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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76846
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Patents Grants
last 30 patents
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Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
Patent number
11,955,532
Issue date
Apr 9, 2024
Intel Corporation
Jeffrey S. Leib
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,955,383
Issue date
Apr 9, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jie Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
Patent number
11,955,534
Issue date
Apr 9, 2024
Intel Corporation
Andrew W. Yeoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal adhesion layer to promote metal plug adhesion
Patent number
11,955,379
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pei-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Trench contact structures for advanced integrated circuit structure...
Patent number
11,948,997
Issue date
Apr 2, 2024
Intel Corporation
Subhash M. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having vertical conductive graphene and met...
Patent number
11,948,837
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Fu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,948,888
Issue date
Apr 2, 2024
Samsung Electronics Co., Ltd.
Hongsik Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-region diffusion barrier containing titanium, silicon and nit...
Patent number
11,942,365
Issue date
Mar 26, 2024
Eugenus, Inc.
Vinayak Veer Vats
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing oxidation by etching sacrificial and protection layer sepa...
Patent number
11,929,281
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia Cheng Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive contact having barrier layers with different depths
Patent number
11,929,328
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Yang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect level with high resistance layer and method of forming...
Patent number
11,923,295
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hong-Wei Chan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
Patent number
11,908,735
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Jen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Composite interconnect formation using graphene
Patent number
11,908,734
Issue date
Feb 20, 2024
International Business Machines Corporation
Takeshi Nogami
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,908,800
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ya-Chin Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming an interconnect structure
Patent number
11,901,226
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Wen-Kuei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,901,230
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device with covering liners
Patent number
11,894,264
Issue date
Feb 6, 2024
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a self-forming barrier layer at via bottom
Patent number
RE49820
Issue date
Jan 30, 2024
GLOBALFOUNDRIES U.S. INC.
Larry Zhao
Information
Patent Grant
Advanced copper interconnects with hybrid microstructure
Patent number
11,881,433
Issue date
Jan 23, 2024
TESSERA LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fin patterning for advanced integrated circuit structure fabrication
Patent number
11,881,520
Issue date
Jan 23, 2024
Intel Corporation
Curtis Ward
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for electrochemical deposition of isolated seed layer areas
Patent number
11,875,996
Issue date
Jan 16, 2024
Applied Materials, Inc.
Marvin Louis Bernt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive layer stack and semiconductor device with a gate contact
Patent number
11,876,051
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Che-Hsien Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cobalt based interconnects and methods of fabrication thereof
Patent number
11,862,563
Issue date
Jan 2, 2024
Tahoe Research, LTD.
Christopher J. Jezewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low resistance contacts including intermetallic alloy of nickel, pl...
Patent number
11,862,567
Issue date
Jan 2, 2024
International Business Machines Corporation
John Bruley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plated metallization structures
Patent number
11,862,518
Issue date
Jan 2, 2024
Analog Devices International Unlimited Company
Jan Kubik
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method for forming titanium nitride barrier with small surface grai...
Patent number
11,854,980
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Ming Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
Patent number
11,854,878
Issue date
Dec 26, 2023
TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
Huei-Wen Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact structure of a semiconductor device
Patent number
11,854,875
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Joanna Chaw Yane Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal contact structure and method of forming the same in a semicon...
Patent number
11,854,874
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Barrier-less structures
Patent number
11,848,190
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Ping Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240128122
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE
Publication number
20240096796
Publication date
Mar 21, 2024
Samsung Electronics Co., Ltd.
Yongjin KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
Publication number
20240096697
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Joanna Chaw Yane YIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
Publication number
20240087953
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
Publication number
20240079270
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Huei-Wen Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
Publication number
20240079332
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., LTD
Chia-Yang WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
Publication number
20240071816
Publication date
Feb 29, 2024
Micron Technology, Inc.
Alyssa N. Scarbrough
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SKIP VIA WITH LOCALIZED SPACER
Publication number
20240071904
Publication date
Feb 29, 2024
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LANTHANUM NITRIDE AS A DRAM MOLYBDENUM LINER
Publication number
20240074162
Publication date
Feb 29, 2024
Applied Materials, Inc.
Rand Haddadin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
Publication number
20240047556
Publication date
Feb 8, 2024
Intel Corporation
Andrew W. YEOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTS HAVING A PORTION WITHOUT A LINER MATERIAL AND RELATED...
Publication number
20240038661
Publication date
Feb 1, 2024
Intel Corporation
Manish Chandhok
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH AIR GAP AND METHOD FOR MANUFACTURING T...
Publication number
20240038586
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Liner TSV Structure and Method Forming Same
Publication number
20240021509
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
Publication number
20240021501
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Mrunal A. Khaderbad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240014069
Publication date
Jan 11, 2024
UNITED MICROELECTRONICS CORP.
Da-Jun Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE BARRIER LAYERS
Publication number
20240006235
Publication date
Jan 4, 2024
Applied Materials, Inc.
Jiajie Cen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
Publication number
20240006237
Publication date
Jan 4, 2024
Adeia Semiconductor Solutions LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
Publication number
20230420545
Publication date
Dec 28, 2023
Intel Corporation
Tahir GHANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230411296
Publication date
Dec 21, 2023
Taiwan Semiconductor Manufacturing company Ltd.
MENG-HSIEN LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230402320
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JUN-NAN NIAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARBON-BASED LINER TO REDUCE CONTACT RESISTANCE
Publication number
20230402321
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsien CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONTACT STRUCTURE
Publication number
20230402388
Publication date
Dec 14, 2023
NANYA TECHNOLOGY CORPORATION
YU-CHANG CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A CONTACT PLUG BY BOTTOM-UP METAL GROWTH
Publication number
20230386915
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Liang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE
Publication number
20230387018
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., LTD
Shin-Yi YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
Publication number
20230386914
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Chen KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE CONTACT STRUCTURE
Publication number
20230386916
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...
Publication number
20230386901
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Ting-Ya LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL NITRIDE DIFFUSION BARRIER AND METHODS OF FORMATION
Publication number
20230377961
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Martin Christopher HOLLAND
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-CARBON-CONCENTRATION DIELECTRICS
Publication number
20230369209
Publication date
Nov 16, 2023
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Feature Formation and Structure
Publication number
20230369109
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu Shih Wang
H01 - BASIC ELECTRIC ELEMENTS