Lead (Pb) as principal constituent

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H01L2224/48616

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48616Lead (Pb) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and methods of manufacturing the same
- Patent number 8,952,549
- Issue date Feb 10, 2015
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked structure
- Patent number 8,487,452
- Issue date Jul 16, 2013
- Samsung Electronics Co., Ltd.
- Jin-Yang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure enhancing molding compound bondability
- Patent number 8,476,746
- Issue date Jul 2, 2013
- Kun Yuan Technology Co., Ltd.
- Cheng-Yu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, wiring of semiconductor device, and method of...
- Patent number 7,642,653
- Issue date Jan 5, 2010
- Denso Corporation
- Takeshi Kuzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices having metallurgies containing copper-semiconduc...
- Patent number 5,855,993
- Issue date Jan 5, 1999
- International Business Machines Corporation
- Michael John Brady
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20130200514
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Doojin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
- Publication number 20120018892
- Publication date Jan 26, 2012
- MEHDI FREDERIK SOLTAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE
- Publication number 20120001347
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Jin-Yang LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe enhancing molding compound bondability and package struct...
- Publication number 20110266662
- Publication date Nov 3, 2011
- Kun Yuan Technology Co., Ltd.
- Cheng-Yu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Semiconductor Package
- Publication number 20090189261
- Publication date Jul 30, 2009
- Lay Yeap Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080116591
- Publication date May 22, 2008
- Nichia Corporation.
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, wiring of semiconductor device, and method of...
- Publication number 20080105947
- Publication date May 8, 2008
- DENSO CORPORATION
- Takeshi Kuzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS

Lead (Pb) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and methods of manufacturing the same

Semiconductor package having a stacked structure

Package structure enhancing molding compound bondability

Semiconductor device and method for manufacturing same

Semiconductor device including an insulating film and insulating pi...

Semiconductor device, wiring of semiconductor device, and method of...

Semiconductor device with improved bonding

Electronic devices having metallurgies containing copper-semiconduc...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

SEMICONDUCTOR PACKAGE HAVING A STACKED STRUCTURE

Leadframe enhancing molding compound bondability and package struct...

Ultra-Thin Semiconductor Package

Semiconductor device and manufacturing method of semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device, wiring of semiconductor device, and method of...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and manufacturing method of semiconductor device