Leads on or in insulating or insulated substrates

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H01L21/4846

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4846Leads on or in insulating or insulated substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 12,261,133
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 12,238,864
- Issue date Feb 25, 2025
- Industrial Technology Research Institute
- Yu-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with solder barriers on leads
- Patent number 12,237,249
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry film lamination with dynamic feedback control
- Patent number 12,214,579
- Issue date Feb 4, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor substrate arrangement
- Patent number 12,205,826
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step isotropic etch patterning of thick copper layers for for...
- Patent number 12,191,161
- Issue date Jan 7, 2025
- Intel Corporation
- Oladeji Fadayomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic carrier and build up carrier for light-emitting diode (LED)...
- Patent number 12,191,280
- Issue date Jan 7, 2025
- Lumileds, LLC
- Loon-Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using tape attachment
- Patent number 12,176,335
- Issue date Dec 24, 2024
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures with deformable conductors
- Patent number 12,125,778
- Issue date Oct 22, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,107,038
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Jung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package employing added metal for embedded...
- Patent number 12,100,645
- Issue date Sep 24, 2024
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlling of height of high-density interconnection structure on...
- Patent number 12,087,596
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Keishi Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric component with pad for a bump and manufacturing method the...
- Patent number 12,074,120
- Issue date Aug 27, 2024
- RF360 SINGAPORE PTE. LTD.
- Robert Felix Bywalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...
- Patent number 12,068,172
- Issue date Aug 20, 2024
- Intel Corporation
- Tarek A. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,062,832
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND TECHNIQUE OF PHOTO-DEFINED SEMICONDUCTOR DEVICE WITH...
- Publication number 20250117561
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Publication number 20250112127
- Publication date Apr 3, 2025
- Intel Corporation
- Kimin Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM CONTAINING HYDROXYCI...
- Publication number 20250109242
- Publication date Apr 3, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Publication number 20250112196
- Publication date Apr 3, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICON...
- Publication number 20250105160
- Publication date Mar 27, 2025
- SILICON BOX PTE. LTD.
- Byung Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096214
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096105
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250096162
- Publication date Mar 20, 2025
- CXMT Corporation
- You FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20250096104
- Publication date Mar 20, 2025
- AaltoSemi Inc.
- Min-Yao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...
- Publication number 20250096108
- Publication date Mar 20, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079389
- Publication date Mar 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Yoshiharu SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE,...
- Publication number 20250070106
- Publication date Feb 27, 2025
- HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hai TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD
- Publication number 20250069993
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD...
- Publication number 20250059347
- Publication date Feb 20, 2025
- FUJIFILM CORPORATION
- Kazuya OOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...
- Publication number 20250051927
- Publication date Feb 13, 2025
- MacDermid Enthone Inc.
- Mikailou THIAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...
- Publication number 20250031315
- Publication date Jan 23, 2025
- DAI NIPPON PRINTING CO., LTD.
- Ryohei KASAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20250022722
- Publication date Jan 16, 2025
- HAESUNG DS CO., LTD.
- Jongwoo PARK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250006648
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20250006616
- Publication date Jan 2, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240429151
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Heejin YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240421094
- Publication date Dec 19, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Seon-Kyu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF
- Publication number 20240404958
- Publication date Dec 5, 2024
- Nexperia Technology (Shanghai) Ltd.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395723
- Publication date Nov 28, 2024
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240387450
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS

Leads on or in insulating or insulated substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer with warpage-relief trenches

Semiconductor package

Electronic apparatus

Substrates with solder barriers on leads

Radio frequency package implementing a window frame with edge plati...

Dry film lamination with dynamic feedback control

Method for forming a semiconductor substrate arrangement

Multi-step isotropic etch patterning of thick copper layers for for...

Cantilevered power planes to provide a return current path for high...

Ceramic carrier and build up carrier for light-emitting diode (LED)...

Antenna with graded dielectirc and method of making the same

Semiconductor device and method using tape attachment

Component carrier and method of manufacturing a component carrier

Heat-dissipating circuit board, heat-dissipating member, and produc...

Package structure with photonic die and method

Fabricating active-bridge-coupled GPU chiplets

Package structure and method of fabrcating the same

Wiring structure and method of manufacturing the same, semiconducto...

Insulated circuit substrate manufacturing method

Structures with deformable conductors

DBC substrate for power semiconductor devices, method for fabricati...

Encircling a semiconductor device with stacked frames on a substrate

Semiconductor packages

Offset interposers for large-bottom packages and large-die package-...

Integrated circuit (IC) package employing added metal for embedded...

Controlling of height of high-density interconnection structure on...

Electric component with pad for a bump and manufacturing method the...

Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB...

Electronic device and manufacturing method thereof

Semiconductor package having routable encapsulated conductive subst...

Patents Applicationslast 30 patents

STRUCTURE AND TECHNIQUE OF PHOTO-DEFINED SEMICONDUCTOR DEVICE WITH...

IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES

COMPOSITION FOR FORMING RESIST UNDERLAYER FILM CONTAINING HYDROXYCI...

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES

INTERCONNECTION MODULE SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICON...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

CANTILEVERED POWER PLANES TO PROVIDE A RETURN CURRENT PATH FOR HIGH...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BACKPLANE AND METHOD FOR MANUFACTURING THE SAME, BACKLIGHT MODULE,...

PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD

RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD...

Method of Metallization by a Nickel or Cobalt Alloy for the Manufac...

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

METHOD FOR MANUFACTURING SUBSTRATE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

HYBRID METALLIZATION SURFACES FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

POWER MODULE PACKAGE AND MANUFACTURE METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

REDISTRIBUTION STRUCTURE AND METHOD OF FORMING THE SAME

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME