Leads on or in insulating or insulated substrates

Industry

CPC
H01L21/4846

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4846Leads on or in insulating or insulated substrates

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated millimeter-wave dual-mode matching network
- Patent number 12,368,118
- Issue date Jul 22, 2025
- NXP B.V.
- Harish Nandagopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interposer structure and method of providing same
- Patent number 12,362,284
- Issue date Jul 15, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 12,354,962
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under chip bridge
- Patent number 12,354,964
- Issue date Jul 8, 2025
- FRONTGRADE TECHNOLOGIES INC.
- Sean Thorne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch light-emitting decoration nameplate
- Patent number 12,341,144
- Issue date Jun 24, 2025
- DARWIN PRECISIONS CORPORATION
- Hsuan Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package for power semiconductor devices
- Patent number 12,300,678
- Issue date May 13, 2025
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, article comprising the same and manufacturing metho...
- Patent number 12,288,736
- Issue date Apr 29, 2025
- Prevayl Innovations Limited
- Michael John Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,283,541
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 12,261,133
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 12,238,864
- Issue date Feb 25, 2025
- Industrial Technology Research Institute
- Yu-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with solder barriers on leads
- Patent number 12,237,249
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency package implementing a window frame with edge plati...
- Patent number 12,224,217
- Issue date Feb 11, 2025
- MACOM Technology Solutions Holdings, Inc.
- Richard Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry film lamination with dynamic feedback control
- Patent number 12,214,579
- Issue date Feb 4, 2025
- Intel Corporation
- Joshua Stacey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor substrate arrangement
- Patent number 12,205,826
- Issue date Jan 21, 2025
- Infineon Technologies AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step isotropic etch patterning of thick copper layers for for...
- Patent number 12,191,161
- Issue date Jan 7, 2025
- Intel Corporation
- Oladeji Fadayomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cantilevered power planes to provide a return current path for high...
- Patent number 12,191,243
- Issue date Jan 7, 2025
- Avago Technologies International Sales Pte. Limited
- Arun Ramakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic carrier and build up carrier for light-emitting diode (LED)...
- Patent number 12,191,280
- Issue date Jan 7, 2025
- Lumileds, LLC
- Loon-Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with graded dielectirc and method of making the same
- Patent number 12,191,571
- Issue date Jan 7, 2025
- Intel Corporation
- Saravana Maruthamuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using tape attachment
- Patent number 12,176,335
- Issue date Dec 24, 2024
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating circuit board, heat-dissipating member, and produc...
- Patent number 12,177,972
- Issue date Dec 24, 2024
- NOF Corporation
- Toshinobu Fujimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package structure with photonic die and method
- Patent number 12,176,270
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating active-bridge-coupled GPU chiplets
- Patent number 12,170,263
- Issue date Dec 17, 2024
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 12,148,732
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated circuit substrate manufacturing method
- Patent number 12,133,338
- Issue date Oct 29, 2024
- Mitsubishi Materials Corporation
- Yoshiaki Sakaniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures with deformable conductors
- Patent number 12,125,778
- Issue date Oct 22, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DBC substrate for power semiconductor devices, method for fabricati...
- Patent number 12,119,284
- Issue date Oct 15, 2024
- Infineon Technologies Austria AG
- Alexander Roth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE SUBSTRATE INCLUDING EMBEDDED ELECTROMAGNETIC ISOL...
- Publication number 20250239513
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME
- Publication number 20250239531
- Publication date Jul 24, 2025
- STATS ChipPAC Pte Ltd.
- TaeWoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATES AND METHODS FOR MANUFACTURING SAME, POWER MOD...
- Publication number 20250226273
- Publication date Jul 10, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACK...
- Publication number 20250226236
- Publication date Jul 10, 2025
- Resonac Corporation
- Yuko KONNO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...
- Publication number 20250218924
- Publication date Jul 3, 2025
- Intel Corporation
- Prithwish Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218982
- Publication date Jul 3, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES
- Publication number 20250218956
- Publication date Jul 3, 2025
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250219043
- Publication date Jul 3, 2025
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218922
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...
- Publication number 20250219018
- Publication date Jul 3, 2025
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...
- Publication number 20250218925
- Publication date Jul 3, 2025
- Intel Corporation
- Shruti Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...
- Publication number 20250218678
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE
- Publication number 20250210268
- Publication date Jun 26, 2025
- Intel Corporation
- Srinivasan RAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...
- Publication number 20250210608
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Lipu Kris Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE, PRODUCTION METHOD THEREOF, AND POWER DEVICE
- Publication number 20250210492
- Publication date Jun 26, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Qipeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES
- Publication number 20250201485
- Publication date Jun 19, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Layer on Subs...
- Publication number 20250201733
- Publication date Jun 19, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES
- Publication number 20250192064
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250192020
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKGING METHOD
- Publication number 20250191936
- Publication date Jun 12, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20250185160
- Publication date Jun 5, 2025
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...
- Publication number 20250174570
- Publication date May 29, 2025
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20250174539
- Publication date May 29, 2025
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250167059
- Publication date May 22, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...
- Publication number 20250167168
- Publication date May 22, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149460
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIMENSIONING A LAND GRID ARRAY PAD
- Publication number 20250149428
- Publication date May 8, 2025
- ADVANCED MICRO DEVICES, INC.
- ChangWei Liang
- H01 - BASIC ELECTRIC ELEMENTS

Leads on or in insulating or insulated substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated millimeter-wave dual-mode matching network

Composite interposer structure and method of providing same

Standard cell layout for better routability

Multi-role semiconductor device substrates, semiconductor device as...

Under chip bridge

Touch light-emitting decoration nameplate

Package for power semiconductor devices

Sensor package, article comprising the same and manufacturing metho...

Manufacturing method of semiconductor package

Interposer with warpage-relief trenches

Semiconductor package

Electronic apparatus

Substrates with solder barriers on leads

Radio frequency package implementing a window frame with edge plati...

Dry film lamination with dynamic feedback control

Method for forming a semiconductor substrate arrangement

Multi-step isotropic etch patterning of thick copper layers for for...

Cantilevered power planes to provide a return current path for high...

Ceramic carrier and build up carrier for light-emitting diode (LED)...

Antenna with graded dielectirc and method of making the same

Semiconductor device and method using tape attachment

Component carrier and method of manufacturing a component carrier

Heat-dissipating circuit board, heat-dissipating member, and produc...

Package structure with photonic die and method

Fabricating active-bridge-coupled GPU chiplets

Package structure and method of fabrcating the same

Wiring structure and method of manufacturing the same, semiconducto...

Insulated circuit substrate manufacturing method

Structures with deformable conductors

DBC substrate for power semiconductor devices, method for fabricati...

Patents Applicationslast 30 patents

INTEGRATED DEVICE SUBSTRATE INCLUDING EMBEDDED ELECTROMAGNETIC ISOL...

ELECTRONIC DEVICE AND A METHOD FOR FORMING THE SAME

MULTILAYER SUBSTRATES AND METHODS FOR MANUFACTURING SAME, POWER MOD...

PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACK...

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) AS...

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

METHODS AND APPARATUS FOR MOUNTING SEMICONDUCTOR DEVICES IN CAVITIES

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR ASSEMBLY COMPONENT AN...

ELECTROLESS NICKEL-ELECTROLESS PALLADIUM-IMMERSION GOLD (ENEPIG) WI...

DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...

PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE

INTEGRATED CIRCUIT PACKAGES WITH THERMAL RESERVOIR DIES AND METHODS...

POWER MODULE, PRODUCTION METHOD THEREOF, AND POWER DEVICE

VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES

Semiconductor Device and Method of Forming Protective Layer on Subs...

MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

PACKAGE STRUCTURE AND PACKGING METHOD

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

METHODS AND SYSTEM FOR ADDITIVE MANUFACTURED SEMICONDUCTOR PACKAGIN...

3D INTEGRATED CIRCUIT PACKAGE AND SUBSTRATE STRUCTURE THEREOF

POWER CONVERSION DEVICE

ELECTRONIC PACKAGE WITH INTEGRATED ANTENNAS AND A METHOD FOR FORMIN...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR DIMENSIONING A LAND GRID ARRAY PAD