Lead telluride [PbTe]

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CPC
H01L2924/10523

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/10523Lead telluride [PbTe]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 9,165,914
- Issue date Oct 20, 2015
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 8,466,559
- Issue date Jun 18, 2013
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20140213017
- Publication date Jul 31, 2014
- Samsung Electronics Co., Ltd.
- Jong-Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
- Publication number 20130252376
- Publication date Sep 26, 2013
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING DIE BACKSIDE COATING STRUCTURES WITH CORELESS PACKAGES
- Publication number 20120153494
- Publication date Jun 21, 2012
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS