Lead [Pb] as principal constituent

Industry

CPC
H01L2224/05116

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05116Lead [Pb] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,813
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 11,521,892
- Issue date Dec 6, 2022
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer
- Patent number 11,476,125
- Issue date Oct 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,101,229
- Issue date Aug 24, 2021
- NANYA TECHNOLOGY CORPORATION
- Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with carrier construction configuration a...
- Patent number 10,679,954
- Issue date Jun 9, 2020
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making multi-die package with bridge layer
- Patent number 10,643,861
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip embedding package with solderable electric contact
- Patent number 10,229,891
- Issue date Mar 12, 2019
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 10,032,697
- Issue date Jul 24, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,966,322
- Issue date May 8, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hisao Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 9,929,117
- Issue date Mar 27, 2018
- SAMSUNG ELECTRO-MACHANICS CO., LTD.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 9,859,243
- Issue date Jan 2, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 9,831,203
- Issue date Nov 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method of manufacturing the same
- Patent number 9,825,003
- Issue date Nov 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Seob Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor, fluxing agent, manufacturing method for...
- Patent number 9,803,111
- Issue date Oct 31, 2017
- Hitachi Chemical Company, Ltd.
- Kazutaka Honda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 9,754,893
- Issue date Sep 5, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jingxiu Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with bridge layer and method for making the same
- Patent number 9,640,521
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chromium/titanium/aluminum-based semiconductor device contact fabri...
- Patent number 9,514,947
- Issue date Dec 6, 2016
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,355,937
- Issue date May 31, 2016
- Mitsubishi Electric Corporation
- Hidetoshi Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure with underbump metallization structure and integrate...
- Patent number 9,190,373
- Issue date Nov 17, 2015
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a chromium/titanium/aluminum-based semicondu...
- Patent number 9,064,845
- Issue date Jun 23, 2015
- Sensor Electronic Technology, Inc.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip heat spreader
- Patent number 8,779,572
- Issue date Jul 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring in an integrated circuit die
- Patent number 8,742,583
- Issue date Jun 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for marking the orientation of a sawed die
- Patent number 8,710,630
- Issue date Apr 29, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip heat spreader
- Patent number 8,609,506
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip heat spreader
- Patent number 8,314,483
- Issue date Nov 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming seal ring in an integrated circuit die
- Patent number 8,168,529
- Issue date May 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005866
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20210288007
- Publication date Sep 16, 2021
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210082843
- Publication date Mar 18, 2021
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Making Multi-Die Package With Bridge Layer
- Publication number 20200266074
- Publication date Aug 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...
- Publication number 20180374809
- Publication date Dec 27, 2018
- EoPlex Limited
- David G. Love
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170358548
- Publication date Dec 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip embedding package with solderable electric contact
- Publication number 20170250152
- Publication date Aug 31, 2017
- INFINEON TECHNOLOGIES AG
- Thorsten SCHARF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170250137
- Publication date Aug 31, 2017
- Kabushiki Kaisha Toshiba
- Koji ARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170162527
- Publication date Jun 8, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170141063
- Publication date May 18, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170133293
- Publication date May 11, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Seob OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160093601
- Publication date Mar 31, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- JINGXIU DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chromium/Titanium/Aluminum-based Semiconductor Device Contact
- Publication number 20140308766
- Publication date Oct 16, 2014
- SENSOR ELECTRONIC TECHNOLOGY, INC.
- Remigijus Gaska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Heat Spreader
- Publication number 20140054761
- Publication date Feb 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Heat Spreader
- Publication number 20130078765
- Publication date Mar 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR MARKING THE ORIENTATION OF A SAWED DIE
- Publication number 20130015561
- Publication date Jan 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Metal for Hybridization and Related Methods
- Publication number 20120273951
- Publication date Nov 1, 2012
- Raytheon Company
- Jonathan Getty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring in an Integrated Circuit Die
- Publication number 20120112322
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120049356
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Seal Ring in an Integrated Circuit Die
- Publication number 20100187671
- Publication date Jul 29, 2010
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
On-Chip Heat Spreader
- Publication number 20100187670
- Publication date Jul 29, 2010
- Chuan-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION
- Publication number 20080067072
- Publication date Mar 20, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for depositing alloy composition
- Publication number 20080041727
- Publication date Feb 21, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor chip having bond pads
- Publication number 20070108562
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS
- Publication number 20070108633
- Publication date May 17, 2007
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS
- Publication number 20070108632
- Publication date May 17, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE
- Publication number 20070057367
- Publication date Mar 15, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE
- Publication number 20070057383
- Publication date Mar 15, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070037337
- Publication date Feb 15, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Lead [Pb] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Method for fabricating a semiconductor device

Multi-die package with bridge layer

Semiconductor device and method for fabricating the same

Integrated circuit system with carrier construction configuration a...

Methods for making multi-die package with bridge layer

Interconnect structures for assembly of semiconductor structures in...

Interconnect structure and semiconductor structures for assembly of...

Chip embedding package with solderable electric contact

Interconnect structures and methods for fabricating interconnect st...

Electronic component package and electronic device including the same

Semiconductor device

Electronic component package and electronic device including the same

Electronic component package and electronic device including the same

Electronic component package and electronic device including the same

Electronic component package and method of manufacturing the same

Adhesive for semiconductor, fluxing agent, manufacturing method for...

Semiconductor structure and fabrication method thereof

Multi-die package with bridge layer and method for making the same

Chromium/titanium/aluminum-based semiconductor device contact fabri...

Semiconductor device

Bump structure with underbump metallization structure and integrate...

Power semiconductor devices

Methods of fabricating a chromium/titanium/aluminum-based semicondu...

On-chip heat spreader

Seal ring in an integrated circuit die

Mechanisms for marking the orientation of a sawed die

On-chip heat spreader

On-chip heat spreader

Forming seal ring in an integrated circuit die

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Methods for Making Multi-Die Package With Bridge Layer

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION A...

ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

Chip embedding package with solderable electric contact

SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Chromium/Titanium/Aluminum-based Semiconductor Device Contact

POWER SEMICONDUCTOR DEVICES

On-Chip Heat Spreader

On-Chip Heat Spreader

MECHANISMS FOR MARKING THE ORIENTATION OF A SAWED DIE

Contact Metal for Hybridization and Related Methods

Seal Ring in an Integrated Circuit Die

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Forming Seal Ring in an Integrated Circuit Die

On-Chip Heat Spreader

METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION

Method and system for depositing alloy composition

Semiconductor chip having bond pads

SEMICONDUCTOR CHIP HAVING BOND PADS

SEMICONDUCTOR CHIP HAVING BOND PADS

SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE

SEMICONDUCTOR CHIP HAVING BOND PADS AND MULTI-CHIP PACKAGE

Manufacturing method of semiconductor device