Lead partly inserted in hole or via

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CPC
H05K2201/10901

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10901Lead partly inserted in hole or via

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Cable assembly, signal transmission structure, and electronic device
- Patent number 12,114,425
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric compressor with inverter circuit section and filter circui...
- Patent number 11,936,251
- Issue date Mar 19, 2024
- SANDEN AUTOMOTIVE COMPONENTS CORPORATION
- Mikio Kobayashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic component
- Patent number 11,844,178
- Issue date Dec 12, 2023
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer copper bus bars with soldered through hole components
- Patent number 11,832,390
- Issue date Nov 28, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor storage device and heat dissipator
- Patent number 11,785,703
- Issue date Oct 10, 2023
- Kioxia Corporation
- Kazuya Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board connector footprint
- Patent number 11,729,898
- Issue date Aug 15, 2023
- TE CONNECTIVITY SOLUTIONS GmbH
- Justin Dennis Pickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotation operation device
- Patent number 11,599,135
- Issue date Mar 7, 2023
- Yamaha Corporation
- Ryuichi Izumi
- G05 - CONTROLLING REGULATING
Information Patent Grant
Mounting structure for heater element, method for mounting heater e...
- Patent number 11,574,852
- Issue date Feb 7, 2023
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting aid and method for mounting electrical components on a pri...
- Patent number 11,357,114
- Issue date Jun 7, 2022
- BorgWarner Ludwigsburg GmbH
- Sisay Tadele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical junction box and wire harness
- Patent number 11,304,301
- Issue date Apr 12, 2022
- Yazaki Corporation
- Keisuke Kimura
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Socket connector and connector assembly
- Patent number 11,108,200
- Issue date Aug 31, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Chenxi (Josh) Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for producing an electronic component
- Patent number 11,058,005
- Issue date Jul 6, 2021
- VITESCO TECHNOLOGIES GERMANY GMBH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,925,151
- Issue date Feb 16, 2021
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board manufacturing method
- Patent number 10,772,214
- Issue date Sep 8, 2020
- Toyota Jidosha Kabushiki Kaisha
- Masafumi Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,517,167
- Issue date Dec 24, 2019
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug-in contact and method for producing a plug-in contact
- Patent number 10,461,454
- Issue date Oct 29, 2019
- Phoenix Contact GmbH & Co. KG
- Ralf Geske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and a method of bonding electrode lead of bat...
- Patent number 10,342,134
- Issue date Jul 2, 2019
- LG Chem Ltd.
- Jin Oh Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device for an electronic device
- Patent number 10,212,816
- Issue date Feb 19, 2019
- APTIV TECHNOLOGIES LIMITED
- Matthias Rieke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered interconnect for a printed circuit board having an angular...
- Patent number 10,096,915
- Issue date Oct 9, 2018
- MERCURY SYSTEMS, INC.
- Darryl J. McKenney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable for alternative interconnect attachement
- Patent number 9,924,595
- Issue date Mar 20, 2018
- Intel Corporation
- Beom-Taek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch screen panel
- Patent number 9,891,733
- Issue date Feb 13, 2018
- Samsung Display Co., Ltd.
- Byeong Kyu Jeon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed circuit board structure
- Patent number 9,872,389
- Issue date Jan 16, 2018
- LG Display Co., Ltd.
- Ducksu Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic flexible substrate and method for manufacturing the same
- Patent number 9,699,893
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector for mounting on circuit board
- Patent number 7,708,590
- Issue date May 4, 2010
- Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
- Zhan-Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method of the same
- Patent number 7,677,905
- Issue date Mar 16, 2010
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 7,563,112
- Issue date Jul 21, 2009
- Denso Corporation
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 7,273,988
- Issue date Sep 25, 2007
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an electrical connection between a plug elemen...
- Patent number 6,898,847
- Issue date May 31, 2005
- Hella KG Hueck & Co.
- André Koerner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 6,878,884
- Issue date Apr 12, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a composite arrangement
- Patent number 5,925,210
- Issue date Jul 20, 1999
- Robert Bosch GmbH
- Walter Wagenbrenner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTOR PIN ALIGNMENT ASSEMBLY
- Publication number 20240215167
- Publication date Jun 27, 2024
- Garrett Transportation I Inc.
- Valeriy Fedorikhin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER MODULE
- Publication number 20240090114
- Publication date Mar 14, 2024
- LS ELECTRIC CO., LTD.
- Jae Moon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240040702
- Publication date Feb 1, 2024
- HITACHI,ASTEMO, LTD.
- Takeshi TOKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS
- Publication number 20230284387
- Publication date Sep 7, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...
- Publication number 20230274994
- Publication date Aug 31, 2023
- Valeo eAutomotive France SAS
- Aurelien POUILLY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising a Cavity with Exposed Contacts and...
- Publication number 20230093341
- Publication date Mar 23, 2023
- Infineon Technologies Austria AG
- Julian Treu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MODULE AND POWER MODULE FOR TRANSFORMER
- Publication number 20230040151
- Publication date Feb 9, 2023
- LG Innotek Co., Ltd.
- Soo San KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cable Assembly, Signal Transmission Structure, and Electronic Device
- Publication number 20230007773
- Publication date Jan 5, 2023
- Huawei Technologies Co., Ltd
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND HEAT DISSIPATOR
- Publication number 20220304137
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Kazuya NAGASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20210378098
- Publication date Dec 2, 2021
- Analog Devices International Unlimited Company
- John Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...
- Publication number 20210327784
- Publication date Oct 21, 2021
- Fuji Electric Co., Ltd.
- Shun FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
- Publication number 20200154577
- Publication date May 14, 2020
- Toyota Jidosha Kabushiki Kaisha
- Masafumi MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...
- Publication number 20200146139
- Publication date May 7, 2020
- Eagle Technology, LLC
- Michael T. DeRoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
- Publication number 20200100364
- Publication date Mar 26, 2020
- Vitesco Technologies Germany GmbH
- Helmut Karrer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
- Publication number 20190380206
- Publication date Dec 12, 2019
- YAZAKI CORPORATION
- Keisuke Kimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLUG-IN CONTACT AND METHOD FOR PRODUCING A PLUG-IN CONTACT
- Publication number 20180331447
- Publication date Nov 15, 2018
- Phoenix Contact GmbH & Co. KG
- Ralf GESKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED OUTPUT STRUCTURE OF CAPACITIVE POWER SUPPLY FOR WELDING EQU...
- Publication number 20180310409
- Publication date Oct 25, 2018
- BOSJOB COMPANY LTD.
- Liang-huan WENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND A METHOD OF BONDING ELECTRODE LEAD OF BAT...
- Publication number 20180242454
- Publication date Aug 23, 2018
- LG CHEM, LTD.
- Jin Oh Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURE
- Publication number 20160150646
- Publication date May 26, 2016
- LG CHEM, LTD.
- Ducksu OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS
- Publication number 20160021747
- Publication date Jan 21, 2016
- DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.
- KIN YEAN CHOW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR
- Publication number 20150373848
- Publication date Dec 24, 2015
- Samsung Electronics Co., Ltd.
- Jong-hyun SEOK
- G11 - INFORMATION STORAGE
Information Patent Application
ELASTIC FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150282295
- Publication date Oct 1, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- TAKASHI MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090212444
- Publication date Aug 27, 2009
- Industrial Technology Research Institute
- Li-Cheng Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rugged Chip Packaging
- Publication number 20080280463
- Publication date Nov 13, 2008
- MERCURY COMPUTER SYSTEMS, INC.
- Darryl J. McKenney
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic device
- Publication number 20080144260
- Publication date Jun 19, 2008
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method of the same
- Publication number 20080146051
- Publication date Jun 19, 2008
- DENSO CORPORATION
- Takayoshi Honda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050230147
- Publication date Oct 20, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050146019
- Publication date Jul 7, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20030196831
- Publication date Oct 23, 2003
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing an electrical connection between a plug elemen...
- Publication number 20030024114
- Publication date Feb 6, 2003
- Andre Koerner
- H01 - BASIC ELECTRIC ELEMENTS

Lead partly inserted in hole or via

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cable assembly, signal transmission structure, and electronic device

Electric compressor with inverter circuit section and filter circui...

Electronic component

Multilayer copper bus bars with soldered through hole components

Semiconductor storage device and heat dissipator

Circuit board connector footprint

Rotation operation device

Mounting structure for heater element, method for mounting heater e...

Mounting aid and method for mounting electrical components on a pri...

Electrical junction box and wire harness

Socket connector and connector assembly

Electronic component and method for producing an electronic component

Systems and methods for providing a high speed interconnect system...

Circuit board manufacturing method

Systems and methods for providing a high speed interconnect system...

Plug-in contact and method for producing a plug-in contact

Printed circuit board and a method of bonding electrode lead of bat...

Heat dissipation device for an electronic device

Soldered interconnect for a printed circuit board having an angular...

Cable for alternative interconnect attachement

Touch screen panel

Flexible printed circuit board structure

Elastic flexible substrate and method for manufacturing the same

Electrical connector for mounting on circuit board

Electronic device and manufacturing method of the same

Electronic device

Wiring board, and electronic device with an electronic part mounted...

Method for producing an electrical connection between a plug elemen...

Wiring board, and electronic device with an electronic part mounted...

Method for manufacturing a composite arrangement

Patents Applicationslast 30 patents

TRANSISTOR PIN ALIGNMENT ASSEMBLY

INVERTER MODULE

POWER SEMICONDUCTOR DEVICE

MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS

POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...

Semiconductor Package Comprising a Cavity with Exposed Contacts and...

SUBSTRATE MODULE AND POWER MODULE FOR TRANSFORMER

Cable Assembly, Signal Transmission Structure, and Electronic Device

SEMICONDUCTOR STORAGE DEVICE AND HEAT DISSIPATOR

ELECTRONIC COMPONENT

MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...

CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD

SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT

ELECTRICAL JUNCTION BOX AND WIRE HARNESS

PLUG-IN CONTACT AND METHOD FOR PRODUCING A PLUG-IN CONTACT

STACKED OUTPUT STRUCTURE OF CAPACITIVE POWER SUPPLY FOR WELDING EQU...

PRINTED CIRCUIT BOARD AND A METHOD OF BONDING ELECTRODE LEAD OF BAT...

FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURE

LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS

SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR

ELASTIC FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Rugged Chip Packaging

Electronic device

Electronic device and manufacturing method of the same

Wiring board, and electronic device with an electronic part mounted...

Wiring board, and electronic device with an electronic part mounted...

Wiring board, and electronic device with an electronic part mounted...

Method for producing an electrical connection between a plug elemen...