Leadless chip carrier [LCC]

Industry

CPC
H05K2201/10727

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10727Leadless chip carrier [LCC]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising a chip package and an overlap-free coil layout
- Patent number 11,831,208
- Issue date Nov 28, 2023
- Infineon Technologies AG
- Udo Ausserlechner
- G01 - MEASURING TESTING
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removing unwanted flux from an integrated circuit package
- Patent number 10,939,559
- Issue date Mar 2, 2021
- Schlage Lock Company LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy, solder joint, solder paste composition, ele...
- Patent number 10,926,360
- Issue date Feb 23, 2021
- Tamura Corporation
- Masaya Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and manufacturing method
- Patent number 10,595,414
- Issue date Mar 17, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 10,522,515
- Issue date Dec 31, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removing unwanted flux from an integrated circuit package
- Patent number 10,512,167
- Issue date Dec 17, 2019
- Schlage Lock Company LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit board, printed-wiring board, and electronic apparatus
- Patent number 10,375,816
- Issue date Aug 6, 2019
- Canon Kabushiki Kaisha
- Keita Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 10,256,214
- Issue date Apr 9, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and circuit board assembly
- Patent number 10,212,803
- Issue date Feb 19, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hong Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film material, electronic component using film material, and method...
- Patent number 9,902,880
- Issue date Feb 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,839,128
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, electronic device, and electronic module
- Patent number 9,788,424
- Issue date Oct 10, 2017
- KYOCERA Corporation
- Masatsugu Iiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer modules with small thicknesses and associated methods of m...
- Patent number 9,717,157
- Issue date Jul 25, 2017
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package modules, memory cards including the same, and...
- Patent number 9,699,907
- Issue date Jul 4, 2017
- SK hynix Inc.
- Jung Tae Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting member, electronic component, and method for manufacturing...
- Patent number 9,673,141
- Issue date Jun 6, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for attachment of integrated circuits
- Patent number 9,635,794
- Issue date Apr 25, 2017
- TRW Automotive U.S. LLC
- Mike Babala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless chip carrier
- Patent number 9,589,873
- Issue date Mar 7, 2017
- MICROSS COMPONENTS LIMITED
- Peter Julian Tollafield
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure with heat dissipation function
- Patent number 9,554,453
- Issue date Jan 24, 2017
- Mediatek Inc.
- Shu-Wei Hsiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic components on trenched substrates and method of forming...
- Patent number 9,508,789
- Issue date Nov 29, 2016
- GLOBALFOUNDRIES Inc.
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,462,703
- Issue date Oct 4, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for contacting, positioning and impinging a solde...
- Patent number 9,327,360
- Issue date May 3, 2016
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for performing extended wafer-level packaging (eWLP) and eW...
- Patent number 9,305,908
- Issue date Apr 5, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Detlef Bernd Krabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling computer modules small in thickness
- Patent number 8,959,759
- Issue date Feb 24, 2015
- Micron Technology, Inc.
- Kevin Gibbons
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for interconnecting connection pads of a head-gimbal asse...
- Patent number 8,881,967
- Issue date Nov 11, 2014
- HGST Netherlands B.V.
- Yuhsuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for a dual interface card
- Patent number 8,819,918
- Issue date Sep 2, 2014
- Assa Abloy AB
- Stéphane Ayala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 8,791,369
- Issue date Jul 29, 2014
- Murata Manufacturing Co., Ltd.
- Terumichi Kita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit having an opening extending therethro...
- Patent number 8,767,352
- Issue date Jul 1, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS
- Publication number 20240388018
- Publication date Nov 21, 2024
- Intel Corporation
- Karumbu MEYYAPPAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING A CHIP PACKAGE AND AN OVERLAP-FREE COIL LAYOUT
- Publication number 20210328483
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Udo Ausserlechner
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20200236793
- Publication date Jul 23, 2020
- SCHLAGE LOCK COMPANY LLC
- Russell L. Steiner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20190279964
- Publication date Sep 12, 2019
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Manufacturing Method
- Publication number 20180288879
- Publication date Oct 4, 2018
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...
- Publication number 20160338200
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20160234938
- Publication date Aug 11, 2016
- NOVALIA LTD.
- Kate Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PERFORMING EXTENDED WAFER-LEVEL PACKAGING (eWLP) AND eW...
- Publication number 20150262983
- Publication date Sep 17, 2015
- Avago Technologies General IP (Singapore) PTE. LTD.
- Detlef Bernd Krabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR...
- Publication number 20140347834
- Publication date Nov 27, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seok Kyu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20140326486
- Publication date Nov 6, 2014
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
- CHAO-RONG LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE WITH HEAT DISSIPATION FUNCTION
- Publication number 20140238729
- Publication date Aug 28, 2014
- MEDIATEK INC.
- Shu-Wei HSIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20140177179
- Publication date Jun 26, 2014
- KYOCERA CORPORATION
- Masatsugu Iiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...
- Publication number 20140151849
- Publication date Jun 5, 2014
- International Business Machines Corporation
- David Questad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...
- Publication number 20140154844
- Publication date Jun 5, 2014
- Micron Technology, Inc.
- Kevin Gibbons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE SUBSTRATE, RESONATOR, OSCILLATOR, SENSOR, ELECTRONIC DEVICE, E...
- Publication number 20140151105
- Publication date Jun 5, 2014
- SEIKO EPSON CORPORATION
- Takuo KUWAHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20140029398
- Publication date Jan 30, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD AND APPARATUS FOR ATTACHMENT OF INTEGRATED CIRCUITS
- Publication number 20130215591
- Publication date Aug 22, 2013
- TRW AUTOMOTIVE U.S. LLC
- Mike Babala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS IN AN ELECTRONIC CONTACT LENS
- Publication number 20130135578
- Publication date May 30, 2013
- Randall Braxton Pugh
- G02 - OPTICS
Information Patent Application
SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...
- Publication number 20130130492
- Publication date May 23, 2013
- STMicroelectronics, Inc.
- Anthony M. Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE
- Publication number 20120292397
- Publication date Nov 22, 2012
- Murata Manufacturing Co., Ltd.
- Yuya DOKAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE
- Publication number 20120292396
- Publication date Nov 22, 2012
- Murata Manufacturing Co., Ltd.
- Yuya DOKAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Miniature Microwave Component for Surface-Mounting
- Publication number 20120248587
- Publication date Oct 4, 2012
- UNITED MONOLITHIC SEMICONDUCTORS S.A.
- Pierre-Franck Alleaume
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVI...
- Publication number 20120170240
- Publication date Jul 5, 2012
- IBIDEN CO., LTD.
- Hironori Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20120125675
- Publication date May 24, 2012
- Murata Manufacturing Co., Ltd.
- Terumichi KITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR...
- Publication number 20120091572
- Publication date Apr 19, 2012
- Mitsubishi Electric Corporation
- Tsuneo Hamaguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ARRANGEMENT OF OPTOELECTRONIC COMPONENTS
- Publication number 20120025219
- Publication date Feb 2, 2012
- Osram Opto Semiconductors GmbH
- Siegfried Herrmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION INTERFACES AND METHODS FOR ADJACENTLY POSITIO...
- Publication number 20110216517
- Publication date Sep 8, 2011
- Apple Inc.
- Michael Rosenblatt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Leadless chip carrier [LCC]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package with stress reduction design and method for f...

Device comprising a chip package and an overlap-free coil layout

Connection arrangement, component carrier and method of forming a c...

Removing unwanted flux from an integrated circuit package

Lead-free solder alloy, solder joint, solder paste composition, ele...

Component carrier and manufacturing method

Computer modules with small thicknesses and associated methods of m...

Removing unwanted flux from an integrated circuit package

Printed-circuit board, printed-wiring board, and electronic apparatus

Computer modules with small thicknesses and associated methods of m...

Circuit board and circuit board assembly

Film material, electronic component using film material, and method...

Solder void reduction between electronic packages and printed circu...

Wiring substrate, electronic device, and electronic module

Computer modules with small thicknesses and associated methods of m...

Semiconductor package modules, memory cards including the same, and...

Mounting member, electronic component, and method for manufacturing...

Method and apparatus for attachment of integrated circuits

Leadless chip carrier

Printed circuit board structure with heat dissipation function

Electronic components on trenched substrates and method of forming...

Solder void reduction between electronic packages and printed circu...

Method and device for contacting, positioning and impinging a solde...

Methods for performing extended wafer-level packaging (eWLP) and eW...

Method for assembling computer modules small in thickness

Apparatus for interconnecting connection pads of a head-gimbal asse...

Manufacturing electronic device having contact elements with a spec...

Manufacturing method for a dual interface card

Electronic component

Suspension board with circuit having an opening extending therethro...

Patents Applicationslast 30 patents

LIQUID METAL PATCH INTERCONNECT FOR LARGE WARPAGE COMPONENTS

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

DEVICE COMPRISING A CHIP PACKAGE AND AN OVERLAP-FREE COIL LAYOUT

Connection Arrangement, Component Carrier and Method of Forming a C...

REMOVING UNWANTED FLUX FROM AN INTEGRATED CIRCUIT PACKAGE

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

Component Carrier and Manufacturing Method

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...

CIRCUIT BOARD ASSEMBLY

METHODS FOR PERFORMING EXTENDED WAFER-LEVEL PACKAGING (eWLP) AND eW...

ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD STRUCTURE WITH HEAT DISSIPATION FUNCTION

WIRING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING...

COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF M...

BASE SUBSTRATE, RESONATOR, OSCILLATOR, SENSOR, ELECTRONIC DEVICE, E...

SUSPENSION BOARD WITH CIRCUIT

METHOD AND APPARATUS FOR ATTACHMENT OF INTEGRATED CIRCUITS

ELECTRICAL INTERCONNECTS IN AN ELECTRONIC CONTACT LENS

SYSTEM AND METHOD FOR IMPROVING SOLDER JOINT RELIABILITY IN AN INTE...

WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE

WIRELESS IC DEVICE AND COMPONENT FOR WIRELESS IC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

Miniature Microwave Component for Surface-Mounting

METHOD OF MANUFACTURING A MULTILAYER PRINTED WIRING BOARD FOR PROVI...

ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR...

ARRANGEMENT OF OPTOELECTRONIC COMPONENTS

ELECTRICAL CONNECTION INTERFACES AND METHODS FOR ADJACENTLY POSITIO...