Lay-out of balanced signal pairs

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CPC
H05K1/0245

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0245Lay-out of balanced signal pairs

Industries

Patents Grantslast 30 patents

Information Patent Grant
Contact arrangement and electronic assembly
- Patent number 12,191,242
- Issue date Jan 7, 2025
- Via Technologies, Inc.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive compensation for vertical interconnect accesses
- Patent number 12,185,462
- Issue date Dec 31, 2024
- Achronix Semiconductor Corporation
- Hansel Desmond Dsilva
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency high-voltage waveguide device
- Patent number 12,176,595
- Issue date Dec 24, 2024
- TRUMPF Huettinger GmbH + Co. KG
- Christian Wangler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Differential circuit board and semiconductor light emitting device
- Patent number 12,082,336
- Issue date Sep 3, 2024
- Lumentum Japan, Inc.
- Koichiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 12,063,735
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband antenna, in particular for a microwave imaging system
- Patent number 12,041,712
- Issue date Jul 16, 2024
- Alessandro Manneschi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstrip delay matching using printed dielectric material
- Patent number 11,991,819
- Issue date May 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor module
- Patent number 11,956,890
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Yunho Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Wideband routing techniques for PCB layout
- Patent number 11,937,373
- Issue date Mar 19, 2024
- Hewlett Packard Enterprise Development LP
- Melvin K. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission apparatus and signal transmission method
- Patent number 11,930,588
- Issue date Mar 12, 2024
- Sony Group Corporation
- Sota Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common-mode filtering for converting differential signaling to sing...
- Patent number 11,903,123
- Issue date Feb 13, 2024
- MARVELL ASIA PTE. LTD.
- Shaowu Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Composite wiring board, package, and electronic device
- Patent number 11,849,538
- Issue date Dec 19, 2023
- NGK Electronics Devices, Inc.
- Noboru Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board for multiple signal transmission
- Patent number 11,844,173
- Issue date Dec 12, 2023
- Gigalane Co., Ltd.
- Byung-hoon Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shared vias for differential pair trace routing
- Patent number 11,832,383
- Issue date Nov 28, 2023
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for low loss interconnection system
- Patent number 11,824,311
- Issue date Nov 21, 2023
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system with split trace for high speed routing
- Patent number 11,805,594
- Issue date Oct 31, 2023
- Dell Products L.P.
- Sandor Farkas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,800,636
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loss and low cross talk transmission lines with stacked dielect...
- Patent number 11,791,528
- Issue date Oct 17, 2023
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interlaced crosstalk controlled traces, vias, and capacitors
- Patent number 11,785,706
- Issue date Oct 10, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inhomogeneous dielectric medium high-speed stripline trace system
- Patent number 11,758,647
- Issue date Sep 12, 2023
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad-trace structures for high-speed signaling
- Patent number 11,751,323
- Issue date Sep 5, 2023
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and printed board assembly
- Patent number 11,744,008
- Issue date Aug 29, 2023
- Sumitomo Electric Industries, Ltd.
- Taichi Misawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 11,737,205
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CABLE DEVICE AND METHOD OF PRODUCING THE SAME
- Publication number 20250024588
- Publication date Jan 16, 2025
- Yamaichi Electronics Co., Ltd.
- Takahiro SHIMOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board and Signal Transmission System
- Publication number 20240397612
- Publication date Nov 28, 2024
- ZTE Corporation
- Xindan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE
- Publication number 20240324096
- Publication date Sep 26, 2024
- BLACK SESAME TECHNOLOGIES (CHONGQING) CO., LTD.
- Hai Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
- Publication number 20240324094
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Okgyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC...
- Publication number 20240292530
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20240260180
- Publication date Aug 1, 2024
- KIOXIA Corporation
- Shuichi TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240260172
- Publication date Aug 1, 2024
- Honor Device Co., Ltd.
- Puwei BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT AND SIGNAL TRANSMISSION METHOD
- Publication number 20240172357
- Publication date May 23, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Li Chung CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transmission line for radio frequency signals
- Publication number 20240147604
- Publication date May 2, 2024
- ALCAN Systems GmbH
- Alexander GÄBLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
- Publication number 20240147605
- Publication date May 2, 2024
- HIROSE ELECTRIC CO., LTD.
- Xingyu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
- Publication number 20240098886
- Publication date Mar 21, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL
- Publication number 20240098883
- Publication date Mar 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GROUND-PENETRATING RADAR SCANNER WITH BALANCED UWB DIRECTIONAL COUPLER
- Publication number 20240061072
- Publication date Feb 22, 2024
- Leica Geosystems AG
- Wilfried KANEIDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC EQUIPMENT
- Publication number 20240023231
- Publication date Jan 18, 2024
- Canon Kabushiki Kaisha
- Shoji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Platform Supports the Shortest Direct Electrical Connections betwee...
- Publication number 20230413423
- Publication date Dec 21, 2023
- Shuang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layout of signal traces
- Publication number 20230403786
- Publication date Dec 14, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- YUNG-CHUNG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM
- Publication number 20230389174
- Publication date Nov 30, 2023
- Dell Products L.P.
- Arun Reddy Chada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS
- Publication number 20230371169
- Publication date Nov 16, 2023
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS
- Publication number 20230363083
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...
- Publication number 20230354503
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun-Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES
- Publication number 20230345626
- Publication date Oct 26, 2023
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIFFERENTIAL PAIR INNER-SIDE IMPEDANCE COMPENSATION
- Publication number 20230345625
- Publication date Oct 26, 2023
- Dell Products L.P.
- Lingyu Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EDGE CONNECTOR, CIRCUIT BOARD, AND CONNECTOR COMPONENT
- Publication number 20230299515
- Publication date Sep 21, 2023
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230284375
- Publication date Sep 7, 2023
- ZTE Corporation
- Changgang YIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring Board and Signal Connecting Structure
- Publication number 20230240001
- Publication date Jul 27, 2023
- Nippon Telegraph and Telephone Corporation
- Hitoshi Wakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT ARRANGMENT AND ELECTRONIC ASSEMBLY
- Publication number 20230163058
- Publication date May 25, 2023
- VIA TECHNOLOGIES, INC.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier for Microwave Applications With Stack Pieces Inte...
- Publication number 20230134610
- Publication date May 4, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian SATTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR MODULE
- Publication number 20230066722
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yunho LEE
- G11 - INFORMATION STORAGE
Information Patent Application
Connecting Electrical Circuitry in a Quantum Computing System
- Publication number 20230067066
- Publication date Mar 2, 2023
- Rigetti & Co, LLC
- Tristan Ossama El Bouayadi
- G06 - COMPUTING CALCULATING COUNTING

Lay-out of balanced signal pairs

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contact arrangement and electronic assembly

Capacitive compensation for vertical interconnect accesses

Component carrier and method of manufacturing a component carrier

High-frequency high-voltage waveguide device

Resetting different pair skew of printed circuit board traces

Multilayer substrate

Differential circuit board and semiconductor light emitting device

Electronic substrate having differential coaxial vias

Wideband antenna, in particular for a microwave imaging system

Microstrip delay matching using printed dielectric material

Printed circuit board and display device including the same

Circuit board and semiconductor module

Wideband routing techniques for PCB layout

Signal transmission apparatus and signal transmission method

Edge connector, circuit board, and connector component

Common-mode filtering for converting differential signaling to sing...

Composite wiring board, package, and electronic device

Flexible circuit board for multiple signal transmission

Shared vias for differential pair trace routing

Connector for low loss interconnection system

Backplane footprint for high speed, high density electrical connectors

Information handling system with split trace for high speed routing

Electronic substrate having differential coaxial vias

Low loss and low cross talk transmission lines with stacked dielect...

Interlaced crosstalk controlled traces, vias, and capacitors

Systems and methods for break out of interconnections for high-dens...

Inhomogeneous dielectric medium high-speed stripline trace system

Quad-trace structures for high-speed signaling

Printed board and printed board assembly

Interconnect structure having conductor extending along dielectric...

Patents Applicationslast 30 patents

CABLE DEVICE AND METHOD OF PRODUCING THE SAME

Printed Circuit Board and Signal Transmission System

POWER SUPPLY CIRCUIT, PCB CIRCUIT BOARD AND POWER SUPPLY DEVICE

PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME

WIRING BOARD, ELECTRONIC COMPONENT STORAGE PACKAGE, AND ELECTRONIC...

WIRING BOARD AND ELECTRONIC DEVICE

CIRCUIT BOARD AND ELECTRONIC DEVICE

INTEGRATED CIRCUIT AND SIGNAL TRANSMISSION METHOD

Transmission line for radio frequency signals

INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR

STRIP LINE DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

MICROSTRIP DELAY MATCHING USING PRINTED DIELECTRIC MATERIAL

GROUND-PENETRATING RADAR SCANNER WITH BALANCED UWB DIRECTIONAL COUPLER

WIRING BOARD AND ELECTRONIC EQUIPMENT

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

Platform Supports the Shortest Direct Electrical Connections betwee...

Layout of signal traces

INHOMOGENEOUS DIELECTRIC MEDIUM HIGH-SPEED STRIPLINE TRACE SYSTEM

INTERLACED CROSSTALK CONTROLLED TRACES, VIAS, AND CAPACITORS

ELECTRONIC SUBSTRATE HAVING DIFFERENTIAL COAXIAL VIAS

INTERCONNECT STRUCTURE HAVING CONDUCTOR EXTENDING ALONG DIELECTRIC...

RESETTING DIFFERENT PAIR SKEW OF PRINTED CIRCUIT BOARD TRACES

DIFFERENTIAL PAIR INNER-SIDE IMPEDANCE COMPENSATION

EDGE CONNECTOR, CIRCUIT BOARD, AND CONNECTOR COMPONENT

PRINTED CIRCUIT BOARD

Wiring Board and Signal Connecting Structure

CONTACT ARRANGMENT AND ELECTRONIC ASSEMBLY

Component Carrier for Microwave Applications With Stack Pieces Inte...

CIRCUIT BOARD AND SEMICONDUCTOR MODULE

Connecting Electrical Circuitry in a Quantum Computing System