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last 30 patents
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Package structure and method of forming the same
Patent number
12,362,274
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of fabricating package structure including a plurality of an...
Patent number
12,362,275
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sen-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacture
Patent number
12,354,969
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip redistribution structure and preparation method thereof
Patent number
12,341,064
Issue date
Jun 24, 2025
CHIPMORE TECHNOLOGY CORPORATION LIMITED
Guanmeng Xu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure and method of forming the same
Patent number
12,334,434
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Tai
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with discrete blocks
Patent number
12,334,476
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing die stack structure
Patent number
12,322,728
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
12,315,842
Issue date
May 27, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package with improved interposer structure
Patent number
12,308,313
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device package including stress buffering layer
Patent number
12,300,677
Issue date
May 13, 2025
Advanced Semiconductor Engineering, Inc.
Chien-Mei Huang
H01 - BASIC ELECTRIC ELEMENTS
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Fan-out semiconductor package and electronic device including the same
Patent number
12,300,594
Issue date
May 13, 2025
Samsung Electronics Co., Ltd.
Sun Ho Kim
H01 - BASIC ELECTRIC ELEMENTS
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Photonic integrated package and method forming same
Patent number
12,283,492
Issue date
Apr 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Package structure and method of manufacturing the same
Patent number
12,283,545
Issue date
Apr 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor devices including recognition marks
Patent number
12,278,193
Issue date
Apr 15, 2025
SK hynix Inc.
Hyun Chul Seo
H01 - BASIC ELECTRIC ELEMENTS
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Package structure
Patent number
12,266,648
Issue date
Apr 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Sen-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package with thermal relaxation block and manufacturi...
Patent number
12,255,196
Issue date
Mar 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Method for fabricating semiconductor device with redistribution str...
Patent number
12,237,318
Issue date
Feb 25, 2025
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Face-to-face through-silicon via multi-chip semiconductor apparatus...
Patent number
12,237,245
Issue date
Feb 25, 2025
Altera Corporation
Loke Yip Foo
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package with improved interposer structure
Patent number
12,237,262
Issue date
Feb 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing a semiconductor device including a pluralit...
Patent number
12,218,051
Issue date
Feb 4, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Yuan Li
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with redistribution structure
Patent number
12,211,831
Issue date
Jan 28, 2025
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Sensor packages
Patent number
12,205,860
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Hsien Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device, circuit board structure and manufacturing met...
Patent number
12,205,923
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Tin-Hao Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Manufacturing method of circuit carrier with chip mounted thereon
Patent number
12,198,993
Issue date
Jan 14, 2025
Dyi-Chung Hu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacture
Patent number
12,191,251
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fan-out packages with warpage resistance
Patent number
12,183,675
Issue date
Dec 31, 2024
Advanced Micro Devices, Inc.
Rahul Agarwal
H01 - BASIC ELECTRIC ELEMENTS
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Method of fabricating redistribution circuit structure
Patent number
12,170,223
Issue date
Dec 17, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device packages and methods of manufacturing the same
Patent number
12,166,009
Issue date
Dec 10, 2024
Advanced Semiconductor Engineering, Inc.
Tang-Yuan Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor package and manufacturing method of semiconductor pac...
Patent number
12,166,015
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Method of fabricating a semiconductor device
Patent number
12,136,602
Issue date
Nov 5, 2024
Samsung Electronics Co., Ltd.
Ju-Il Choi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226317
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
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PHOTONIC INTEGRATED PACKAGE AND METHOD FORMING SAME
Publication number
20250218799
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR PREPARING THE SAME
Publication number
20250210554
Publication date
Jun 26, 2025
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
Publication number
20250210539
Publication date
Jun 26, 2025
SK HYNIX INC.
Hyun Chul SEO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20250210555
Publication date
Jun 26, 2025
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
Publication number
20250183245
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250167104
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Hao HSU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A PLURALIT...
Publication number
20250157922
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Yuan Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
Publication number
20250157956
Publication date
May 15, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Jin Young Kim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING MET...
Publication number
20250096198
Publication date
Mar 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Tin-Hao Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Publication number
20250096203
Publication date
Mar 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADING POINT OF DISCHARGE STRUCTURES FOR ELECTROSTATIC DISCHARGE P...
Publication number
20250079354
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Company Limited
Steven Sze Hang Poon
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Method of Fabricating Redistribution Circuit Structure
Publication number
20250069951
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
Publication number
20250054886
Publication date
Feb 13, 2025
TEXAS INSTRUMENTS INCORPORATED
Indumini W. Ranmuthu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20250022823
Publication date
Jan 16, 2025
Samsung Electronics Co., Ltd.
Ju-Il CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS...
Publication number
20250022774
Publication date
Jan 16, 2025
Altera Corporation
Loke Yip FOO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor structure and forming method thereof
Publication number
20250015023
Publication date
Jan 9, 2025
UNITED MICROELECTRONICS CORP.
Chiu-Jung Chiu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20250006676
Publication date
Jan 2, 2025
Samsung Electronics Co., Ltd.
Jinkyeong SEOL
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240395774
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING WIRED UNDER BUMP STRUCTURE AND METHOD T...
Publication number
20240395674
Publication date
Nov 28, 2024
NXP B.V.
Kuan-Hsiang Mao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATI...
Publication number
20240387498
Publication date
Nov 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240379543
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jen Hsu
G06 - COMPUTING CALCULATING COUNTING
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Patent Application
REDUCTION OF CRACKS IN PASSIVATION LAYER
Publication number
20240379593
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuo-An Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20240379538
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DIE STACKS AND METHODS FORMING SAME
Publication number
20240363590
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CIRCUIT PACKAGES HAVING MECHANICAL BRACE STANDOFFS
Publication number
20240363486
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yuan Sheng Chiu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE
Publication number
20240363533
Publication date
Oct 31, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hao Tsai
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20240355728
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Chun Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240332261
Publication date
Oct 3, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ching-Jung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240332268
Publication date
Oct 3, 2024
Samsung Electronics Co., Ltd.
Kyoung Lim SUK
H01 - BASIC ELECTRIC ELEMENTS