Leadless components

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CPC
H05K3/3431

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3431Leadless components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,790,206
- Issue date Oct 17, 2023
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metal composition, intermetallic compound member and joined body
- Patent number 11,746,398
- Issue date Sep 5, 2023
- Murata Manufacturing Co., Ltd.
- Masumi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED precision assembly method
- Patent number 11,749,791
- Issue date Sep 5, 2023
- Jabil Inc.
- Weiping Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with a solid body protecting a component carrier...
- Patent number 11,612,064
- Issue date Mar 21, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for die bonding using energy beam
- Patent number 11,588,084
- Issue date Feb 21, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for bonding a cable to a substrate using a die bo...
- Patent number 11,540,399
- Issue date Dec 27, 2022
- HRL Laboratories, LLC
- Peter Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coil component and electronic device
- Patent number 11,532,427
- Issue date Dec 20, 2022
- Taiyo Yuden Co., Ltd.
- Keizo Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting substrate and manufacturing method th...
- Patent number 11,516,923
- Issue date Nov 29, 2022
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- F21 - LIGHTING
Information Patent Grant
Light-emitting module for vehicle lamp
- Patent number 11,506,352
- Issue date Nov 22, 2022
- Lite-On Electronics (Guangzhou) Limited
- Ching-Tang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 11,510,314
- Issue date Nov 22, 2022
- Xerox Corporation
- Naveen Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light device, headlight and method
- Patent number 11,499,688
- Issue date Nov 15, 2022
- Osram GmbH
- Markus Stange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission apparatus and display apparatus
- Patent number 11,474,572
- Issue date Oct 18, 2022
- HKC CORPORATION LIMITED
- Huailiang He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic module with single or multiple components partially surr...
- Patent number 11,452,199
- Issue date Sep 20, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Appliance control panel with in-molded electronic film directly mou...
- Patent number 11,330,722
- Issue date May 10, 2022
- Haier US Appliance Solutions, Inc.
- Richard Gary Woodham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-speed RFID tag assembly using impulse heating
- Patent number 11,288,564
- Issue date Mar 29, 2022
- Impinj, Inc.
- Ronald Lee Koepp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for mechanical contacting of a potting frame on a printed ci...
- Patent number 11,277,920
- Issue date Mar 15, 2022
- ENDRESS+HAUSER SE+CO.KG
- Bernd Strütt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Displays with direct-lit backlight units and color conversion layers
- Patent number 11,221,512
- Issue date Jan 11, 2022
- Apple Inc.
- Rong Liu
- F21 - LIGHTING
Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 11,158,920
- Issue date Oct 26, 2021
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and electronic device
- Patent number 11,139,105
- Issue date Oct 5, 2021
- Taiyo Yuden Co., Ltd.
- Keizo Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and board having the same
- Patent number 11,094,467
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyo Kwang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electric circuit comprising a circuit carri...
- Patent number 11,056,460
- Issue date Jul 6, 2021
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor and board having the same
- Patent number 11,058,003
- Issue date Jul 6, 2021
- SAMSUNG ELECTRO-MECHANICS CO, , LTD.
- Jin Man Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Displays with direct-lit backlight units including light-emitting d...
- Patent number 11,009,745
- Issue date May 18, 2021
- Apple Inc.
- Rong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component, composite electronic component pack...
- Patent number 10,991,513
- Issue date Apr 27, 2021
- Taiyo Yuden Co., Ltd.
- Shin Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Displays with direct-lit backlight units
- Patent number 10,901,260
- Issue date Jan 26, 2021
- Apple Inc.
- Rong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making single reflow power pin connections
- Patent number 10,897,821
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for void reduction in solder joints
- Patent number 10,843,284
- Issue date Nov 24, 2020
- ZKW GROUP GMBH
- Erik Edlinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLING CAPACITOR BOOSTER MODULE
- Publication number 20240260193
- Publication date Aug 1, 2024
- Intel Corporation
- Herh Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT
- Publication number 20240049399
- Publication date Feb 8, 2024
- KOA Corporation
- Yasushi AKAHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
- Publication number 20230420317
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Michael STADLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Control Device
- Publication number 20230380068
- Publication date Nov 23, 2023
- Hitachi Astemo, Ltd.
- Takeshi IGARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, METHOD FOR FORMING A PACKAGE, CHIP CARD, AND METHOD FOR FO...
- Publication number 20230187328
- Publication date Jun 15, 2023
- INFINEON TECHNOLOGIES AG
- Jens Pohl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CI...
- Publication number 20230134246
- Publication date May 4, 2023
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING METHOD FOR MICRO-LED
- Publication number 20230116166
- Publication date Apr 13, 2023
- LEDMAN OPTOELECTRONIC CO., LTD.
- Mantie Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20220418104
- Publication date Dec 29, 2022
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220225510
- Publication date Jul 14, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220190805
- Publication date Jun 16, 2022
- KYOCERA CORPORATION
- Akira OIKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COIL COMPONENT AND ELECTRONIC DEVICE
- Publication number 20210375532
- Publication date Dec 2, 2021
- Taiyo Yuden Co., Ltd.
- Keizo KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With a Solid Body Protecting a Component Carrier...
- Publication number 20210360795
- Publication date Nov 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Erich Schlaffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210289624
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke MINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRANSMISSION APPARATUS AND DISPLAY APPARATUS
- Publication number 20210181811
- Publication date Jun 17, 2021
- HKC CORPORATION LIMITED
- Huailiang He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT DEVICE, HEADLIGHT AND METHOD
- Publication number 20210140599
- Publication date May 13, 2021
- Markus Stange
- F21 - LIGHTING
Information Patent Application
Electronic Module With Single or Multiple Components Partially Surr...
- Publication number 20210084747
- Publication date Mar 18, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Martin Schrems
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE FOR VEHICLE LAMP
- Publication number 20210010652
- Publication date Jan 14, 2021
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Ching-Tang Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20200367365
- Publication date Nov 19, 2020
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...
- Publication number 20200305283
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED PRECISION ASSEMBLY METHOD
- Publication number 20200266325
- Publication date Aug 20, 2020
- Jabil Inc.
- Weiping (aka Jonathan) Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MECHANICAL CONTACTING OF A POTTING FRAME ON A PRINTED CI...
- Publication number 20200245470
- Publication date Jul 30, 2020
- Endress+Hauser SE+Co. KG
- Bernd Strütt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND BOARD HAVING THE SAME
- Publication number 20200205291
- Publication date Jun 25, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Jin Man JUNG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...
- Publication number 20200100360
- Publication date Mar 26, 2020
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...
- Publication number 20200093008
- Publication date Mar 19, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLIANCE CONTROL PANEL WITH IN-MOLDED ELECTRONIC FILM DIRECTLY MOU...
- Publication number 20200019260
- Publication date Jan 16, 2020
- Richard Gary Woodham
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING MODULE FOR VEHICLE LAMP
- Publication number 20200011498
- Publication date Jan 9, 2020
- LITE-ON ELECTRONICS (GUANGZHOU) LIMITED
- Ching-Tang Fu
- F21 - LIGHTING
Information Patent Application
METHOD FOR PRODUCING AN ELECTRIC CIRCUIT
- Publication number 20190393187
- Publication date Dec 26, 2019
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING MODULE
- Publication number 20190364669
- Publication date Nov 28, 2019
- Nichia Corporation.
- Takashi MATSUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light-Emitting Diodes in Displays with Direct-lit Backlight Units
- Publication number 20190285942
- Publication date Sep 19, 2019
- Apple Inc.
- Rong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Leadless components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hybrid nanosilver/liquid metal ink composition and uses thereof

High-speed RFID tag assembly using impulse heating

Metal composition, intermetallic compound member and joined body

LED precision assembly method

Component carrier with a solid body protecting a component carrier...

Method and structure for die bonding using energy beam

System and method for bonding a cable to a substrate using a die bo...

Coil component and electronic device

Electronic component mounting substrate and manufacturing method th...

Light-emitting module for vehicle lamp

Hybrid nanosilver/liquid metal ink composition and uses thereof

Light device, headlight and method

Signal transmission apparatus and display apparatus

Electronic module with single or multiple components partially surr...

Appliance control panel with in-molded electronic film directly mou...

High-speed RFID tag assembly using impulse heating

Method for mechanical contacting of a potting frame on a printed ci...

Displays with direct-lit backlight units and color conversion layers

High powered RF part for improved manufacturability

Coil component and electronic device

Multilayer ceramic capacitor and board having the same

Method for producing an electric circuit comprising a circuit carri...

Capacitor and board having the same

Displays with direct-lit backlight units including light-emitting d...

Composite electronic component, composite electronic component pack...

Displays with direct-lit backlight units

Method of making single reflow power pin connections

Electronic device comprising an electronic component mounted on a s...

Method for void reduction in solder joints

Contact structures with porous networks for solder connections, and...

Patents Applicationslast 30 patents

DECOUPLING CAPACITOR BOOSTER MODULE

CONNECTING ARRANGEMENT

CHIP COMPONENT

ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS

Electronic Control Device

PACKAGE, METHOD FOR FORMING A PACKAGE, CHIP CARD, AND METHOD FOR FO...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CI...

DIE BONDING METHOD FOR MICRO-LED

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME

COIL COMPONENT AND ELECTRONIC DEVICE

Component Carrier With a Solid Body Protecting a Component Carrier...

MODULE AND METHOD OF MANUFACTURING THE SAME

SIGNAL TRANSMISSION APPARATUS AND DISPLAY APPARATUS

LIGHT DEVICE, HEADLIGHT AND METHOD

Electronic Module With Single or Multiple Components Partially Surr...

LIGHT-EMITTING MODULE FOR VEHICLE LAMP

ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD TH...

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...

LED PRECISION ASSEMBLY METHOD

METHOD FOR MECHANICAL CONTACTING OF A POTTING FRAME ON A PRINTED CI...

CAPACITOR AND BOARD HAVING THE SAME

CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

APPLIANCE CONTROL PANEL WITH IN-MOLDED ELECTRONIC FILM DIRECTLY MOU...

LIGHT-EMITTING MODULE FOR VEHICLE LAMP

METHOD FOR PRODUCING AN ELECTRIC CIRCUIT

METHOD FOR MANUFACTURING LIGHT EMITTING MODULE

Light-Emitting Diodes in Displays with Direct-lit Backlight Units