Layout details of a plurality of traces

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H05K2201/09227

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09227Layout details of a plurality of traces

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Patents Grantslast 30 patents

Information Patent Grant
Display panel
- Patent number 12,363,824
- Issue date Jul 15, 2025
- Yungu (Gu'an) Technology Co., Ltd.
- Hongrui Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional circuit mounting structures
- Patent number 12,342,448
- Issue date Jun 24, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection body and harness
- Patent number 12,334,659
- Issue date Jun 17, 2025
- Japan Aviation Electronics Industry, Limited
- Kentaro Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and power conversion apparatus
- Patent number 12,336,094
- Issue date Jun 17, 2025
- Fuji Electric Co., Ltd.
- Ryoga Kiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 12,309,930
- Issue date May 20, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module, display apparatus, and method of manufacturing the...
- Patent number 12,278,225
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Jongsu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,274,000
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Sang Hun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component sub-mount and electronic device using the same
- Patent number 12,267,960
- Issue date Apr 1, 2025
- Lextar Electronics Corporation
- Ming-Jing Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Decoupled PCB structure to parallel power transistors
- Patent number 12,237,760
- Issue date Feb 25, 2025
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 12,232,254
- Issue date Feb 18, 2025
- Unimicron Technology Corporation
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 12,211,797
- Issue date Jan 28, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact arrangement and electronic assembly
- Patent number 12,191,242
- Issue date Jan 7, 2025
- Via Technologies, Inc.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring board
- Patent number 12,185,458
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- Ryo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including lines provided on elastic base
- Patent number 12,177,981
- Issue date Dec 24, 2024
- Japan Display Inc.
- Takumi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 12,177,975
- Issue date Dec 24, 2024
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 12,133,330
- Issue date Oct 29, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Current sensors for power converters
- Patent number 12,126,264
- Issue date Oct 22, 2024
- Apple Inc.
- Brandon Pierquet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
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- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-performance capacitor packaging for next generation power elec...
- Patent number 12,100,560
- Issue date Sep 24, 2024
- UT-Battelle, LLC
- Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and electronic device having polarizer with conducti...
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- Issue date Sep 10, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Dong Tian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board configuration blocks and edge projections
- Patent number 12,082,342
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadside coupled radio frequency interconnect
- Patent number 12,069,798
- Issue date Aug 20, 2024
- Lockheed Martin Corporation
- Thomas Henry Hand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 12,041,720
- Issue date Jul 16, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wetness pad assembly, system and method
- Patent number 12,029,631
- Issue date Jul 9, 2024
- Franklin Edward Ward
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY APPARATUS
- Publication number 20250237900
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Ren XIONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20250240877
- Publication date Jul 24, 2025
- Nitto Denko Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...
- Publication number 20250227840
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Sang Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE CAPABLE OF SUPPRESSING COMMON MODE NOISE
- Publication number 20250203756
- Publication date Jun 19, 2025
- EMPass Technology Inc.
- Yang-Chih HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT SUB-MOUNT
- Publication number 20250203780
- Publication date Jun 19, 2025
- Lextar Electronics Corporation
- Ming-Jing LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISCHARGE COLLECTOR
- Publication number 20250151189
- Publication date May 8, 2025
- Wiliot, LTD.
- Alon YEHEZKELY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250126710
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250107055
- Publication date Mar 27, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE
- Publication number 20250079284
- Publication date Mar 6, 2025
- KYOCERA CORPORATION
- Shigenori TAKAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR STRUCTURES
- Publication number 20250056711
- Publication date Feb 13, 2025
- Cisco Technology, Inc.
- D. Brice Achkir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PANEL
- Publication number 20250048544
- Publication date Feb 6, 2025
- AUO Corporation
- Zih-Shuo Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
Metal-ceramic substrate and method for producing a metal ceramic su...
- Publication number 20250048556
- Publication date Feb 6, 2025
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES
- Publication number 20250048532
- Publication date Feb 6, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Earbud with Low Enoise
- Publication number 20250030971
- Publication date Jan 23, 2025
- Google LLC
- Mingfeng Xue
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250016909
- Publication date Jan 9, 2025
- Sumitomo Electric Industries, Ltd.
- Shun IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES
- Publication number 20250016930
- Publication date Jan 9, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND ROTATING ELECTRICAL MACHINE
- Publication number 20250008655
- Publication date Jan 2, 2025
- Honda Motor Co., Ltd.
- Daiki Suetsugu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONIC DEVICE COMPRISING RIGID FLEXIBLE PRINTED CIRCUI...
- Publication number 20240427376
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Hansol KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240422912
- Publication date Dec 19, 2024
- PanelSemi Corporation
- Sheng-Ping CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20240389234
- Publication date Nov 21, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit layout of printed circuit board
- Publication number 20240349421
- Publication date Oct 17, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- CHIA-LUNG WANG
- H01 - BASIC ELECTRIC ELEMENTS

Layout details of a plurality of traces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display panel

Three dimensional circuit mounting structures

Connection body and harness

Wiring board and power conversion apparatus

Display apparatus

Board-level pad pattern for multi-row QFN packages

Display module, display apparatus, and method of manufacturing the...

Flexible printed circuit board, COF module, and electronic device c...

Leadless current sensor package with high isolation

Electronic component sub-mount and electronic device using the same

Rapid implementation of high-temperature analog interface electronics

Decoupled PCB structure to parallel power transistors

Printed circuit board and manufacturing method thereof

Flexible substrate

Contact arrangement and electronic assembly

Flexible wiring board

Electronic device including lines provided on elastic base

Wiring substrate

High speed network device with orthogonal pluggable optics modules

Resetting different pair skew of printed circuit board traces

Wiring substrate and semiconductor device

Current sensors for power converters

Circuit board and preparation method thereof

High-performance capacitor packaging for next generation power elec...

Display device and electronic device having polarizer with conducti...

Printed circuit board configuration blocks and edge projections

Multi-level printed circuit boards and memory modules including the...

Broadside coupled radio frequency interconnect

Display device and manufacturing method thereof

Wetness pad assembly, system and method

Patents Applicationslast 30 patents

DISPLAY APPARATUS

WIRING CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...

CIRCUIT BOARD MODULE CAPABLE OF SUPPRESSING COMMON MODE NOISE

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

ELECTRONIC DEVICE INCLUDING ELECTRONIC COMPONENT SUB-MOUNT

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

FLEXIBLE CIRCUIT BOARD

ELECTROSTATIC DISCHARGE COLLECTOR

PRINTED CIRCUIT BOARD

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

SWITCHING POWER SUPPLY DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE

CONNECTOR STRUCTURES

DEVICE PANEL

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

Metal-ceramic substrate and method for producing a metal ceramic su...

THREE DIMENSIONAL CIRCUIT MOUNTING STRUCTURES

Earbud with Low Enoise

PRINTED WIRING BOARD

PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES

FLEXIBLE CIRCUIT BOARD AND ROTATING ELECTRICAL MACHINE

WEARABLE ELECTRONIC DEVICE COMPRISING RIGID FLEXIBLE PRINTED CIRCUI...

ELECTRONIC DEVICE

CIRCUIT MODULE

Circuit layout of printed circuit board