Lateral distribution of bump connectors prior to mounting

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CPC
H01L2021/60262

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60262Lateral distribution of bump connectors prior to mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,957,719
- Issue date Mar 23, 2021
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,304,867
- Issue date May 28, 2019
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,929,185
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akihiko Yoshioka
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number RE45932
- Issue date Mar 15, 2016
- PS4 Luxco S.A.R.L.
- Seiya Fujii
- 001 -
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,178,971
- Issue date May 15, 2012
- Elpida Memory, Inc.
- Seiya Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE
- Publication number 20240363994
- Publication date Oct 31, 2024
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- SHUN-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180175067
- Publication date Jun 21, 2018
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
MOLDED INTERCONNECTING SUBSTRATE AND THE METHOD FOR MANUFACTURING T...
- Publication number 20170117263
- Publication date Apr 27, 2017
- Powertech Technology Inc.
- Yun-Hsin YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20170084633
- Publication date Mar 23, 2017
- RENESAS ELECTRONICS CORPORATION
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
Method and Apparatus for Cooling Semiconductor Device Hot Blocks an...
- Publication number 20160148890
- Publication date May 26, 2016
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090224403
- Publication date Sep 10, 2009
- ELPIDA MEMORY, INC.
- Seiya Fujii
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for cooling semiconductor device hot blocks an...
- Publication number 20070267740
- Publication date Nov 22, 2007
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS

Lateral distribution of bump connectors prior to mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

ANTENNA DEVICE AND METHOD OF MANUFACTURING ANTENNA DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

MOLDED INTERCONNECTING SUBSTRATE AND THE METHOD FOR MANUFACTURING T...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method and Apparatus for Cooling Semiconductor Device Hot Blocks an...

Semiconductor device and method of manufacturing the same

Method and apparatus for cooling semiconductor device hot blocks an...