larger or equal to 2000 microns less than 2500 microns

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CPC
H01L2924/20652

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/20652larger or equal to 2000 microns less than 2500 microns

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
Wire Bonding Method and Apparatus
- Publication number 20250096195
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Stefan Tophinke
- H01 - BASIC ELECTRIC ELEMENTS