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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Igniter and engine ignition device
- Patent number 12,104,565
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Hiroyuki Tanigawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked chip structure
- Patent number 11,961,824
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Hyunggyun Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die stack having bent wires and vertical wires and a...
- Patent number 11,908,825
- Issue date Feb 20, 2024
- SK hynix Inc.
- Jeong Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,652,079
- Issue date May 16, 2023
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising wire bonds configured as a heat spreader
- Patent number 11,545,411
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,204
- Issue date Oct 11, 2022
- Sumitomo Electric Device Innovations, Inc.
- Akitada Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,342,276
- Issue date May 24, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 11,315,913
- Issue date Apr 26, 2022
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-interface IC card module
- Patent number 11,222,861
- Issue date Jan 11, 2022
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Backside metalization with through-wafer-via processing to allow us...
- Patent number 11,171,110
- Issue date Nov 9, 2021
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using wires and stacked semiconductor package
- Patent number 11,164,833
- Issue date Nov 2, 2021
- SK hynix Inc.
- Young Jo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple gate pads
- Patent number 11,004,841
- Issue date May 11, 2021
- Vishay SIliconix, LLC
- Chanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scan channel fabric for tiled circuit designs
- Patent number 10,990,739
- Issue date Apr 27, 2021
- Amazon Technologies, Inc.
- Dan Trock
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,971,436
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive chip package including shielding structure
- Patent number 10,923,650
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Jae-gwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic detection device, current detection device, method for man...
- Patent number 10,698,005
- Issue date Jun 30, 2020
- Asahi Kasei Microdevices Corporation
- Toshiaki Fukunaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,822
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring device
- Patent number 10,490,518
- Issue date Nov 26, 2019
- AZBIL CORPORATION
- Shinichi Ike
- G01 - MEASURING TESTING
Information Patent Grant
Dual-interface IC card module
- Patent number 10,461,057
- Issue date Oct 29, 2019
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light emitting device and method of manufacturing the light emittin...
- Patent number 10,431,572
- Issue date Oct 1, 2019
- Nichia Corporation
- Hiroaki Ukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,354,943
- Issue date Jul 16, 2019
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency power component and radio frequency signal transcei...
- Patent number 10,347,596
- Issue date Jul 9, 2019
- Huawei Technologies Co., Ltd.
- An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 10,283,489
- Issue date May 7, 2019
- Nichia Corporation
- Yasuhiko Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor photomultiplier
- Patent number 10,276,610
- Issue date Apr 30, 2019
- SensL Technologies Ltd.
- Brian McGarvey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 10,269,733
- Issue date Apr 23, 2019
- Realtek Semiconductor Corp.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead frame
- Patent number 10,262,929
- Issue date Apr 16, 2019
- Lapis Semiconductor Co., Ltd.
- Yuuki Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip with large and small...
- Patent number 10,236,269
- Issue date Mar 19, 2019
- ABLIC Inc.
- Makoto Takesawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LAYOUT STRUCTURE OF DIFFERENTIAL LINES, MEMORY STORAGE DEVICE AND M...
- Publication number 20240312949
- Publication date Sep 19, 2024
- PHISON ELECTRONICS CORP.
- Kang-Yun Yang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240222235
- Publication date Jul 4, 2024
- Fuji Electric Co., Ltd.
- Ryu ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240055391
- Publication date Feb 15, 2024
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE
- Publication number 20230230951
- Publication date Jul 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE
- Publication number 20230028943
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- HYUNGGYUN NOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...
- Publication number 20220392866
- Publication date Dec 8, 2022
- SK HYNIX INC.
- Jeong Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220293550
- Publication date Sep 15, 2022
- Sumitomo Electric Industries, Ltd.
- Shuichi NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220246542
- Publication date Aug 4, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER
- Publication number 20220037224
- Publication date Feb 3, 2022
- QUALCOMM Incorporated
- Wen YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...
- Publication number 20210366868
- Publication date Nov 25, 2021
- Skyworks Solutions, Inc.
- Bharatjeet Singh Gill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING WIRES AND STACKED SEMICONDUCTOR PACKAGE
- Publication number 20210104479
- Publication date Apr 8, 2021
- SK hynix Inc.
- Young Jo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE
- Publication number 20200020618
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Thomas STOEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-INTERFACE IC CARD MODULE
- Publication number 20190355693
- Publication date Nov 21, 2019
- NXP B.V.
- CHRISTIAN ZENZ
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS
- Publication number 20190237458
- Publication date Aug 1, 2019
- Vishay-Siliconix
- Chanho PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF...
- Publication number 20190157237
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Yong Je LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES
- Publication number 20190035761
- Publication date Jan 31, 2019
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASURING DEVICE
- Publication number 20190035751
- Publication date Jan 31, 2019
- AZBIL CORPORATION
- Shinichi Ike
- G01 - MEASURING TESTING
Information Patent Application
MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE
- Publication number 20180375017
- Publication date Dec 27, 2018
- Samsung Electronics Co., Ltd.
- Jae-gwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP WITH LARGE AND SMALL...
- Publication number 20180158792
- Publication date Jun 7, 2018
- SII Semiconductor Corporation
- Makoto TAKESAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSMITTER MODULE
- Publication number 20180143463
- Publication date May 24, 2018
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Young-Tak HAN
- G02 - OPTICS
Information Patent Application
LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE
- Publication number 20180102287
- Publication date Apr 12, 2018
- Nexperia B.V.
- EUGENE PUMANES SANTOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
- Publication number 20180090463
- Publication date Mar 29, 2018
- RENESAS ELECTRONICS CORPORATION
- Yukihiro SATOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...
- Publication number 20180005909
- Publication date Jan 4, 2018
- Micron Technology, Inc.
- David J. Corisis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CHIP ASSEMBLAGE
- Publication number 20170271298
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170256510
- Publication date Sep 7, 2017
- Shotaro MIYAWAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20170236791
- Publication date Aug 17, 2017
- Realtek Semiconductor Corp.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Igniter and engine ignition device

Semiconductor device

Semiconductor package including stacked chip structure

Semiconductor die stack having bent wires and vertical wires and a...

Semiconductor packages with pass-through clock traces and associate...

Backside metalization with through-wafer-via processing to allow us...

Package comprising wire bonds configured as a heat spreader

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Light emitting device and method of manufacturing the light emittin...

Dual-interface IC card module

Backside metalization with through-wafer-via processing to allow us...

Semiconductor device using wires and stacked semiconductor package

Multi-chip modules including stacked semiconductor dice

Semiconductor device having multiple gate pads

Scan channel fabric for tiled circuit designs

Multi-branch terminal for integrated circuit (IC) package

Magneto-resistive chip package including shielding structure

Magnetic detection device, current detection device, method for man...

Semiconductor device

Measuring device

Dual-interface IC card module

Light emitting device and method of manufacturing the light emittin...

Multi-branch terminal for integrated circuit (IC) package

Radio frequency power component and radio frequency signal transcei...

Light emitting device

Semiconductor photomultiplier

Integrated circuit device

Semiconductor device with lead frame

Semiconductor device having semiconductor chip with large and small...

Patents Applicationslast 30 patents

LAYOUT STRUCTURE OF DIFFERENTIAL LINES, MEMORY STORAGE DEVICE AND M...

SEMICONDUCTOR DEVICE

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

CIRCUIT MODULE

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIP STRUCTURE

SEMICONDUCTOR DIE STACK HAVING BENT WIRES AND VERTICAL WIRES AND A...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PACKAGE COMPRISING WIRE BONDS CONFIGURED AS A HEAT SPREADER

BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW US...

SEMICONDUCTOR DEVICE USING WIRES AND STACKED SEMICONDUCTOR PACKAGE

MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE

DUAL-INTERFACE IC CARD MODULE

SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS

SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF...

WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES

MEASURING DEVICE

MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP WITH LARGE AND SMALL...

OPTICAL TRANSMITTER MODULE

LEADFRAME-LESS SURFACE MOUNT SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHO...

METHOD FOR PRODUCING A CHIP ASSEMBLAGE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE