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Lead [Pb] as principal constituent
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CPC
H01L2224/80416
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80416
Lead [Pb] as principal constituent
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Patent Application
CHIP-TO-CHIP STACKING BY USE OF NICKEL TIN METALLIZATION STACKS AND...
Publication number
20240304600
Publication date
Sep 12, 2024
Infineon Technologies Austria AG
Shalini Jakanadan
H01 - BASIC ELECTRIC ELEMENTS