Lead [Pb] as principal constituent

Follow

Industry

CPC
H01L2224/29416

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29416Lead [Pb] as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Anisotropic conductive film including conductive adhesive layer and...
- Patent number 9,490,228
- Issue date Nov 8, 2016
- Cheil Industries, Inc.
- Kyoung Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection device, method for manufacturing connection structure, m...
- Patent number 9,196,599
- Issue date Nov 24, 2015
- Dexerials Corporation
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including thermal comp...
- Patent number 9,171,820
- Issue date Oct 27, 2015
- Cheil Industries, Inc.
- Kil Yong Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating coated powder materials and their use for hig...
- Patent number 6,059,952
- Issue date May 9, 2000
- International Business Machines Corporation
- Sung Kwon Kang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of producing connection electrodes
- Patent number 5,034,245
- Issue date Jul 23, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF MANUFACTURE
- Publication number 20220246510
- Publication date Aug 4, 2022
- HYPERTAC S.P.A.
- Alessandro Bosca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, M...
- Publication number 20140302643
- Publication date Oct 9, 2014
- Takayuki Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179065
- Publication date Jun 26, 2014
- Kil Yong LEE
- G02 - OPTICS