larger or equal to 80 microns less than 90 microns

Industry

CPC
H01L2924/20758

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/20758larger or equal to 80 microns less than 90 microns

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,692,917
- Issue date Jun 23, 2020
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor logic device and system and method of embedded packag...
- Patent number 10,396,053
- Issue date Aug 27, 2019
- General Electric Company
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fan-out in ball grid array (BGA) package
- Patent number 10,249,596
- Issue date Apr 2, 2019
- Juniper Networks, Inc.
- Valery Kugel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Post-passivation interconnect structure and method of forming same
- Patent number 9,859,242
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having low on resistance
- Patent number 9,824,996
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball, manufacturing method thereof, and semiconductor device
- Patent number 9,780,056
- Issue date Oct 3, 2017
- ChipMOS Technologies Inc.
- Tung-Bao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and method for production
- Patent number 9,368,447
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating equal height metal pillars of different diam...
- Patent number 9,324,557
- Issue date Apr 26, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor device
- Patent number 9,165,901
- Issue date Oct 20, 2015
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,129,946
- Issue date Sep 8, 2015
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,112,059
- Issue date Aug 18, 2015
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) for semiconductor components having...
- Patent number 9,013,044
- Issue date Apr 21, 2015
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module including a conductor with a slot therein and...
- Patent number 8,854,152
- Issue date Oct 7, 2014
- Kyocera Corporation
- Hiroshi Uchimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,796,838
- Issue date Aug 5, 2014
- Renesas Electronics Corporation
- Yukihiro Satou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Assembly of a wire element with a microelectronic chip with a groov...
- Patent number 8,723,312
- Issue date May 13, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,633,102
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and manufacturing thereof
- Patent number 8,618,644
- Issue date Dec 31, 2013
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device and method for production
- Patent number 8,552,571
- Issue date Oct 8, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor component having through wire interconnect (T...
- Patent number 8,513,797
- Issue date Aug 20, 2013
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making solder-top enhanced semiconductor device of low p...
- Patent number 8,497,160
- Issue date Jul 30, 2013
- Alpha & Omega Semiconductor, Inc.
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230387066
- Publication date Nov 30, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230245995
- Publication date Aug 3, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
- Publication number 20230013769
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Ryo OISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...
- Publication number 20190157233
- Publication date May 23, 2019
- GENERAL ELECTRIC COMPANY
- Raymond Albert Fillion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190019834
- Publication date Jan 17, 2019
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER
- Publication number 20170154863
- Publication date Jun 1, 2017
- Heraeus Deutschland GmbH & Co. KG
- Murali SARANGAPANI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Post-Passivation Interconnect Structure and Method of Forming Same
- Publication number 20170141060
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20160284661
- Publication date Sep 29, 2016
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Equal Height Metal Pillars of Different Diam...
- Publication number 20150262950
- Publication date Sep 17, 2015
- LSI Corporation
- Steven D. Cate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332866
- Publication date Nov 13, 2014
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20130328197
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Wire Interconnect (TWI) For Semiconductor Components Having...
- Publication number 20130299983
- Publication date Nov 14, 2013
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Semiconductor Device
- Publication number 20130020715
- Publication date Jan 24, 2013
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120319109
- Publication date Dec 20, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making Solder-top Enhanced Semiconductor Device of Low P...
- Publication number 20120289001
- Publication date Nov 15, 2012
- Francois Hebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20120276693
- Publication date Nov 1, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...
- Publication number 20120228781
- Publication date Sep 13, 2012
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20120104613
- Publication date May 3, 2012
- NIPPON MICROMETAL CORPORATION
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120074552
- Publication date Mar 29, 2012
- ON SEMICONDUCTOR TRADING, LTD.
- Shigeki Mashimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20120025384
- Publication date Feb 2, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Frequency Module
- Publication number 20110298568
- Publication date Dec 8, 2011
- KYOCERA CORPORATION
- Hiroshi Uchimura
- H01 - BASIC ELECTRIC ELEMENTS

larger or equal to 80 microns less than 90 microns

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple plated via arrays of different wire heights on a same subs...

Bonding wire for semiconductor devices

Sensor package structure

Multiple plated via arrays of different wire heights on same substrate

Semiconductor logic device and system and method of embedded packag...

Multiple bond via arrays of different wire heights on a same substrate

Fan-out in ball grid array (BGA) package

Post-passivation interconnect structure and method of forming same

Semiconductor device having low on resistance

Solder ball, manufacturing method thereof, and semiconductor device

Electronic device and method for production

Module comprising a semiconductor chip

Electronic device and method for production

Method for fabricating equal height metal pillars of different diam...

Core-jacket bonding wire

Semiconductor device

Semiconductor device

Bonding wire for semiconductor device

Semiconductor module system having encapsulated through wire interc...

Through wire interconnect (TWI) for semiconductor components having...

High-frequency module including a conductor with a slot therein and...

Semiconductor device

Method for fabricating a through wire interconnect (TWI) on a semic...

Assembly of a wire element with a microelectronic chip with a groov...

Module comprising a semiconductor chip

Electronic device and manufacturing thereof

Through wire interconnect (TWI) having bonded connection and encaps...

Electronic device and method for production

Stacked semiconductor component having through wire interconnect (T...

Method for making solder-top enhanced semiconductor device of low p...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR LOGIC DEVICE AND SYSTEM AND METHOD OF EMBEDDED PACKAG...

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

SENSOR PACKAGE STRUCTURE

Multiple bond via arrays of different wire heights on a same substrate

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

COPPER BONDING WIRE WITH ANGSTROM (Å) THICK SURFACE OXIDE LAYER

Post-Passivation Interconnect Structure and Method of Forming Same

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

Method for Fabricating Equal Height Metal Pillars of Different Diam...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

Module Comprising a Semiconductor Chip

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

Through Wire Interconnect (TWI) For Semiconductor Components Having...

CORE-JACKET BONDING WIRE

Semiconductor Device

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

Method for Making Solder-top Enhanced Semiconductor Device of Low P...

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

Module Comprising a Semiconductor Chip

STACKED SEMICONDUCTOR COMPONENT HAVING THROUGH WIRE INTERCONNECT (T...

BONDING WIRE FOR SEMICONDUCTOR DEVICE

CIRCUIT DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Module System Having Stacked Components With Encapsul...

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

High-Frequency Module