laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Industry

CPC
H05K3/4632

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4632laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board, circuit board connection structure, and method of ma...
- Patent number 12,191,549
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Kentarou Kawabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,917,756
- Issue date Feb 27, 2024
- Ibiden Co., Ltd.
- Yuji Ikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate and method of manufacturing multilayer r...
- Patent number 11,856,713
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Masanori Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method for manufacturing the same
- Patent number 11,735,346
- Issue date Aug 22, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of mounting structure, and sheet therefor
- Patent number 11,710,645
- Issue date Jul 25, 2023
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step integrated circuit handling process and apparatus
- Patent number 11,659,669
- Issue date May 23, 2023
- Pragmatic Printing Ltd
- Richard Price
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Fibrillated liquid crystal polymer powder, method of producing fibr...
- Patent number 11,646,127
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Hiroyuki Ohata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,558,958
- Issue date Jan 17, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film for interlayer insulating layer with support, multilayer...
- Patent number 11,553,593
- Issue date Jan 10, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takayuki Suzukawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,540,396
- Issue date Dec 27, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Built-in-coil substrate and method for manufacturing the same
- Patent number 11,469,027
- Issue date Oct 11, 2022
- Murata Manufacturing Co., Ltd.
- Shuichi Kezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,445,606
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of mounting structure
- Patent number 11,315,804
- Issue date Apr 26, 2022
- Nagase Chemtex Corporation
- Eiichi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried via in a circuit board
- Patent number 11,310,921
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,240,915
- Issue date Feb 1, 2022
- Lincstech Co., Ltd.
- Masahiro Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing resin multilayer board
- Patent number 11,212,923
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Jun Wakiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed wiring board
- Patent number 11,197,379
- Issue date Dec 7, 2021
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki Kawashita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,089,694
- Issue date Aug 10, 2021
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate
- Patent number 10,893,618
- Issue date Jan 12, 2021
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid component carrier and method for manufacturing the same
- Patent number 10,887,977
- Issue date Jan 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ecological multilayer structure for hosting electronics and related...
- Patent number 10,827,609
- Issue date Nov 3, 2020
- TACTOTEK OY
- Tero Heikkinen
- G02 - OPTICS
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 10,818,448
- Issue date Oct 27, 2020
- Harris Corporation
- Louis Joseph Rendek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, electronic device, and a method for manufactu...
- Patent number 10,813,209
- Issue date Oct 20, 2020
- Murata Manufacturing Co., Ltd.
- Shuichi Kezuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD
- Publication number 20240215160
- Publication date Jun 27, 2024
- KYOCERA CORPORATION
- Chie CHIKARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...
- Publication number 20240064910
- Publication date Feb 22, 2024
- SHENGYI TECHNOLOGY CO., LTD.
- Junqi TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240040708
- Publication date Feb 1, 2024
- FUJIKURA PRINTED CIRCUITS LTD.
- Daisuke Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20230371188
- Publication date Nov 16, 2023
- Denka Company Limited
- Shun UCHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20230238197
- Publication date Jul 27, 2023
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230118261
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, CIRCUIT BOARD CONNECTION STRUCTURE, AND METHOD OF MA...
- Publication number 20230043114
- Publication date Feb 9, 2023
- Murata Manufacturing Co., Ltd.
- Kentarou KAWABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377886
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Component Carrier and Component Carrier Int...
- Publication number 20220377911
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Marco Gavagnin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20220322534
- Publication date Oct 6, 2022
- FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
- Shin Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD, ELECTRONIC DEVICE, AND MULTILAYER BOARD INSPECTIO...
- Publication number 20220285082
- Publication date Sep 8, 2022
- Murata Manufacturing Co., Ltd.
- Kiminori KOUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Sheets, Methods of Manufacture, and Articles Formed Ther...
- Publication number 20220159843
- Publication date May 19, 2022
- SHPP Global Technologies B.V.
- Shijie SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20220141965
- Publication date May 5, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220071015
- Publication date Mar 3, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220015231
- Publication date Jan 13, 2022
- IBIDEN CO., LTD.
- Yuji IKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER R...
- Publication number 20210410296
- Publication date Dec 30, 2021
- Murata Manufacturing Co., Ltd.
- Masanori OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER...
- Publication number 20210235582
- Publication date Jul 29, 2021
- Showa Denko Materials Co., Ltd.
- Takayuki SUZUKAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210212203
- Publication date Jul 8, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED VIA IN A CIRCUIT BOARD
- Publication number 20210127502
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR
- Publication number 20210084775
- Publication date Mar 18, 2021
- Nagase Chemtex Corporation
- Eiichi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED...
- Publication number 20210007222
- Publication date Jan 7, 2021
- TactoTek Oy
- Tero HEIKKINEN
- F21 - LIGHTING
Information Patent Application
METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...
- Publication number 20210005405
- Publication date Jan 7, 2021
- Harris Corporation
- LOUIS JOSEPH RENDEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, CIRCUIT BOARD, AND METHO...
- Publication number 20200375030
- Publication date Nov 26, 2020
- Kuraray Co., Ltd
- Takahiro NAKASHIMA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200367369
- Publication date Nov 19, 2020
- IBIDEN CO., LTD.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT HANDLING PROCESS AND APPARATUS
- Publication number 20200359508
- Publication date Nov 12, 2020
- Pragmatic Printing Ltd.
- Richard PRICE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20200107439
- Publication date Apr 2, 2020
- IBIDEN CO., LTD.
- Yuji IKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...
- Publication number 20200107437
- Publication date Apr 2, 2020
- Hitachi Chemical Company, Ltd.
- Norihiko SAKAMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20200015363
- Publication date Jan 9, 2020
- Mitsubishi Gas Chemical Company, Inc.
- Kazuaki KAWASHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board, circuit board connection structure, and method of ma...

Multilayer substrate

Multilayer board and manufacturing method thereof

Printed wiring board and method for manufacturing printed wiring board

Multilayer resin substrate and method of manufacturing multilayer r...

Multilayer substrate and method for manufacturing the same

Manufacturing method of mounting structure, and sheet therefor

Method for making a three-dimensional liquid crystal polymer multil...

Multi-step integrated circuit handling process and apparatus

Fibrillated liquid crystal polymer powder, method of producing fibr...

Laminated body and method for manufacturing the same

Resin film for interlayer insulating layer with support, multilayer...

Circuit board structure and manufacturing method thereof

Built-in-coil substrate and method for manufacturing the same

Laminated body and method for manufacturing the same

Manufacturing method of mounting structure

Buried via in a circuit board

Methods and processes for forming electrical circuitries on three-d...

Method for manufacturing multilayer wiring board

Method for producing resin multilayer board

Method for producing printed wiring board

Printed wiring board and method for manufacturing printed wiring board

High-speed interconnects for printed circuit boards

Circuit board using non-catalytic laminate with catalytic adhesive...

Method for manufacturing multilayer substrate

Hybrid component carrier and method for manufacturing the same

Ecological multilayer structure for hosting electronics and related...

Method for making a three-dimensional liquid crystal polymer multil...

Multilayer substrate, electronic device, and a method for manufactu...

Catalytic circuit board with traces and vias

Patents Applicationslast 30 patents

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD

LAMINATE COATED WITH ASYMMETRIC METAL FOILS, AND PRINTED CIRCUIT BO...

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

MULTILAYER SUBSTRATE

CIRCUIT BOARD, CIRCUIT BOARD CONNECTION STRUCTURE, AND METHOD OF MA...

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

Method of Manufacturing Component Carrier and Component Carrier Int...

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

MULTILAYER BOARD, ELECTRONIC DEVICE, AND MULTILAYER BOARD INSPECTIO...

Multilayer Sheets, Methods of Manufacture, and Articles Formed Ther...

MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER SUBSTRATE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

MULTILAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER R...

RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER...

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

BURIED VIA IN A CIRCUIT BOARD

MANUFACTURING METHOD OF MOUNTING STRUCTURE, AND SHEET THEREFOR

ECOLOGICAL MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED...

METHOD FOR MAKING A THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTIL...

Circuit Board using non-catalytic laminate with catalytic adhesive...

THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, CIRCUIT BOARD, AND METHO...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

INTEGRATED CIRCUIT HANDLING PROCESS AND APPARATUS

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

CORELESS SUBSTRATE PREPREG, CORELESS SUBSTRATE, CORELESS SUBSTRATE...

METHOD FOR PRODUCING PRINTED WIRING BOARD