Layers specifically deposited to enhance or enable the nucleation of further layers

Industry

CPC
H01L21/76871

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76871Layers specifically deposited to enhance or enable the nucleation of further layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked via structure
- Patent number 11,973,023
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution substrate, method of fabricating the same, and semic...
- Patent number 11,973,028
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component with stepped passivation layer
- Patent number 11,961,762
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 11,961,763
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling threshold voltages through blocking layers
- Patent number 11,961,732
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming conductive feature including cleaning step
- Patent number 11,955,329
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,948,863
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,948,890
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hao Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 11,942,366
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diamond semiconductor system and method
- Patent number 11,915,934
- Issue date Feb 27, 2024
- AKHAN SEMICONDUCTOR, INC.
- Adam Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN/diamond wafers
- Patent number 11,901,417
- Issue date Feb 13, 2024
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,901,266
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method
- Patent number 11,903,216
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,901,230
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN/diamond wafers
- Patent number 11,901,418
- Issue date Feb 13, 2024
- RFHIC Corporation
- Won Sang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive layer stack and semiconductor device with a gate contact
- Patent number 11,876,051
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Che-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, forming method thereof, and semiconductor...
- Patent number 11,854,885
- Issue date Dec 26, 2023
- Changxin Memory Technologies, Inc.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal contact structure and method of forming the same in a semicon...
- Patent number 11,854,874
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,855,039
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain metal contact and formation thereof
- Patent number 11,855,144
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,848,233
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 11,848,302
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,823,894
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via with next level line selective growth
- Patent number 11,823,998
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Brent Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 11,824,023
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive powder formation method and device for forming conductiv...
- Patent number 11,819,923
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- You-Hua Chou
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Magnetically enhanced high density plasma-chemical vapor deposition...
- Patent number 11,821,068
- Issue date Nov 21, 2023
- IonQuest Corp.
- Bassam Hanna Abraham
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,798,883
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD
- Publication number 20240138152
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128122
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128120
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20240120313
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Metal Contact and Formation Thereof
- Publication number 20240096961
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Contact Structure and Method of Forming the Same in a Semicon...
- Publication number 20240087953
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240088090
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SKIP VIA WITH LOCALIZED SPACER
- Publication number 20240071904
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240063030
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240038699
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Wonkyun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED METAL GATE FOR MULTIGATE DEVICE AND METHOD OF FORMING...
- Publication number 20240030066
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Plug with Impurity Variation
- Publication number 20240021471
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS-COMPATIBLE GRAPHENE STRUCTURES, INTERCONNECTS AND FABRICATION...
- Publication number 20240014071
- Publication date Jan 11, 2024
- The Regents of the University of California
- Kaustav Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014197
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR INTERCONNECT STRUCTURE AND SEM...
- Publication number 20230395396
- Publication date Dec 7, 2023
- Changxin Memory Technologies, Inc.
- Pingheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR FORMING CONDUCTIVE POWDER
- Publication number 20230381862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua CHOU
- B22 - CASTING POWDER METALLURGY
Information Patent Application
GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE
- Publication number 20230387018
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shin-Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230387059
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Changbo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20230386827
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230369322
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Chuan YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230369125
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Ting PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20230352342
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...
- Publication number 20230343644
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT OXIDATION AND ETCH OF PVD MOLYBDENUM FOR BOTTOM UP GAP FILL
- Publication number 20230343645
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Meng-Shan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20230335536
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE MANUFACTURING METHOD
- Publication number 20230326765
- Publication date Oct 12, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE
- Publication number 20230317873
- Publication date Oct 5, 2023
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER FEATURES
- Publication number 20230307366
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20230274976
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260885
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tuan-Yu Hung
- H01 - BASIC ELECTRIC ELEMENTS

Layers specifically deposited to enhance or enable the nucleation of further layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked via structure

Redistribution substrate, method of fabricating the same, and semic...

Package component with stepped passivation layer

Self-aligned metal gate for multigate device and method of forming...

Controlling threshold voltages through blocking layers

Method of forming conductive feature including cleaning step

Package structure and method of forming the same

Methods and apparatus for forming dual metal interconnects

Semiconductor package and method

Backside metal patterning die singulation systems and related methods

Stacked die modules for semiconductor device assemblies and methods...

Diamond semiconductor system and method

GaN/diamond wafers

Semiconductor device structure and method for forming the same

Three-dimensional memory device and method

Semiconductor package and manufacturing method thereof

GaN/diamond wafers

Conductive layer stack and semiconductor device with a gate contact

Semiconductor structure, forming method thereof, and semiconductor...

Metal contact structure and method of forming the same in a semicon...

Chip package structure

Source/drain metal contact and formation thereof

Semiconductor package and manufacturing method thereof

Chip package structure with ring-like structure

Semiconductor devices and methods of manufacture

Top via with next level line selective growth

Semiconductor chip and semiconductor package including the same

Conductive powder formation method and device for forming conductiv...

Magnetically enhanced high density plasma-chemical vapor deposition...

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

Source/Drain Metal Contact and Formation Thereof

Metal Contact Structure and Method of Forming the Same in a Semicon...

CHIP PACKAGE STRUCTURE

SKIP VIA WITH LOCALIZED SPACER

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SELF-ALIGNED METAL GATE FOR MULTIGATE DEVICE AND METHOD OF FORMING...

Contact Plug with Impurity Variation

CMOS-COMPATIBLE GRAPHENE STRUCTURES, INTERCONNECTS AND FABRICATION...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR INTERCONNECT STRUCTURE AND SEM...

DEVICE FOR FORMING CONDUCTIVE POWDER

GRAPHENE LAYER FOR REDUCED CONTACT RESISTANCE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...

GRADIENT OXIDATION AND ETCH OF PVD MOLYBDENUM FOR BOTTOM UP GAP FILL

Semiconductor Packages and Methods of Forming the Same

PACKAGE SUBSTRATE MANUFACTURING METHOD

SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE

REDISTRIBUTION LAYER FEATURES

Processes for Reducing Leakage and Improving Adhesion

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF