Layer combinations

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H01L21/76846

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76846Layer combinations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,272,597
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a nitrided capping layer
- Patent number 12,261,082
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 12,255,247
- Issue date Mar 18, 2025
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene liners and caps for semiconductor structures
- Patent number 12,255,144
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,256,565
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner and barrier layer in dual damascene cu interconnect for enhan...
- Patent number 12,243,773
- Issue date Mar 4, 2025
- SiEn (QingDao) Integrated Circuits Co., Ltd
- Zhaosheng Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 12,237,216
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contact structure
- Patent number 12,237,218
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Ting Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and methods of formin...
- Patent number 12,230,537
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of integrated circuit semiconductor device
- Patent number 12,230,568
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jungha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit device having an etch-stop...
- Patent number 12,218,054
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for forming semiconductor devices containin...
- Patent number 12,217,965
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Fei Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal liner for interconnect structures
- Patent number 12,211,743
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing recessed gate structure with protection layer
- Patent number 12,211,905
- Issue date Jan 28, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,199,164
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for copper doped hybrid metallization for line and via
- Patent number 12,183,631
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Suketu Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate structure and semiconductor device having the same
- Patent number 12,166,126
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten molybdenum structures
- Patent number 12,159,804
- Issue date Dec 3, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact conductive feature formation and structure
- Patent number 12,148,659
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor wafer, memory device, and elect...
- Patent number 12,125,849
- Issue date Oct 22, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method Of Forming A Metal Liner For Interconnect Structures
- Publication number 20250112090
- Publication date Apr 3, 2025
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...
- Publication number 20250098258
- Publication date Mar 20, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250098270
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-REGION DIFFUSION BARRIER CONTAINING TITANIUM, SILICON AND NIT...
- Publication number 20250087534
- Publication date Mar 13, 2025
- EUGENUS, INC.
- Vinayak Veer Vats
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20250079238
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL TREATMENT ON METAL SILICIDE FOR CMOS DEVICES
- Publication number 20250081569
- Publication date Mar 6, 2025
- Applied Materials, Inc.
- Nicolas Louis BREIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
- Publication number 20250070026
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING GATE STRUCTURE
- Publication number 20250063759
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT
- Publication number 20250062160
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE
- Publication number 20250046716
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Junjing BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN MOLYBDENUM STRUCTURES
- Publication number 20250038051
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xi CEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250038049
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECT STRUCTURES
- Publication number 20250022750
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Shinjae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES
- Publication number 20250006552
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Liqi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECT...
- Publication number 20240421155
- Publication date Dec 19, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Publication number 20240420997
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
- Publication number 20240395612
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsien CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20240387260
- Publication date Nov 21, 2024
- NANYA TECHNOLOGY CORPORATION
- Cheng Yan JI
- H01 - BASIC ELECTRIC ELEMENTS

Layer combinations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor interconnection structures and methods of forming the...

Conductive feature of a semiconductor device

Semiconductor devices with a nitrided capping layer

Trench contact structures for advanced integrated circuit structure...

Graphene liners and caps for semiconductor structures

Method for preparing recessed gate structure with protection layer

Liner and barrier layer in dual damascene cu interconnect for enhan...

Method for filling recessed features in semiconductor devices with...

Method of fabricating contact structure

Semiconductor device having a contact structure

Semiconductor device structure having air gap and methods of formin...

Interconnection structure of integrated circuit semiconductor device

Method of forming an integrated circuit device having an etch-stop...

Methods and apparatuses for forming semiconductor devices containin...

Method of forming a metal liner for interconnect structures

Method for preparing recessed gate structure with protection layer

Gate line plug structures for advanced integrated circuit structure...

Semiconductor device and manufacturing method thereof

Plugs for interconnect lines for advanced integrated circuit struct...

Semiconductor package

Methods for copper doped hybrid metallization for line and via

Semiconductor device

Method of forming interconnect structure having a barrier layer

Gate structure and semiconductor device having the same

Chemical direct pattern plating method

Tungsten molybdenum structures

Contact conductive feature formation and structure

Semiconductor device

Contact over active gate structures for advanced integrated circuit...

Semiconductor device, semiconductor wafer, memory device, and elect...

Patents Applicationslast 30 patents

Method Of Forming A Metal Liner For Interconnect Structures

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTI-REGION DIFFUSION BARRIER CONTAINING TITANIUM, SILICON AND NIT...

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

METAL TREATMENT ON METAL SILICIDE FOR CMOS DEVICES

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS

METHOD OF FORMING GATE STRUCTURE

METAL IMPLANTATION TO BARRIER OR LINER FOR INTERCONNECT

MODIFIED REVERSE SELECTIVE BARRIER STRUCTURE

TUNGSTEN MOLYBDENUM STRUCTURES

INTERCONNECT STRUCTURE AND FABRICATION METHOD THEREOF

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

METHODS OF FORMING INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE

BOTTOM-UP GAP FILL PROCESSES FOR SEMICONDUCTOR SUBSTRATES

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER, MEMORY DEVICE, AND ELECT...

SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

Interconnect Structure and Method of Forming Thereof

CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

LOW-RESISTANCE COPPER INTERCONNECTS

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE