Layers specifically deposited to enhance or enable the nucleation of further layers

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H01L2221/1084

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/1084Layers specifically deposited to enhance or enable the nucleation of further layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for forming components without adding tabs during etching
- Patent number 12,044,965
- Issue date Jul 23, 2024
- Hutchinson Technology Incorporated
- Clark T. Olsen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 11,929,393
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 11,756,800
- Issue date Sep 12, 2023
- Rashid Mavliev
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Integrated circuit devices and methods of manufacturing the same
- Patent number 11,569,344
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including physical unclonable function
- Patent number 11,177,225
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Bahman Hekmatshoartabari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bumps and process for making same
- Patent number 9,449,931
- Issue date Sep 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method forming through-via using electroless plating solution
- Patent number 9,401,307
- Issue date Jul 26, 2016
- Mitsubishi Gas Chemical Company, Inc.
- Keiichi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a through-silicon via utilizing a metal contact p...
- Patent number 8,951,906
- Issue date Feb 10, 2015
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and materials including crystallization of substra...
- Patent number 8,859,403
- Issue date Oct 14, 2014
- Gigasi Solar, Inc.
- Venkatraman Prabhakar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Pillar bumps and process for making same
- Patent number 8,823,166
- Issue date Sep 2, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a through-silicon via utilizing a metal contact p...
- Patent number 8,791,009
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems, methods and materials including crystallization of substra...
- Patent number 8,361,890
- Issue date Jan 29, 2013
- Gigasi Solar, Inc.
- Venkatraman Prabhakar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240186369
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20230369065
- Publication date Nov 16, 2023
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230163164
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Jungoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...
- Publication number 20210305061
- Publication date Sep 30, 2021
- RASHID MAVLIEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM
- Publication number 20150348826
- Publication date Dec 3, 2015
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Structure for Copper Interconnect
- Publication number 20150262870
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FORMING THROUGH-VIA USING ELECTROLESS PLATING SOLUTION
- Publication number 20150243553
- Publication date Aug 27, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Keiichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20140363966
- Publication date Dec 11, 2014
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...
- Publication number 20140342552
- Publication date Nov 20, 2014
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...
- Publication number 20140227870
- Publication date Aug 14, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS AND MATERIALS INCLUDING CRYSTALLIZATION OF SUBSTRA...
- Publication number 20140021477
- Publication date Jan 23, 2014
- Venkatraman Prabhakar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...
- Publication number 20120315753
- Publication date Dec 13, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Bumps and Process for Making Same
- Publication number 20120049346
- Publication date Mar 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS AND MATERIALS INCLUDING CRYSTALLIZATION OF SUBSTRA...
- Publication number 20110101364
- Publication date May 5, 2011
- Venkatraman Prabhakar
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Layers specifically deposited to enhance or enable the nucleation of further layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems of forming metal interconnect layers using engi...

Method for forming components without adding tabs during etching

Integrated circuit devices and methods of manufacturing the same

Methods and systems of forming metal interconnect layers using engi...

Integrated circuit devices and methods of manufacturing the same

Semiconductor device including physical unclonable function

Pillar bumps and process for making same

Method forming through-via using electroless plating solution

Method of forming a through-silicon via utilizing a metal contact p...

Systems, methods and materials including crystallization of substra...

Pillar bumps and process for making same

Method of forming a through-silicon via utilizing a metal contact p...

Systems, methods and materials including crystallization of substra...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME

METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERS USING ENGI...

METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM

Barrier Structure for Copper Interconnect

METHOD FORMING THROUGH-VIA USING ELECTROLESS PLATING SOLUTION

Pillar Bumps and Process for Making Same

METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...

METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...

SYSTEMS, METHODS AND MATERIALS INCLUDING CRYSTALLIZATION OF SUBSTRA...

METHOD OF FORMING A THROUGH-SILICON VIA UTILIZING A METAL CONTACT P...

Pillar Bumps and Process for Making Same

SYSTEMS, METHODS AND MATERIALS INCLUDING CRYSTALLIZATION OF SUBSTRA...