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SEMICONDUCTOR PACKAGE
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Publication number 20240096819
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Publication date Mar 21, 2024
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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THICK REDISTRIBUTION LAYER FEATURES
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Publication number 20240088074
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chia-Feng Cheng
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240079313
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Publication date Mar 7, 2024
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Samsung Electronics Co., Ltd.
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Kyuhyeon CHOI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240014166
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Publication date Jan 11, 2024
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Samsung Electronics Co., Ltd.
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Youngdeuk KIM
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230402424
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Publication date Dec 14, 2023
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Samsung Electronics Co., Ltd.
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Yongjin Park
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20230352460
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Publication date Nov 2, 2023
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Samsung Electronics Co., Ltd.
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Eunsu LEE
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H01 - BASIC ELECTRIC ELEMENTS
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FLIP CHIP PACKAGE ASSEMBLY
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Publication number 20230317658
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Publication date Oct 5, 2023
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TEXAS INSTRUMENTS INCORPORATED
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Rafael Jose Lizares Guevara
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication date Jul 6, 2023
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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