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H01L2924/0545
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/0545
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Patents Grants
last 30 patents
Information
Patent Grant
Hybrid bonding structures and semiconductor devices including the same
Patent number
11,804,462
Issue date
Oct 31, 2023
Samsung Electronics Co., Ltd.
Kunmo Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package structure and wafer level packaging method
Patent number
10,784,229
Issue date
Sep 22, 2020
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Hailong Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pnictide buffer structures and devices for GaN base applications
Patent number
10,615,141
Issue date
Apr 7, 2020
IQE plc
Andrew Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rare earth pnictides for strain management
Patent number
10,332,857
Issue date
Jun 25, 2019
IQE plc
Andrew Clark
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...
Publication number
20230260956
Publication date
Aug 17, 2023
SK HYNIX INC.
Mir IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING STRUCTURES AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
Publication number
20220077100
Publication date
Mar 10, 2022
Samsung Electronics Co., Ltd.
Kunmo CHU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE AND WAFER LEVEL PACKAGING METHOD
Publication number
20200075539
Publication date
Mar 5, 2020
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Hailong LUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RARE EARTH INTERLAYS FOR MECHANICALLY LAYERING DISSIMILAR SEMICONDU...
Publication number
20180012858
Publication date
Jan 11, 2018
IQE, plc
Andrew Clark
H01 - BASIC ELECTRIC ELEMENTS