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H05K2201/10901
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
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H05K2201/10901
Lead partly inserted in hole or via
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Patents Grants
last 30 patents
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Patent Grant
Electric compressor with inverter circuit section and filter circui...
Patent number
11,936,251
Issue date
Mar 19, 2024
SANDEN AUTOMOTIVE COMPONENTS CORPORATION
Mikio Kobayashi
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Electronic component
Patent number
11,844,178
Issue date
Dec 12, 2023
Analog Devices International Unlimited Company
John David Brazzle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer copper bus bars with soldered through hole components
Patent number
11,832,390
Issue date
Nov 28, 2023
Rolls-Royce Corporation
Shuai Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor storage device and heat dissipator
Patent number
11,785,703
Issue date
Oct 10, 2023
Kioxia Corporation
Kazuya Nagasawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board connector footprint
Patent number
11,729,898
Issue date
Aug 15, 2023
TE CONNECTIVITY SOLUTIONS GmbH
Justin Dennis Pickel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rotation operation device
Patent number
11,599,135
Issue date
Mar 7, 2023
Yamaha Corporation
Ryuichi Izumi
G05 - CONTROLLING REGULATING
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Patent Grant
Mounting structure for heater element, method for mounting heater e...
Patent number
11,574,852
Issue date
Feb 7, 2023
Fuji Electric Co., Ltd.
Shun Fukuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mounting aid and method for mounting electrical components on a pri...
Patent number
11,357,114
Issue date
Jun 7, 2022
BorgWarner Ludwigsburg GmbH
Sisay Tadele
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical junction box and wire harness
Patent number
11,304,301
Issue date
Apr 12, 2022
Yazaki Corporation
Keisuke Kimura
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Socket connector and connector assembly
Patent number
11,108,200
Issue date
Aug 31, 2021
Tyco Electronics (Shanghai) Co. Ltd.
Chenxi (Josh) Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component and method for producing an electronic component
Patent number
11,058,005
Issue date
Jul 6, 2021
VITESCO TECHNOLOGIES GERMANY GMBH
Helmut Karrer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Systems and methods for providing a high speed interconnect system...
Patent number
10,925,151
Issue date
Feb 16, 2021
Eagle Technology, LLC
Michael T. DeRoy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board manufacturing method
Patent number
10,772,214
Issue date
Sep 8, 2020
Toyota Jidosha Kabushiki Kaisha
Masafumi Momose
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Systems and methods for providing a high speed interconnect system...
Patent number
10,517,167
Issue date
Dec 24, 2019
Eagle Technology, LLC
Michael T. DeRoy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plug-in contact and method for producing a plug-in contact
Patent number
10,461,454
Issue date
Oct 29, 2019
Phoenix Contact GmbH & Co. KG
Ralf Geske
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed circuit board and a method of bonding electrode lead of bat...
Patent number
10,342,134
Issue date
Jul 2, 2019
LG Chem Ltd.
Jin Oh Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat dissipation device for an electronic device
Patent number
10,212,816
Issue date
Feb 19, 2019
APTIV TECHNOLOGIES LIMITED
Matthias Rieke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Soldered interconnect for a printed circuit board having an angular...
Patent number
10,096,915
Issue date
Oct 9, 2018
MERCURY SYSTEMS, INC.
Darryl J. McKenney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cable for alternative interconnect attachement
Patent number
9,924,595
Issue date
Mar 20, 2018
Intel Corporation
Beom-Taek Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Touch screen panel
Patent number
9,891,733
Issue date
Feb 13, 2018
Samsung Display Co., Ltd.
Byeong Kyu Jeon
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Flexible printed circuit board structure
Patent number
9,872,389
Issue date
Jan 16, 2018
LG Display Co., Ltd.
Ducksu Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Elastic flexible substrate and method for manufacturing the same
Patent number
9,699,893
Issue date
Jul 4, 2017
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Takashi Matsumoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrical connector for mounting on circuit board
Patent number
7,708,590
Issue date
May 4, 2010
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.
Zhan-Yang Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device and manufacturing method of the same
Patent number
7,677,905
Issue date
Mar 16, 2010
Denso Corporation
Takayoshi Honda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device
Patent number
7,563,112
Issue date
Jul 21, 2009
Denso Corporation
Takayoshi Honda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board, and electronic device with an electronic part mounted...
Patent number
7,273,988
Issue date
Sep 25, 2007
NEC Corporation
Yuki Momokawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing an electrical connection between a plug elemen...
Patent number
6,898,847
Issue date
May 31, 2005
Hella KG Hueck & Co.
André Koerner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring board, and electronic device with an electronic part mounted...
Patent number
6,878,884
Issue date
Apr 12, 2005
NEC Corporation
Yuki Momokawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing a composite arrangement
Patent number
5,925,210
Issue date
Jul 20, 1999
Robert Bosch GmbH
Walter Wagenbrenner
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board with through-hole connection
Patent number
4,787,853
Issue date
Nov 29, 1988
Kabushiki Kaisha Toshiba
Yutaka Igarashi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
INVERTER MODULE
Publication number
20240090114
Publication date
Mar 14, 2024
LS ELECTRIC CO., LTD.
Jae Moon LEE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER SEMICONDUCTOR DEVICE
Publication number
20240040702
Publication date
Feb 1, 2024
HITACHI,ASTEMO, LTD.
Takeshi TOKUYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER COPPER BUS BARS WITH SOLDERED THROUGH HOLE COMPONENTS
Publication number
20230284387
Publication date
Sep 7, 2023
Rolls-Royce Corporation
Shuai Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER ELECTRONICS MODULE, ELECTRICAL SYSTEM HAVING SUCH A MODULE, C...
Publication number
20230274994
Publication date
Aug 31, 2023
Valeo eAutomotive France SAS
Aurelien POUILLY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Comprising a Cavity with Exposed Contacts and...
Publication number
20230093341
Publication date
Mar 23, 2023
Infineon Technologies Austria AG
Julian Treu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE MODULE AND POWER MODULE FOR TRANSFORMER
Publication number
20230040151
Publication date
Feb 9, 2023
LG Innotek Co., Ltd.
Soo San KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Cable Assembly, Signal Transmission Structure, and Electronic Device
Publication number
20230007773
Publication date
Jan 5, 2023
Huawei Technologies Co., Ltd
Guodong Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR STORAGE DEVICE AND HEAT DISSIPATOR
Publication number
20220304137
Publication date
Sep 22, 2022
KIOXIA Corporation
Kazuya NAGASAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT
Publication number
20210378098
Publication date
Dec 2, 2021
Analog Devices International Unlimited Company
John Brazzle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING STRUCTURE FOR HEATER ELEMENT, METHOD FOR MOUNTING HEATER E...
Publication number
20210327784
Publication date
Oct 21, 2021
Fuji Electric Co., Ltd.
Shun FUKUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD
Publication number
20200154577
Publication date
May 14, 2020
Toyota Jidosha Kabushiki Kaisha
Masafumi MOMOSE
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...
Publication number
20200146139
Publication date
May 7, 2020
Eagle Technology, LLC
Michael T. DeRoy
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
Publication number
20200100364
Publication date
Mar 26, 2020
Vitesco Technologies Germany GmbH
Helmut Karrer
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRICAL JUNCTION BOX AND WIRE HARNESS
Publication number
20190380206
Publication date
Dec 12, 2019
YAZAKI CORPORATION
Keisuke Kimura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PLUG-IN CONTACT AND METHOD FOR PRODUCING A PLUG-IN CONTACT
Publication number
20180331447
Publication date
Nov 15, 2018
Phoenix Contact GmbH & Co. KG
Ralf GESKE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STACKED OUTPUT STRUCTURE OF CAPACITIVE POWER SUPPLY FOR WELDING EQU...
Publication number
20180310409
Publication date
Oct 25, 2018
BOSJOB COMPANY LTD.
Liang-huan WENG
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND A METHOD OF BONDING ELECTRODE LEAD OF BAT...
Publication number
20180242454
Publication date
Aug 23, 2018
LG CHEM, LTD.
Jin Oh Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD STRUCTURE
Publication number
20160150646
Publication date
May 26, 2016
LG CHEM, LTD.
Ducksu OH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LASER WELDING OF THRU-HOLE ELECTRICAL COMPONENTS
Publication number
20160021747
Publication date
Jan 21, 2016
DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.
KIN YEAN CHOW
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR MODULE HAVING A TAB PIN WITH NO TIE BAR
Publication number
20150373848
Publication date
Dec 24, 2015
Samsung Electronics Co., Ltd.
Jong-hyun SEOK
G11 - INFORMATION STORAGE
Information
Patent Application
ELASTIC FLEXIBLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20150282295
Publication date
Oct 1, 2015
Panasonic Intellectual Property Management Co., Ltd.
TAKASHI MATSUMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20090212444
Publication date
Aug 27, 2009
Industrial Technology Research Institute
Li-Cheng Shen
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Rugged Chip Packaging
Publication number
20080280463
Publication date
Nov 13, 2008
MERCURY COMPUTER SYSTEMS, INC.
Darryl J. McKenney
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Electronic device
Publication number
20080144260
Publication date
Jun 19, 2008
DENSO CORPORATION
Takayoshi Honda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electronic device and manufacturing method of the same
Publication number
20080146051
Publication date
Jun 19, 2008
DENSO CORPORATION
Takayoshi Honda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring board, and electronic device with an electronic part mounted...
Publication number
20050230147
Publication date
Oct 20, 2005
NEC Corporation
Yuki Momokawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring board, and electronic device with an electronic part mounted...
Publication number
20050146019
Publication date
Jul 7, 2005
NEC Corporation
Yuki Momokawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring board, and electronic device with an electronic part mounted...
Publication number
20030196831
Publication date
Oct 23, 2003
NEC Corporation
Yuki Momokawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for producing an electrical connection between a plug elemen...
Publication number
20030024114
Publication date
Feb 6, 2003
Andre Koerner
H01 - BASIC ELECTRIC ELEMENTS