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Lead [Pb] as principal constituent
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CPC
H01L2224/37616
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/37616
Lead [Pb] as principal constituent
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Patents Grants
last 30 patents
Information
Patent Grant
Connection member with bulk body and electrically and thermally con...
Patent number
10,366,946
Issue date
Jul 30, 2019
Infineon Technologies AG
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Connection member with bulk body and electrically and thermally con...
Publication number
20190131218
Publication date
May 2, 2019
INFINEON TECHNOLOGIES AG
Wu Hu LI
H01 - BASIC ELECTRIC ELEMENTS