Leads on or in insulating or insulated substrates

Industry

CPC
H01L21/4846

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4846Leads on or in insulating or insulated substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 11,973,040
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including multiple substrates with dif...
- Patent number 11,955,419
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures with deformable conductors
- Patent number 11,955,420
- Issue date Apr 9, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,948,852
- Issue date Apr 2, 2024
- ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Chang-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method of forming the same
- Patent number 11,948,862
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,942,334
- Issue date Mar 26, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,916,009
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system in package comprising protected side faces
- Patent number 11,894,315
- Issue date Feb 6, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Thibaut Sohier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnection of circuit elements on a substrate witho...
- Patent number 11,881,466
- Issue date Jan 23, 2024
- Orbotech Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell layout for better routability
- Patent number 11,862,568
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 11,862,570
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jung Joo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having a profile modifier
- Patent number 11,854,832
- Issue date Dec 26, 2023
- NANYA TECHNOLOGY CORPORATION
- Shih-En Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors with nanoislands on conductive plates
- Patent number 11,855,125
- Issue date Dec 26, 2023
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge chip with through via
- Patent number 11,848,273
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing assembly structure by using frame structur...
- Patent number 11,848,280
- Issue date Dec 19, 2023
- ADVANCED SEMlCONDUCTOR ENGINEERING, INC.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with layer structures, antenna layer and elec...
- Patent number 11,837,552
- Issue date Dec 5, 2023
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,837,549
- Issue date Dec 5, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frames stacked on substrate encircling devices and manufacturing me...
- Patent number 11,823,991
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery for embedded bridge die utilizing trench structures
- Patent number 11,817,391
- Issue date Nov 14, 2023
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated thin film capacitors using amorphous high-k di...
- Patent number 11,804,455
- Issue date Oct 31, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid metal circuits and methods of making the same
- Patent number 11,805,597
- Issue date Oct 31, 2023
- Carnegie Mellon University
- O Burak Ozdoganlar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed pad size and pad design
- Patent number 11,804,428
- Issue date Oct 31, 2023
- QUALCOMM Incorporated
- Wen Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating copper pillar bump structure with solder supp...
- Patent number 11,798,885
- Issue date Oct 24, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for signal integrity protection technique
- Patent number 11,798,894
- Issue date Oct 24, 2023
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...
- Publication number 20240145374
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136271
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- KEUNYOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
- Publication number 20240128185
- Publication date Apr 18, 2024
- PANJIT INTERNATIONAL INC.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATES AND RELATED METHODS
- Publication number 20240120253
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...
- Publication number 20240120282
- Publication date Apr 11, 2024
- SERIPHY TECHNOLOGY CORPORATION
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
- Publication number 20240120268
- Publication date Apr 11, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Substrate
- Publication number 20240112979
- Publication date Apr 4, 2024
- Solid-tech Co., Ltd.
- Tzu Chien HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH WITH METAL DOME
- Publication number 20240105580
- Publication date Mar 28, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC SURFACE FINISH ARCHITECTURE
- Publication number 20240105575
- Publication date Mar 28, 2024
- Intel Corporation
- Jason M. GAMBA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS...
- Publication number 20240105576
- Publication date Mar 28, 2024
- Intel Corporation
- Kyle MCELHINNY
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DRY FILM LAMINATION WITH DYNAMIC FEEDBACK CONTROL
- Publication number 20240092074
- Publication date Mar 21, 2024
- Intel Corporation
- Joshua STACEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standard Cell Layout for Better Routability
- Publication number 20240088046
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Carrier Substrate
- Publication number 20240087979
- Publication date Mar 14, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...
- Publication number 20240088051
- Publication date Mar 14, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH EMBEDDED BRIDGE DIES
- Publication number 20240079339
- Publication date Mar 7, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
- Publication number 20240079358
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Siva Sai Kishore Palli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...
- Publication number 20240079305
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS
- Publication number 20240079306
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION
- Publication number 20240071886
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY
- Publication number 20240071934
- Publication date Feb 29, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
- Publication number 20240071975
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE
- Publication number 20240071935
- Publication date Feb 29, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240071943
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE
- Publication number 20240063148
- Publication date Feb 22, 2024
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ARRANGEMENT
- Publication number 20240038651
- Publication date Feb 1, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030077
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- SANGHYEON JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES
- Publication number 20240030143
- Publication date Jan 25, 2024
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS

Leads on or in insulating or insulated substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interposer with warpage-relief trenches

Electronic component apparatus having a first lead frame and a seco...

Semiconductor device package including multiple substrates with dif...

Structures with deformable conductors

Semiconductor device package

Package structures and method of forming the same

Stacked die modules for semiconductor device assemblies and methods...

Microelectronic assemblies having conductive structures with differ...

Semiconductor package and manufacturing method thereof

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Manufacturing method of package structure

Electronic system in package comprising protected side faces

Electrical interconnection of circuit elements on a substrate witho...

Sn—Bi and copper powder conductive paste in through hole of insulat...

Standard cell layout for better routability

Semiconductor package

Semiconductor device structure having a profile modifier

Shielding structures

Capacitors with nanoislands on conductive plates

Bridge chip with through via

Method for manufacturing assembly structure by using frame structur...

Semiconductor package with layer structures, antenna layer and elec...

Power delivery for embedded bridge die utilizing trench structures

Frames stacked on substrate encircling devices and manufacturing me...

Power delivery for embedded bridge die utilizing trench structures

Substrate integrated thin film capacitors using amorphous high-k di...

Liquid metal circuits and methods of making the same

Mixed pad size and pad design

Method of fabricating copper pillar bump structure with solder supp...

Devices and methods for signal integrity protection technique

Patents Applicationslast 30 patents

WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF

INTEGRATED SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR STRUCTURES AND METHOD FOR MANUFACTURING A SEMICONDUCT...

METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE

Carrier Substrate

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

SURFACE FINISH WITH METAL DOME

ELECTROLYTIC SURFACE FINISH ARCHITECTURE

DFR OVERHANG PROCESS FLOW FOR ELECTROLYTIC SURFACE FINISH FOR GLASS...

DRY FILM LAMINATION WITH DYNAMIC FEEDBACK CONTROL

Standard Cell Layout for Better Routability

Carrier Substrate

METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...

PACKAGE SUBSTRATE WITH EMBEDDED BRIDGE DIES

SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING

EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...

MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS

MULTI-CHIP PACKAGE WITH ENHANCED CONDUCTIVE LAYER ADHESION

COMPOSITE BRIDGES FOR 3D STACKED INTEGRATED CIRCUIT POWER DELIVERY

SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...

GLASS DIE-TO-DIE BRIDGE AND INTERPOSER FOR DIE FIRST ARCHITECTURE

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SUBSTRATES WITH CONTINUOUS SLOT VIAS

SEMICONDUCTOR PACKAGES

DEEP TRENCH CAPACITOR BRIDGE FOR MULTI-CHIP PACKAGE

CIRCUIT BOARD ARRANGEMENT

PACKAGE AND METHOD OF FABRICATING THE SAME

POWER DELIVERY FOR EMBEDDED BRIDGE DIE UTILIZING TRENCH STRUCTURES