Layers specifically deposited to enhance or enable the nucleation of further layers

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H01L21/76871

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76871Layers specifically deposited to enhance or enable the nucleation of further layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 12,322,653
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices devices including crystallized layer having m...
- Patent number 12,322,595
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene barrier layer for reduced contact resistance
- Patent number 12,315,811
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 12,315,765
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,300,602
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a nitrided capping layer
- Patent number 12,261,082
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming vias in a GaN/diamond wafer
- Patent number 12,261,206
- Issue date Mar 25, 2025
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten feature fill with inhibition control
- Patent number 12,261,081
- Issue date Mar 25, 2025
- Lam Research Corporation
- Tsung-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,255,173
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for filling recessed features in semiconductor devices with...
- Patent number 12,237,216
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Kai-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 12,230,430
- Issue date Feb 18, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure of integrated circuit semiconductor device
- Patent number 12,230,568
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jungha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and manufacturing method thereof, and three...
- Patent number 12,218,032
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,198,978
- Issue date Jan 14, 2025
- Sumitomo Electric Device Innovations, Inc.
- Shouhei Kitajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,191,203
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,183,733
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 12,183,709
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device structure having dielectric features between a plural...
- Patent number 12,165,926
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Ting Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene layer for low resistance contacts and damascene interconnects
- Patent number 12,136,570
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,119,318
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection structure and semiconductor device
- Patent number 12,119,236
- Issue date Oct 15, 2024
- Osram Opto Semiconductors GmbH
- Andreas Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 12,113,132
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,087,826
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with ring-shaped substrates
- Patent number 12,074,104
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250174545
- Publication date May 29, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyun Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMI...
- Publication number 20250149482
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shan Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250149476
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132202
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Seokkyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Trace Substrate...
- Publication number 20250118599
- Publication date Apr 10, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250120172
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Chuan YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250096044
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250096181
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Changbo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...
- Publication number 20250087565
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250081594
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Ting PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20250079238
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Uihyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFERENTIAL ETCH RATES OF COPPER FEATURES
- Publication number 20250046654
- Publication date Feb 6, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE
- Publication number 20250038106
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LAYER FOR LOW RESISTANCE CONTACTS AND DAMASCENE INTERCONNECTS
- Publication number 20240395627
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20240387380
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Rail Conductors For Non-Planar Semiconductor Devices
- Publication number 20240379854
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGES
- Publication number 20240363610
- Publication date Oct 31, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND PREPARING METHOD TH...
- Publication number 20240332371
- Publication date Oct 3, 2024
- Dynax Semiconductor, Inc.
- Hui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240332010
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION REDUCTION
- Publication number 20240332190
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...
- Publication number 20240322042
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240297114
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20240290656
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures In Semiconductor Devices
- Publication number 20240282627
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Peng-Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240274589
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Layers specifically deposited to enhance or enable the nucleation of further layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned metal gate for multigate device and method of forming...

Semiconductor devices devices including crystallized layer having m...

Graphene barrier layer for reduced contact resistance

Backside metal patterning die singulation systems and related methods

Semiconductor package structure and method for manufacturing the same

Semiconductor devices with a nitrided capping layer

Method of forming vias in a GaN/diamond wafer

Tungsten feature fill with inhibition control

Semiconductor packages and methods of forming the same

Chip package structure

Method for filling recessed features in semiconductor devices with...

Substrate embedded magnetic core inductors and method of making

Interconnection structure of integrated circuit semiconductor device

Semiconductor chip and semiconductor package including the same

Semiconductor apparatus and manufacturing method thereof, and three...

Semiconductor device and method of fabricating the same

Method of manufacturing semiconductor device

Semiconductor package

Semiconductor device structure and methods of forming the same

Chip package structure with ring-like structure

FinFET device structure having dielectric features between a plural...

Via for component electrode connection

Graphene layer for low resistance contacts and damascene interconnects

Semiconductor package and manufacturing method thereof

Bonding structure and method of forming same

Method for producing a connection structure and semiconductor device

Metal rail conductors for non-planar semiconductor devices

Formation of metal vias on metal lines

Method for forming a semiconductor structure

Integrated circuit packages with ring-shaped substrates

Patents Applicationslast 30 patents

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

VIAS WITH SELECTED GRAIN DISTRIBUTION

SEMICONDUCTOR STRUCTURE WITH BONDING INTERFACE AND METHODS OF FORMI...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Embedded Trace Substrate...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME AND MANU...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

DIFFERENTIAL ETCH RATES OF COPPER FEATURES

BOND STRUCTURE

BONDING STRUCTURE AND METHOD OF FORMING SAME

GRAPHENE LAYER FOR LOW RESISTANCE CONTACTS AND DAMASCENE INTERCONNECTS

REDISTRIBUTION LAYER FEATURES

Via for Component Electrode Connection

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Metal Rail Conductors For Non-Planar Semiconductor Devices

HYBRID INTEGRATED CIRCUIT PACKAGES

EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND PREPARING METHOD TH...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

ELECTRO-MIGRATION REDUCTION

SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...

CIRCUIT STRUCTURE

METHODS OF FORMING SEMICONDUCTOR PACKAGES

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

Contact Structures In Semiconductor Devices

MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE