, 2024
- Innolux Corporation
- Ying-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING EXTENDED LENGTH FLEXIBLE CIRCUITS
- Publication number 20230422410
- Publication date Dec 28, 2023
- All Flex Solutions, Inc.
- Jason David Hoium
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL APERTURE ENGINE SENSORS AND MESH NETWORK
- Publication number 20230304834
- Publication date Sep 28, 2023
- FRACTAL ANTENNA SYSTEMS, INC.
- Nathan Cohen
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20230180398
- Publication date Jun 8, 2023
- FICT LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20220361343
- Publication date Nov 10, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YAO-CAI LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...
- Publication number 20220354001
- Publication date Nov 3, 2022
- Matrix Electronics Limited
- Kieran HEALY
- B32 - LAYERED PRODUCTS
Information Patent Application
RIGID-FLEXIBLE CIRCUIT BOARD WITH EASY AND SIMPLE MANUFACTURE AND M...
- Publication number 20220225511
- Publication date Jul 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- WEI-XIANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL APERTURE ENGINE SENSORS AND MESH NETWORK
- Publication number 20220187107
- Publication date Jun 16, 2022
- FRACTAL ANTENNA SYSTEMS, INC.
- Nathan Cohen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20220167507
- Publication date May 26, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YAO-CAI LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING TRANSMISSION CIRCUIT BOARD
- Publication number 20220141948
- Publication date May 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE AND MULTILAYER SUBSTRATE
- Publication number 20220141966
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...
- Publication number 20220132678
- Publication date Apr 28, 2022
- Matrix Electronics Limited
- Kieran HEALY
- B32 - LAYERED PRODUCTS
Information Patent Application
BIPHASIC MATERIAL AND STRETCHABLE CIRCUIT BOARD
- Publication number 20210410283
- Publication date Dec 30, 2021
- Yale University
- Rebecca Bottiglio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Vehicle Having the Same
- Publication number 20210360798
- Publication date Nov 18, 2021
- Hyundai Motor Company
- SeungWoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210345479
- Publication date Nov 4, 2021
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reel-to-Reel Lamination Methods and Devices in FPC Fabrication
- Publication number 20210092853
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods of Manufacturing Circuit Boards
- Publication number 20200389980
- Publication date Dec 10, 2020
- OSI Electronics, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE INCORPORATED WITH RESIN-BASED CONDUCTIVE AD...
- Publication number 20200170109
- Publication date May 28, 2020
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING FLEXIBLE CIRCUIT BOARD
- Publication number 20200068715
- Publication date Feb 27, 2020
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20200068716
- Publication date Feb 27, 2020
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTOR SUBSTRATE, WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRI...
- Publication number 20190320527
- Publication date Oct 17, 2019
- Hitachi Chemical Company, Ltd.
- Takeshi MASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190289725
- Publication date Sep 19, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- XIAN-QIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190289724
- Publication date Sep 19, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- XIAN-QIN HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY AND HIGH-TRANSMISSION SPEED FPC WITH FRCC AND PREPAR...
- Publication number 20190215947
- Publication date Jul 11, 2019
- Kunshan Aplus Tec. Corporation
- Bo-sian DU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WINGED COIL STRUCTURE
- Publication number 20190180919
- Publication date Jun 13, 2019
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY FILTER AND COMMUNICATION DEVICE MODULE
- Publication number 20180115037
- Publication date Apr 26, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20180070435
- Publication date Mar 8, 2018
- Murata Manufacturing Co., Ltd.
- Hirofumi SHINAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PLATE ADAPTED TO BE USED IN WINGED COIL STRUCTURE, WINGED...
- Publication number 20180068777
- Publication date Mar 8, 2018
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS

laminating flexible circuit boards using additional insulating adhesive materials between the boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conformal aperture engine sensors and mesh network

Flexible circuit board

Laminated circuit board

Biphasic material and stretchable circuit board

Method for manufacturing multilayer substrate and multilayer substrate

Method for manufacturing transmission circuit board

Conformal aperture engine sensors and mesh network

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

System and method for high-temperature lamination of printed circui...

Flexible circuit board and method for manufacturing same

Flexible printed circuit board

Methods and processes for forming electrical circuitries on three-d...

Conformal aperture engine sensors and mesh network

Conductor substrate, wiring substrate and method for producing wiri...

Transmission circuit board and method for manufacturing the same

Method for forming laminated circuit board

Multi-layered fabrication processing

Multilayer substrate

Reel-to-reel laser sintering methods and devices in FPC fabrication

Reel-to-reel flexible printed circuit fabrication methods and devices

Circuit board structure incorporated with resin-based conductive ad...

Treated liquid crystal polymer resin sheet and resin multilayer sub...

Stacked antenna module

Flexible circuit board

Method of manufacturing multilayer circuit board

Multilayer circuit board and method of manufacturing the same

High-frequency and high-transmission speed FPC with FRCC and prepar...

Flexible printed circuit board

Method of making flexible circuit board

Patents Applicationslast 30 patents

FLEXIBLE LAMINATE MATERIAL

Copper Foil, Laminate, and Flexible Printed Wiring Board

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

SYSTEM AND METHOD FOR FABRICATING EXTENDED LENGTH FLEXIBLE CIRCUITS

CONFORMAL APERTURE ENGINE SENSORS AND MESH NETWORK

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

FLEXIBLE CIRCUIT BOARD

SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...

RIGID-FLEXIBLE CIRCUIT BOARD WITH EASY AND SIMPLE MANUFACTURE AND M...

CONFORMAL APERTURE ENGINE SENSORS AND MESH NETWORK

FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING TRANSMISSION CIRCUIT BOARD

METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE AND MULTILAYER SUBSTRATE

SYSTEM AND METHOD FOR HIGH-TEMPERATURE LAMINATION OF PRINTED CIRCUI...

BIPHASIC MATERIAL AND STRETCHABLE CIRCUIT BOARD

Printed Circuit Board and Vehicle Having the Same

TRANSMISSION CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Reel-to-Reel Lamination Methods and Devices in FPC Fabrication

Systems and Methods of Manufacturing Circuit Boards

CIRCUIT BOARD STRUCTURE INCORPORATED WITH RESIN-BASED CONDUCTIVE AD...

METHOD OF MAKING FLEXIBLE CIRCUIT BOARD

FLEXIBLE CIRCUIT BOARD

CONDUCTOR SUBSTRATE, WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRI...

MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

HIGH-FREQUENCY AND HIGH-TRANSMISSION SPEED FPC WITH FRCC AND PREPAR...

METHOD OF MANUFACTURING WINGED COIL STRUCTURE

HIGH-FREQUENCY FILTER AND COMMUNICATION DEVICE MODULE

MULTILAYER RESIN SUBSTRATE, AND METHOD OF MANUFACTURING MULTILAYER...

FLEXIBLE PLATE ADAPTED TO BE USED IN WINGED COIL STRUCTURE, WINGED...