larger or equal to 1500 microns less than 2000 microns

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CPC
H01L2924/20651

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/20651larger or equal to 1500 microns less than 2000 microns

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Patents Grantslast 30 patents

Information Patent Grant
3D bond and assembly process for severely bowed interposer die
- Patent number 9,224,712
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Marcus E. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
3D BOND AND ASSEMBLY PROCESS FOR SEVERELY BOWED INTERPOSER DIE
- Publication number 20150228614
- Publication date Aug 13, 2015
- International Business Machines Corporation
- MARCUS E INTERRANTE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR