larger or equal to 7000 microns less than 8000 microns

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H01L2924/20658

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/20658larger or equal to 7000 microns less than 8000 microns

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 9,431,360
- Issue date Aug 30, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge bond foot jumper connections
- Patent number 9,236,363
- Issue date Jan 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
- Publication number 20230335530
- Publication date Oct 19, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150348927
- Publication date Dec 3, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- HSUAN-TING KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wedge Bond Foot Jumper Connections
- Publication number 20150262961
- Publication date Sep 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jeffrey K. Jones
- H01 - BASIC ELECTRIC ELEMENTS