Lanthanum [La]

Industry

CPC
H01L2924/01057

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01057Lanthanum [La]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-package wireless communication device
- Patent number 11,942,676
- Issue date Mar 26, 2024
- Tahoe Research, LTD.
- Mohamed A. Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 11,848,258
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 11,631,790
- Issue date Apr 18, 2023
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-package wireless communication device
- Patent number 11,552,383
- Issue date Jan 10, 2023
- Tahoe Research, LTD.
- Mohamed A. Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,495,570
- Issue date Nov 8, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Systems and methods for optimizing looping parameters and looping t...
- Patent number 11,276,666
- Issue date Mar 15, 2022
- Kulicke and Soffa Industries, Inc.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 11,239,191
- Issue date Feb 1, 2022
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel lanthanide alloys for MEMS packaging applications
- Patent number 11,091,366
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic module
- Patent number 11,071,207
- Issue date Jul 20, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,971,656
- Issue date Apr 6, 2021
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,950,571
- Issue date Mar 16, 2021
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 10,777,479
- Issue date Sep 15, 2020
- TOSHIBA MEMORY CORPORATION
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,741,517
- Issue date Aug 11, 2020
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-package wireless communication device
- Patent number 10,727,567
- Issue date Jul 28, 2020
- Intel Corporation
- Mohamed A. Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayers of nickel alloys as diffusion barrier layers
- Patent number 10,692,830
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molding, surface mounted light emitting apparatus and methods...
- Patent number 10,686,102
- Issue date Jun 16, 2020
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mainboard assembly including a package overlying a die directly att...
- Patent number 10,555,417
- Issue date Feb 4, 2020
- Intel Corporation
- Damion Searls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel lanthanide alloys for mems packaging applications
- Patent number 10,544,034
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Nazila Dadvand
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Recessed and embedded die coreless package
- Patent number 10,541,232
- Issue date Jan 21, 2020
- Intel Corporation
- John Guzek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20240153853
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING A SEMICONDUCTOR TRANSISTOR AND METHODS FOR FO...
- Publication number 20240014289
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Yoshikazu Moriwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BONDING WIRE
- Publication number 20230146315
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME
- Publication number 20230006095
- Publication date Jan 5, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hoo Keun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
- Publication number 20220208665
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20220173062
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210321520
- Publication date Oct 14, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20200321299
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200165124
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SINGLE-PACKAGE WIRELESS COMMUNICATION DEVICE
- Publication number 20200112082
- Publication date Apr 9, 2020
- Intel Corporation
- Mohamed A. Megahed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS
- Publication number 20200024130
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20190326246
- Publication date Oct 24, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...
- Publication number 20190295983
- Publication date Sep 26, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Ivy Wei Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DEVICE AND LEAD FRAME USED FOR TH...
- Publication number 20190139849
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Yoshiaki GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protrusion Bump Pads for Bond-on-Trace Processing
- Publication number 20190122976
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
- Publication number 20190109109
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...
- Publication number 20180175253
- Publication date Jun 21, 2018
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Lanthanum [La]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with nickel-silver pre-plated leadframe

Single-package wireless communication device

Semiconductor components having conductive vias with aligned back s...

Semiconductor package with nickel-silver pre-plated leadframe

Method for manufacturing an electronic module and electronic module

Method for manufacturing a semiconductor device having a semiconduc...

Resin molding, surface mounted light emitting apparatus and methods...

Single-package wireless communication device

Systems and methods for optimizing looping parameters and looping t...

Bonding wire for semiconductor devices

Systems and methods for optimizing looping parameters and looping t...

Semiconductor device and a method of manufacturing the same

Modulated inductance module

Designs and methods for conductive bumps

Nickel lanthanide alloys for MEMS packaging applications

Electronic module

Resin molding, surface mounted light emitting apparatus and methods...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Protrusion bump pads for bond-on-trace processing

Semiconductor memory device

Bonding wire for semiconductor device

Semiconductor device and a method of manufacturing the same

Single-package wireless communication device

Multilayers of nickel alloys as diffusion barrier layers

Resin molding, surface mounted light emitting apparatus and methods...

Bonding wire for semiconductor device

Mainboard assembly including a package overlying a die directly att...

Nickel lanthanide alloys for mems packaging applications

Recessed and embedded die coreless package

Patents Applicationslast 30 patents

REVERSABLE ATTACHMENT SYSTEM

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

APPARATUSES INCLUDING A SEMICONDUCTOR TRANSISTOR AND METHODS FOR FO...

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

AL BONDING WIRE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

LIGHT-EMITTING DIODE AND DISPLAY DEVICE COMPRISING SAME

SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

ELECTRONIC MODULE

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

SINGLE-PACKAGE WIRELESS COMMUNICATION DEVICE

NICKEL LANTHANIDE ALLOYS FOR MEMS PACKAGING APPLICATIONS

ALLOY DIFFUSION BARRIER LAYER

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR OPTIMIZING LOOPING PARAMETERS AND LOOPING T...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SEMICONDUCTOR PACKAGE INCLUDING A DEVICE AND LEAD FRAME USED FOR TH...

Protrusion Bump Pads for Bond-on-Trace Processing

MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS

ALLOY DIFFUSION BARRIER LAYER

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

RESIN MOLDING, SURFACE MOUNTED LIGHT EMITTING APPARATUS AND METHODS...