Leaded components

Industry

CPC
H05K3/3421

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3421Leaded components

Industries

Patents Grantslast 30 patents

Information Patent Grant
IC die, probe and ultrasound system
- Patent number 12,128,443
- Issue date Oct 29, 2024
- Koninklijke Philips N.V.
- Wojtek Sudol
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 12,082,350
- Issue date Sep 3, 2024
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly process using multiple solders and a...
- Patent number 12,035,483
- Issue date Jul 9, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mechanically bridged SMD interconnects for electronic devices
- Patent number 11,744,020
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical apparatus having tin whisker sensing and prevention
- Patent number 11,619,665
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Jeffrey N. Judd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intraluminal ultrasound imaging device and method of fabricating th...
- Patent number 11,596,387
- Issue date Mar 7, 2023
- PHILIPS IMAGE GUIDED THERAPY CORPORATION
- Jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical component package with reinforced molded pins
- Patent number 11,432,407
- Issue date Aug 30, 2022
- XFMRS, Inc.
- Tung Kong Luk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser soldering system
- Patent number 11,351,622
- Issue date Jun 7, 2022
- TE Connectivity Corporation
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount electrical connector
- Patent number 11,349,234
- Issue date May 31, 2022
- TE CONNECTIVITY SERVICES GMBH
- Christopher P. Devine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with top terminations
- Patent number 11,343,919
- Issue date May 24, 2022
- NXP USA, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal with clamping portion and connector assembly us...
- Patent number 11,336,040
- Issue date May 17, 2022
- Tyco Electronics (Shanghai) Co. Ltd.
- Xiaozhi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,195,269
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC die, probe and ultrasound system
- Patent number 11,161,146
- Issue date Nov 2, 2021
- Koninklijke Philips N.V.
- Wojtek Sudol
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Solder-pinning metal pads for electronic components
- Patent number 11,166,381
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing apparatus
- Patent number 11,160,173
- Issue date Oct 26, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Yingcong Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 11,064,615
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 10,959,339
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting arrangement and corresponding method for mounting an ele...
- Patent number 10,905,010
- Issue date Jan 26, 2021
- Robert Bosch GmbH
- Helmut Seiband
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board, air conditioner, and method for manufacturin...
- Patent number 10,897,809
- Issue date Jan 19, 2021
- Mitsubishi Electric Corporation
- Tsuyoshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for minimizing connector pad open-circuit stubs
- Patent number 10,856,414
- Issue date Dec 1, 2020
- Dell Products, L.P.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 10,842,029
- Issue date Nov 17, 2020
- Jabil Circuit (Guangzhou) Ltd.
- Jiangang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for holding a printed circuit board
- Patent number 10,798,856
- Issue date Oct 6, 2020
- PROTOSONIC LIMITED
- Niall Barrett
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit boards and circuit board assemblies
- Patent number 10,764,994
- Issue date Sep 1, 2020
- Hamilton Sundstrand Corporation
- Tran Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of assembling semiconductor device
- Patent number 10,750,621
- Issue date Aug 18, 2020
- Sumitomo Electric Device Innovations, Inc.
- Shingo Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a stacked electronic structure
- Patent number 10,741,531
- Issue date Aug 11, 2020
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse mounted gull wing electronic package
- Patent number 10,699,992
- Issue date Jun 30, 2020
- Intel Corporation
- Juan Landeros
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES
- Publication number 20240292547
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun Bowers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...
- Publication number 20240244761
- Publication date Jul 18, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Zhiyang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20230377124
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER CONNECTION BETWEEN A COAXIAL CABLE AND A PRINTED CIRCUIT BOA...
- Publication number 20230378663
- Publication date Nov 23, 2023
- Telefonaktiebolaget LM Ericsson (publ)
- Wolfgang Heibler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230292440
- Publication date Sep 14, 2023
- LG Innotek Co., Ltd.
- Seung Min LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor Module
- Publication number 20230209716
- Publication date Jun 29, 2023
- SEIKO EPSON CORPORATION
- Hitoshi UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES
- Publication number 20230171894
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Kyle Brent Norell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT
- Publication number 20230145507
- Publication date May 11, 2023
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20220132674
- Publication date Apr 28, 2022
- Mitsubishi Electric Corporation
- Koji SHIGETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20220092767
- Publication date Mar 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC DIE, PROBE AND ULTRASOUND SYSTEM
- Publication number 20220048071
- Publication date Feb 17, 2022
- Koninklijke Philips N.V.
- Wojtek SUDOL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip Package Positioning and Fixing Structure
- Publication number 20210398886
- Publication date Dec 23, 2021
- Hitachi Astemo, Ltd.
- Binti Haridan FATIN FARHANAH
- G01 - MEASURING TESTING
Information Patent Application
WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE
- Publication number 20210345495
- Publication date Nov 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE MOUNT ELECTRICAL CONNECTOR
- Publication number 20210313722
- Publication date Oct 7, 2021
- TE Connectivity Services GmbH
- Christopher P. Devine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Assembly Process Using Multiple Solders And A...
- Publication number 20210315107
- Publication date Oct 7, 2021
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL APPARATUS HAVING TIN WHISKER SENSING AND PREVENTION
- Publication number 20210208190
- Publication date Jul 8, 2021
- International Business Machines Corporation
- Jeffrey N. JUDD
- G01 - MEASURING TESTING
Information Patent Application
ULTRASOUND SCANNER ASSEMBLY
- Publication number 20210177377
- Publication date Jun 17, 2021
- Koninklijke Philips N.V.
- Jun SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE
- Publication number 20210100108
- Publication date Apr 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200404794
- Publication date Dec 24, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Stacking Printed Circuit Board Assemblies...
- Publication number 20200367367
- Publication date Nov 19, 2020
- Jabil Inc.
- Zambri Bin Samsudin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW GRID ARRAY TO SUPPORT LATE ATTACH OF COMPONENTS
- Publication number 20200205299
- Publication date Jun 25, 2020
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC BOARD AND MOUNTING SHEET
- Publication number 20200163227
- Publication date May 21, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder-Pinning Metal Pads for Electronic Components
- Publication number 20200100369
- Publication date Mar 26, 2020
- International Business Machines Corporation
- Yves Martin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURIN...
- Publication number 20200084874
- Publication date Mar 12, 2020
- Mitsubishi Electric Corporation
- Tsuyoshi MIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and Method for Manufacturing the Same
- Publication number 20200077524
- Publication date Mar 5, 2020
- Jabil Circuit (Guangzhou) Ltd.
- Jiangang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS OF ASSEMBLING SEMICONDUCTOR DEVICE
- Publication number 20200053883
- Publication date Feb 13, 2020
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Shingo INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Minimizing Connector Pad Open-Circuit Stubs
- Publication number 20190281698
- Publication date Sep 12, 2019
- DELL PRODUCTS, L.P.
- Chun-Lin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERLESS INTER-COMPONENT JOINTS
- Publication number 20190239361
- Publication date Aug 1, 2019
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS

Leaded components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IC die, probe and ultrasound system

Chip package positioning and fixing structure

Semiconductor device

Printed circuit board assembly process using multiple solders and a...

Exposed pad integrated circuit package

Mechanically bridged SMD interconnects for electronic devices

Reflow grid array to support late attach of components

Electrical apparatus having tin whisker sensing and prevention

Intraluminal ultrasound imaging device and method of fabricating th...

Electrical component package with reinforced molded pins

Laser soldering system

Surface mount electrical connector

Packaged electronic devices with top terminations

Conductive terminal with clamping portion and connector assembly us...

Exposed pad integrated circuit package

IC die, probe and ultrasound system

Solder-pinning metal pads for electronic components

Fixing apparatus

Wafer level bump stack for chip scale package

Manufacturing a product using a soldering process

Connecting arrangement and corresponding method for mounting an ele...

Printed circuit board, air conditioner, and method for manufacturin...

System and method for minimizing connector pad open-circuit stubs

Electronic device and method for manufacturing the same

Method for mounting a power amplifier (AP) assembly

Apparatus for holding a printed circuit board

Circuit boards and circuit board assemblies

Process of assembling semiconductor device

Method to form a stacked electronic structure

Reverse mounted gull wing electronic package

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...

Printed Circuit Board And Method For Soldering A Chip Housing In A...

ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES

PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

SOLDER CONNECTION BETWEEN A COAXIAL CABLE AND A PRINTED CIRCUIT BOA...

PRINTED CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE COMPRISING SAME

Sensor Module

MECHANICALLY BRIDGED SMD INTERCONNECTS FOR ELECTRONIC DEVICES

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT

PRINTED WIRING BOARD

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

IC DIE, PROBE AND ULTRASOUND SYSTEM

Chip Package Positioning and Fixing Structure

WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE

SURFACE MOUNT ELECTRICAL CONNECTOR

Printed Circuit Board Assembly Process Using Multiple Solders And A...

ELECTRICAL APPARATUS HAVING TIN WHISKER SENSING AND PREVENTION

ULTRASOUND SCANNER ASSEMBLY

WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE

SEMICONDUCTOR DEVICE

Method and Apparatus for Stacking Printed Circuit Board Assemblies...

REFLOW GRID ARRAY TO SUPPORT LATE ATTACH OF COMPONENTS

METHOD OF MANUFACTURING ELECTRONIC BOARD AND MOUNTING SHEET

Solder-Pinning Metal Pads for Electronic Components

PRINTED CIRCUIT BOARD, AIR CONDITIONER, AND METHOD FOR MANUFACTURIN...

Electronic Device and Method for Manufacturing the Same

PROCESS OF ASSEMBLING SEMICONDUCTOR DEVICE

System and Method for Minimizing Connector Pad Open-Circuit Stubs

SOLDERLESS INTER-COMPONENT JOINTS