Layer and strap connectors

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CPC
H01L2224/73213

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73213Layer and strap connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,564
- Issue date Jan 17, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of heat sinks for a semiconductor package
- Patent number 11,515,237
- Issue date Nov 29, 2022
- Agency for Science, Technology and Research
- Gongyue Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,309,273
- Issue date Apr 19, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for die and clip attachment
- Patent number 11,289,447
- Issue date Mar 29, 2022
- Alpha Assembly Solutions, Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated spring mounted chip termination
- Patent number 10,818,992
- Issue date Oct 27, 2020
- Smiths Interconnect Americas, Inc.
- Christopher Raymond Hawn
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated circuit package with conductive clips
- Patent number 10,546,805
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Oscar Paulo Razon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit connection arrangement for minimizing crosstalk
- Patent number 10,446,687
- Issue date Oct 15, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and integrated circuit connection arrangement
- Patent number 10,424,666
- Issue date Sep 24, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 10,249,759
- Issue date Apr 2, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit connection arrangement for minimizing crosstalk
- Patent number 10,192,989
- Issue date Jan 29, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 10,181,445
- Issue date Jan 15, 2019
- Mitsubishi Electric Corporation
- Akihisa Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, semiconductor system and method of formi...
- Patent number 10,115,646
- Issue date Oct 30, 2018
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,056,309
- Issue date Aug 21, 2018
- Renesas Electronics Corporation
- Koji Bando
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sintered conductive matrix material on wire bond
- Patent number 9,905,502
- Issue date Feb 27, 2018
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having compliant and crack-arresting interconn...
- Patent number 9,812,384
- Issue date Nov 7, 2017
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,698,091
- Issue date Jul 4, 2017
- Mitsubishi Electric Corporation
- Shinsuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array based fabrication of power semiconductor package with integra...
- Patent number 9,620,475
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having compliant and crack-arresting interconn...
- Patent number 9,496,208
- Issue date Nov 15, 2016
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,474,191
- Issue date Oct 18, 2016
- Hitachi Automotive Systems, Ltd.
- Masato Higuma
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,443,822
- Issue date Sep 13, 2016
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 9,379,046
- Issue date Jun 28, 2016
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip chip assembly and process with sintering material on metal bumps
- Patent number 9,117,811
- Issue date Aug 25, 2015
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method of manufacturing the same
- Patent number 9,059,334
- Issue date Jun 16, 2015
- Mitsubishi Electric Corporation
- Osamu Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package comprising a laminate and method of making...
- Patent number 8,692,361
- Issue date Apr 8, 2014
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 8,653,643
- Issue date Feb 18, 2014
- Toyota Jidosha Kabushiki Kaisha
- Norimune Orimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module comprising a semiconductor chip
- Patent number 8,633,102
- Issue date Jan 21, 2014
- Infineon Technologies AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230420321
- Publication date Dec 28, 2023
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
- Publication number 20230411336
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230395451
- Publication date Dec 7, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230369195
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Hyeon Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
- Publication number 20220406679
- Publication date Dec 22, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Ruoyang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...
- Publication number 20220399300
- Publication date Dec 15, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...
- Publication number 20220302073
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...
- Publication number 20220302072
- Publication date Sep 22, 2022
- DANFOSS SILICON POWER GMBH
- André Bastos Abibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20210242167
- Publication date Aug 5, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210217721
- Publication date Jul 15, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20210175198
- Publication date Jun 10, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS
- Publication number 20190206773
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Oscar Paulo RAZON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CONNECTION ARRANGEMENT FOR MINIMIZING CROSSTALK
- Publication number 20190157446
- Publication date May 23, 2019
- Silanna Asia Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180331002
- Publication date Nov 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Koji BANDO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method for Die and Clip Attachment
- Publication number 20180166415
- Publication date Jun 14, 2018
- Alpha Assembly Solutions Inc.
- Oscar Khaselev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20170352629
- Publication date Dec 7, 2017
- MITSUBISHI ELECTRIC CORPORATION
- Akihisa FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Compliant and Crack-Arresting Interconn...
- Publication number 20170250126
- Publication date Aug 31, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE APPARATUS
- Publication number 20160099198
- Publication date Apr 7, 2016
- UBIQ Semiconductor Corp.
- Chau-Chun Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20150294926
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20140110829
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electric Device Package Comprising a Laminate and Method of Making...
- Publication number 20140027892
- Publication date Jan 30, 2014
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20130214404
- Publication date Aug 22, 2013
- Toyota Jidosha Kabushiki Kaisha
- Norimune ORIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130181228
- Publication date Jul 18, 2013
- Mitsubishi Electric Corporation
- Osamu USUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS
- Publication number 20120313239
- Publication date Dec 13, 2012
- Tessera, Inc.
- Wael Zohni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Comprising a Semiconductor Chip
- Publication number 20120276693
- Publication date Nov 1, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE
- Publication number 20120199960
- Publication date Aug 9, 2012
- TEXAS INSTRUMENTS INCORPORATED
- GLENN ENRICK CALDERON COSUE
- H01 - BASIC ELECTRIC ELEMENTS

Layer and strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module with a first substrate, a second substrate and...

Semiconductor packages using package in package systems and related...

Method for processing a semiconductor wafer, semiconductor wafer, c...

Semiconductor device

Plurality of heat sinks for a semiconductor package

Electronic module

Method for die and clip attachment

Integrated spring mounted chip termination

Assembly and semiconductor device

Integrated circuit package with conductive clips

Integrated circuit connection arrangement for minimizing crosstalk

Leadframe and integrated circuit connection arrangement

Connection arrangements for integrated lateral diffusion field effe...

Integrated circuit connection arrangement for minimizing crosstalk

Power module

Semiconductor arrangement, semiconductor system and method of formi...

Electronic device

Sintered conductive matrix material on wire bond

Semiconductor device having compliant and crack-arresting interconn...

Power semiconductor device

Array based fabrication of power semiconductor package with integra...

Semiconductor device having compliant and crack-arresting interconn...

Power semiconductor module

Flip chip assembly and process with sintering material on metal bumps

Module comprising a semiconductor chip

Flip chip assembly and process with sintering material on metal bumps

Power semiconductor module and method of manufacturing the same

Electric device package comprising a laminate and method of making...

Semiconductor module

Module comprising a semiconductor chip

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

POWER MODULE AND METHOD FOR MANUFACTURING SAME

Method for Producing Power Semiconductor Module and Power Semicondu...

CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR MODULE WITH A FIRST SUBSTRATE, A SECOND SUBSTRATE AND...

SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SH...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

SEMICONDUCTOR DEVICE

ELECTRONIC MODULE

INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS

INTEGRATED CIRCUIT CONNECTION ARRANGEMENT FOR MINIMIZING CROSSTALK

ASSEMBLY AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

Method for Die and Clip Attachment

POWER MODULE

Semiconductor Device Having Compliant and Crack-Arresting Interconn...

SEMICONDUCTOR PACKAGE APPARATUS

Module Comprising a Semiconductor Chip

Module Comprising a Semiconductor Chip

Electric Device Package Comprising a Laminate and Method of Making...

SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP ASSEMBLY AND PROCESS WITH SINTERING MATERIAL ON METAL BUMPS

Module Comprising a Semiconductor Chip

WIRE BONDING FOR INTERCONNECTION BETWEEN INTERPOSER AND FLIP CHIP DIE