Layers specifically deposited to enhance or enable the nucleation of further layers

Industry

CPC
H01L21/76871

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76871Layers specifically deposited to enhance or enable the nucleation of further layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene layer for low resistance contacts and damascene interconnects
- Patent number 12,136,570
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,131,986
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 12,119,318
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a connection structure and semiconductor device
- Patent number 12,119,236
- Issue date Oct 15, 2024
- Osram Opto Semiconductors GmbH
- Andreas Rudolph
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 12,113,132
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure
- Patent number 12,087,826
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with ring-shaped substrates
- Patent number 12,074,104
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit package
- Patent number 12,068,297
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages including conductors electrically con...
- Patent number 12,062,635
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plug with impurity variation
- Patent number 12,033,893
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device integrating backside power grid and related in...
- Patent number 12,034,076
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,033,853
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having electric power transmitting elements on...
- Patent number 12,027,454
- Issue date Jul 2, 2024
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 12,020,983
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating conductive layer stack and method for fabric...
- Patent number 12,014,955
- Issue date Jun 18, 2024
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-migration reduction
- Patent number 12,014,987
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,014,979
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 12,009,256
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 12,002,709
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 11,996,400
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 11,984,356
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peng-Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 11,961,763
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling threshold voltages through blocking layers
- Patent number 11,961,732
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive feature including cleaning step
- Patent number 11,955,329
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20240395752
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LAYER FOR LOW RESISTANCE CONTACTS AND DAMASCENE INTERCONNECTS
- Publication number 20240395627
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20240387380
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379519
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Rail Conductors For Non-Planar Semiconductor Devices
- Publication number 20240379854
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT PACKAGES
- Publication number 20240363610
- Publication date Oct 31, 2024
- Taiwan Semiconductor Mamufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240332010
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND PREPARING METHOD TH...
- Publication number 20240332371
- Publication date Oct 3, 2024
- Dynax Semiconductor, Inc.
- Hui ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-MIGRATION REDUCTION
- Publication number 20240332190
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...
- Publication number 20240322042
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240297114
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20240290656
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures In Semiconductor Devices
- Publication number 20240282627
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Peng-Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240274589
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20240258243
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR FOR MEASURING A GAS PROPERTY
- Publication number 20240248071
- Publication date Jul 25, 2024
- INFINEON TECHNOLOGIES AG
- Julia Isabel PEREZ BARRAZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240250036
- Publication date Jul 25, 2024
- TAIWAN SEMICODUCTOR MANUFACTURING CO., LTD.
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED VIA STRUCTURE
- Publication number 20240234299
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING THRESHOLD VOLTAGES THROUGH BLOCKING LAYERS
- Publication number 20240222108
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER
- Publication number 20240222194
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Diamond Semiconductor System And Method
- Publication number 20240213024
- Publication date Jun 27, 2024
- AKHAN Semiconductor, Inc.
- Adam Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Conductive Feature Including Cleaning Step
- Publication number 20240213016
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD AND MANUFACTURING APP...
- Publication number 20240203732
- Publication date Jun 20, 2024
- KYOCERA CORPORATION
- Katsuaki MASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240194569
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACK STRUCTURE
- Publication number 20240186291
- Publication date Jun 6, 2024
- SK HYNIX INC.
- Sung Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20240178060
- Publication date May 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240162119
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240153849
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS

Layers specifically deposited to enhance or enable the nucleation of further layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Via for component electrode connection

Graphene layer for low resistance contacts and damascene interconnects

Semiconductor package and manufacturing method thereof

Bonding structure and method of forming same

Method for producing a connection structure and semiconductor device

Metal rail conductors for non-planar semiconductor devices

Formation of metal vias on metal lines

Method for forming a semiconductor structure

Integrated circuit packages with ring-shaped substrates

Hybrid integrated circuit package

Semiconductor device packages including conductors electrically con...

Semiconductor package structure and method for manufacturing the same

Contact plug with impurity variation

Semiconductor device integrating backside power grid and related in...

Semiconductor devices and methods of manufacture

Packaging substrate having electric power transmitting elements on...

Processes for reducing leakage and improving adhesion

Method for fabricating conductive layer stack and method for fabric...

Electro-migration reduction

Methods of forming semiconductor packages

Redistribution lines with protection layers and method forming same

Interconnect structure and manufacturing method for the same

Manufacturing method of package on package structure

Contact structures in semiconductor devices

Stacked via structure

Redistribution substrate, method of fabricating the same, and semic...

Package component with stepped passivation layer

Self-aligned metal gate for multigate device and method of forming...

Controlling threshold voltages through blocking layers

Method of forming conductive feature including cleaning step

Patents Applicationslast 30 patents

BONDING STRUCTURE AND METHOD OF FORMING SAME

GRAPHENE LAYER FOR LOW RESISTANCE CONTACTS AND DAMASCENE INTERCONNECTS

REDISTRIBUTION LAYER FEATURES

Via for Component Electrode Connection

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Metal Rail Conductors For Non-Planar Semiconductor Devices

HYBRID INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

EPITAXIAL STRUCTURE OF SEMICONDUCTOR DEVICE AND PREPARING METHOD TH...

ELECTRO-MIGRATION REDUCTION

SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED IN...

CIRCUIT STRUCTURE

METHODS OF FORMING SEMICONDUCTOR PACKAGES

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

Contact Structures In Semiconductor Devices

MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

SENSOR FOR MEASURING A GAS PROPERTY

SEMICONDUCTOR PACKAGE AND METHOD

STACKED VIA STRUCTURE

CONTROLLING THRESHOLD VOLTAGES THROUGH BLOCKING LAYERS

PACKAGE COMPONENT WITH STEPPED PASSIVATION LAYER

Diamond Semiconductor System And Method

Method of Forming Conductive Feature Including Cleaning Step

SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD AND MANUFACTURING APP...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DIE STACK STRUCTURE

BACKSIDE METAL PATTERNING DIE SINGULATION SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME