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Lead [Pb] as principal constituent
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CPC
H01L2224/13216
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13216
Lead [Pb] as principal constituent
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Patents Grants
last 30 patents
Information
Patent Grant
Lead free solder columns and methods for making same
Patent number
10,937,752
Issue date
Mar 2, 2021
TOPLINE CORPORATION
Martin B. Hart
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package on package structure and method of manufacturing the same
Patent number
9,230,935
Issue date
Jan 5, 2016
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Cheng Lin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Solder and electrically conductive adhesive based interconnection f...
Patent number
8,592,299
Issue date
Nov 26, 2013
Endicott Interconnect Technologies, Inc.
Voya R. Markovich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
Patent number
7,528,006
Issue date
May 5, 2009
Intel Corporation
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20140159233
Publication date
Jun 12, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit die containing particale-filled through-silicon...
Publication number
20100193952
Publication date
Aug 5, 2010
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit die containing particle-filled through-silicon m...
Publication number
20070001266
Publication date
Jan 4, 2007
Leonel Arana
H01 - BASIC ELECTRIC ELEMENTS