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H01L21/76846

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76846Layer combinations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 12,148,659
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, memory device, and elect...
- Patent number 12,125,849
- Issue date Oct 22, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug
- Patent number 12,125,748
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective blocking of metal surfaces using bifunctional self-assemb...
- Patent number 12,094,766
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Michael L. McSwiney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a semiconductor...
- Patent number 12,094,804
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beol tip-to-tip shorting and time dependent dielectric breakdown
- Patent number 12,087,624
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed gate strcutre with protection layer
- Patent number 12,080,773
- Issue date Sep 3, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection structure and method of...
- Patent number 12,080,591
- Issue date Sep 3, 2024
- Renesas Electronics Corporation
- Kazuyuki Omori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier-less structures
- Patent number 12,080,593
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 12,080,594
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with multi-metal gate via and method
- Patent number 12,074,061
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Tsung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure integrating air gaps and methods of...
- Patent number 12,068,372
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
- Patent number 12,062,614
- Issue date Aug 13, 2024
- International Business Machines Corporation
- John Bruley
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 12,057,492
- Issue date Aug 6, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two 2D capping layers on interconnect conductive structure to incre...
- Patent number 12,051,645
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including capping la...
- Patent number 12,046,657
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsueh Wen Tsau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and preparation methods thereof
- Patent number 12,027,418
- Issue date Jul 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Pingheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including liner structure
- Patent number 12,027,419
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Ching-Fu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation and structure
- Patent number 12,020,981
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive layer stack and method for fabric...
- Patent number 12,014,955
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure with conductive...
- Patent number 12,014,986
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Chin-Te Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration reduction
- Patent number 12,014,987
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECT...
- Publication number 20240421155
- Publication date Dec 19, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Publication number 20240420997
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240387260
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng Yan JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUG
- Publication number 20240387267
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387166
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...
- Publication number 20240387165
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES
- Publication number 20240387379
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES
- Publication number 20240387259
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387381
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...
- Publication number 20240379761
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Ching WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LINER TSV STRUCTURE AND METHOD FORMING SAME
- Publication number 20240379521
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240379557
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Liners to Facilitate The Formation of Copper-Containing Via...
- Publication number 20240379556
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD
- Publication number 20240379422
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371758
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Yu-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20240355675
- Publication date Oct 24, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240339395
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Byungchul KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240339358
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Jesus Candelario Mendoza-Gutierrez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240332075
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS

Layer combinations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming interconnect structure having a barrier layer

Gate structure and semiconductor device having the same

Chemical direct pattern plating method

Tungsten molybdenum structures

Contact conductive feature formation and structure

Semiconductor device

Contact over active gate structures for advanced integrated circuit...

Semiconductor device, semiconductor wafer, memory device, and elect...

Contact plug

Selective blocking of metal surfaces using bifunctional self-assemb...

Method of manufacturing a semiconductor device and a semiconductor...

Beol tip-to-tip shorting and time dependent dielectric breakdown

Film stack simplification for high aspect ratio patterning and vert...

Recessed gate strcutre with protection layer

Semiconductor device having interconnection structure and method of...

Barrier-less structures

Thermally stable copper-alloy adhesion layer for metal interconnect...

Field effect transistor with multi-metal gate via and method

Semiconductor device structure integrating air gaps and methods of...

Low resistance contacts including intermetallic alloy of nickel, pl...

Gate cut and fin trim isolation for advanced integrated circuit str...

Top via interconnects without barrier metal between via and above line

Two 2D capping layers on interconnect conductive structure to incre...

Method of manufacturing a semiconductor device including capping la...

Semiconductor devices and preparation methods thereof

Semiconductor device including liner structure

Conductive feature formation and structure

Method for fabricating conductive layer stack and method for fabric...

Method for preparing semiconductor device structure with conductive...

Electro-migration reduction

Patents Applicationslast 30 patents

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECT...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION

Interconnect Structure and Method of Forming Thereof

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

LOW-RESISTANCE COPPER INTERCONNECTS

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

CONTACT PLUG

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

GATE CONTACT STRUCTURE

SEMICONDUCTOR DEVICE WITH POROUS LAYER AND METHOD FOR FABRICATING T...

METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES

CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE STRUCTURE INTEGRATING AIR GAPS AND METHODS OF...

MULTI-LINER TSV STRUCTURE AND METHOD FORMING SAME

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

Forming Liners to Facilitate The Formation of Copper-Containing Via...

FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHODS OF FORMING INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE

METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES