Lead [Pb] as principal constituent

Industry

CPC
H01L2224/13616

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13616Lead [Pb] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,127,705
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer lid wafer-level package with an electrically and thermally...
- Patent number 10,804,875
- Issue date Oct 13, 2020
- Avago Technologies International Sales Pte. Limited
- Stephen Roy Gilbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,720,360
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,510,605
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,381,312
- Issue date Aug 13, 2019
- Nepes Co., Ltd.
- Il-Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,115,689
- Issue date Oct 30, 2018
- TOSHIBA MEMORY CORPORATION
- Taku Kamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visibility event navigation method and system
- Patent number 9,916,763
- Issue date Mar 13, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. Jenkins
- G05 - CONTROLLING REGULATING
Information Patent Grant
Interconnection structure including a metal post encapsulated by so...
- Patent number 9,806,045
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,728,527
- Issue date Aug 8, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure comprising fine pitch backside metal redistr...
- Patent number 9,716,066
- Issue date Jul 25, 2017
- Intel Corporation
- Kevin J. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 9,620,469
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 9,583,456
- Issue date Feb 28, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal coating for indium bump bonding
- Patent number 9,190,377
- Issue date Nov 17, 2015
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including through-silicon-vias having in...
- Patent number 8,987,869
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, method for manufacturing the same, and mount...
- Patent number 8,330,271
- Issue date Dec 11, 2012
- Kyocera Corporation
- Kenichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallurgy structure and wafer structure using the same...
- Patent number 7,800,240
- Issue date Sep 21, 2010
- Advanced Semiconductor Engineering, Inc.
- Jui-I Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL PADS
- Publication number 20240088072
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Tsung Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384377
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...
- Publication number 20220293543
- Publication date Sep 15, 2022
- DIC CORPORATION
- Ryota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device and Displayer
- Publication number 20220231206
- Publication date Jul 21, 2022
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20200350209
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200227368
- Publication date Jul 16, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- TUNG-JIUN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mechanisms for Forming Post-Passivation Interconnect Structure
- Publication number 20190326241
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20190236964
- Publication date Aug 1, 2019
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY...
- Publication number 20190103852
- Publication date Apr 4, 2019
- Avago Technologies General IP (Singapore) PTE. LTD.
- Stephen Roy Gilbert
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20180330991
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20180268724
- Publication date Sep 20, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G08 - SIGNALLING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180233468
- Publication date Aug 16, 2018
- Toshiba Memory Corporation
- Taku KAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061798
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20180033695
- Publication date Feb 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20170338204
- Publication date Nov 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170330839
- Publication date Nov 16, 2017
- NEPES CO., LTD.
- Il-Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20170053883
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20160233188
- Publication date Aug 11, 2016
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING THROUGH-SILICON-VIAS HAVING IN...
- Publication number 20130175673
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...
- Publication number 20130043573
- Publication date Feb 21, 2013
- Advanced Analogic Technologies (Hong Kong) Limited
- Richard K. Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Lead [Pb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Multiple plated via arrays of different wire heights on a same subs...

Methods of manufacturing a semiconductor device including a joint a...

Semiconductor die singulation and structures formed thereby

Mechanisms for forming post-passivation interconnect structure

Semiconductor structure and manufacturing method thereof

Interconnection structure including a metal post encapsulated by a...

Polymer lid wafer-level package with an electrically and thermally...

Semiconductor die singulation and structures formed thereby

Multiple plated via arrays of different wire heights on same substrate

Semiconductor die singulation and structures formed thereby

Semiconductor package and method of manufacturing the same

Mechanisms for forming post-passivation interconnect structure

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor device and method for manufacturing the same

Visibility event navigation method and system

Interconnection structure including a metal post encapsulated by so...

Semiconductor device and method of forming bump structure with insu...

Multiple bond via arrays of different wire heights on a same substrate

Interconnect structure comprising fine pitch backside metal redistr...

Semiconductor packages

Bump electrode, board which has bump electrodes, and method for man...

Mechanisms for forming post-passivation interconnect structure

Multiple bond via arrays of different wire heights on a same substrate

Flip-chip assembly process comprising pre-coating interconnect elem...

Metal coating for indium bump bonding

Integrated circuit devices including through-silicon-vias having in...

Semiconductor device and method of forming bump structure with insu...

Semiconductor element, method for manufacturing the same, and mount...

Under bump metallurgy structure and wafer structure using the same...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

EMBEDDED METAL PADS

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...

Light-Emitting Device and Displayer

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Device and Method for UBM/RDL Routing

Semiconductor Die Singulation and Structures Formed Thereby

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Device and Method for UBM/RDL Routing

Mechanisms for Forming Post-Passivation Interconnect Structure

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY...

Semiconductor Die Singulation and Structures Formed Thereby

Multiple bond via arrays of different wire heights on a same substrate

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Die Singulation and Structures Formed Thereby

Device and Method for UBM/RDL Routing

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE

Contact bumps methods of making contact bumps

Semiconductor Device and Method of Forming Bump Structure with Insu...

INTEGRATED CIRCUIT DEVICES INCLUDING THROUGH-SILICON-VIAS HAVING IN...

Solder Bump Bonding In Semiconductor Package Using Solder Balls Hav...

SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Forming Bump Structure with Insu...