leaving a reusable substrate

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H01L21/7813

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/7813leaving a reusable substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and structure for thin-film fabrication
- Patent number 12,165,922
- Issue date Dec 10, 2024
- Jani Oksanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing wafers with modification lines of defined orie...
- Patent number 12,159,805
- Issue date Dec 3, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 12,148,667
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 12,148,666
- Issue date Nov 19, 2024
- Kioxia Corporation
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonpolar or semipolar group III-nitride substrates
- Patent number 12,106,959
- Issue date Oct 1, 2024
- Saphlux, Inc.
- Jie Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring blocks from a donor substrate onto a receiv...
- Patent number 12,094,759
- Issue date Sep 17, 2024
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring large-area group III-nitride semiconductor material an...
- Patent number 12,020,985
- Issue date Jun 25, 2024
- The Government of the United States of America, as represented by the Secreta...
- Travis J. Anderson
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for separating a solid body
- Patent number 11,996,331
- Issue date May 28, 2024
- Siltectra GmbH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crystal efficient SiC device wafer production
- Patent number 11,996,330
- Issue date May 28, 2024
- II-VI ADVANCED MATERIALS, LLC
- Adolf Schöner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing GaN layered substrate
- Patent number 11,967,530
- Issue date Apr 23, 2024
- Shin-Etsu Chemical Co., Ltd.
- Sumio Sekiyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
- Patent number 11,887,894
- Issue date Jan 30, 2024
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed wafer and method of manufacturing chip formation wafer
- Patent number 11,881,407
- Issue date Jan 23, 2024
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing the thickness of solid-state layers provided wi...
- Patent number 11,869,810
- Issue date Jan 9, 2024
- Siltectra GmbH
- Marko Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned nanochannel sacrificial layer for semiconductor substrate...
- Patent number 11,830,733
- Issue date Nov 28, 2023
- Alliance for Sustainable Energy, LLC
- John Stanley Mangum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser lift-off method for separating substrate and semiconductor-ep...
- Patent number 11,784,094
- Issue date Oct 10, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing gallium nitride semiconductor device
- Patent number 11,784,039
- Issue date Oct 10, 2023
- Denso Corporation
- Jun Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring blocks from a donor substrate onto a receiv...
- Patent number 11,776,843
- Issue date Oct 3, 2023
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable nitride wafer, method of making, and use thereof
- Patent number RE49677
- Issue date Oct 3, 2023
- SLT TECHNOLOGIES, INC.
- Mark P. D'Evelyn
Information Patent Grant
Glass substrate, laminated substrate, and laminate
- Patent number 11,753,330
- Issue date Sep 12, 2023
- AGC Inc.
- Yu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
- Patent number 11,742,243
- Issue date Aug 29, 2023
- Rohm Co., Ltd.
- Masatoshi Aketa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of re-using a silicon carbide substrate
- Patent number 11,735,642
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
- Patent number 11,712,749
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 11,715,768
- Issue date Aug 1, 2023
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable wide bandgap semiconductor substrate
- Patent number 11,710,662
- Issue date Jul 25, 2023
- United Silicon Carbide, Inc.
- Anup Bhalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with two-dimensional materials
- Patent number 11,688,605
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tse-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing group III nitride semiconductor substrate,...
- Patent number 11,680,339
- Issue date Jun 20, 2023
- Furukawa Co., Ltd.
- Yujiro Ishihara
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,652,000
- Issue date May 16, 2023
- Kioxia Corporation
- Hidekazu Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water soluble oxide liftoff layers for GaAs photovoltaics
- Patent number 11,621,365
- Issue date Apr 4, 2023
- Alliance for Sustainable Energy, LLC
- Andrew Gordon Norman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 11,587,824
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Hsiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED display device and a manufacturing method thereof
- Patent number 11,581,291
- Issue date Feb 14, 2023
- GoerTek Inc.
- Peixuan Chen
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
Process for the Pulsed Laser Ejection of Multiple Epitaxial Structu...
- Publication number 20240421001
- Publication date Dec 19, 2024
- Benjamin Reeves
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...
- Publication number 20240363416
- Publication date Oct 31, 2024
- MICLEDI MICRODISPLAYS BV
- Soeren STEUDEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332081
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Makoto TAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE UNIT, AND SUBSTRATE UNIT
- Publication number 20240332080
- Publication date Oct 3, 2024
- Oki Electric Industry Co., Ltd.
- Hironori FURUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...
- Publication number 20240297078
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
- Publication number 20240274468
- Publication date Aug 15, 2024
- Adolf SCHONER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240194530
- Publication date Jun 13, 2024
- DENSO CORPORATION
- SHOSUKE NAKABAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT-OFF METHOD
- Publication number 20240038591
- Publication date Feb 1, 2024
- Disco Corporation
- Masato TERAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wide Band Gap Semiconductor Process, Device, and Method
- Publication number 20240006242
- Publication date Jan 4, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Exfoliation Method
- Publication number 20240006243
- Publication date Jan 4, 2024
- ThinSiC Inc.
- Tirunelveli Subramaniam Ravi
- C30 - CRYSTAL GROWTH
Information Patent Application
COUPON WAFER AND METHOD OF PREPARATION THEREOF
- Publication number 20230420305
- Publication date Dec 28, 2023
- ROCKLEY PHOTONICS LIMITED
- Ludovic CARO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20230411205
- Publication date Dec 21, 2023
- SOITEC
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
- Publication number 20230377973
- Publication date Nov 23, 2023
- ROHM CO., LTD.
- Masatoshi AKETA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
- Publication number 20230361196
- Publication date Nov 9, 2023
- Infineon Techmologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
- Publication number 20230330769
- Publication date Oct 19, 2023
- INFINEON TECHNOLOGIES AG
- Ralf Rieske
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING PROCESS INCLUDING FORMING A BOND...
- Publication number 20230335441
- Publication date Oct 19, 2023
- SANDISK TECHNOLOGIES LLC
- Takuya MAEHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
- Publication number 20230307234
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tse-An CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING SYSTEM AND CHIP BONDING METHOD
- Publication number 20230307284
- Publication date Sep 28, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PRODUCING AN OPTOELECTRONIC DEVICE
- Publication number 20230275173
- Publication date Aug 31, 2023
- Antora Energy, Inc.
- Andrew Joseph PONEC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...
- Publication number 20230260841
- Publication date Aug 17, 2023
- SOITEC
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20230245927
- Publication date Aug 3, 2023
- Kioxia Corporation
- Hidekazu HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230238308
- Publication date Jul 27, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE
- Publication number 20230230851
- Publication date Jul 20, 2023
- University of South Carolina
- ASIF KHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230203709
- Publication date Jun 29, 2023
- DENSO CORPORATION
- HIROAKI FUJIBAYASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR SEPARATING A SOLID BODY
- Publication number 20230106978
- Publication date Apr 6, 2023
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...
- Publication number 20230096632
- Publication date Mar 30, 2023
- KIOXIA Corporation
- Shunsuke OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTINUOUS ARRAY LAYER
- Publication number 20230101190
- Publication date Mar 30, 2023
- Chen-Fu CHU
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF REMOVING A SUBSTRATE WITH A CLEAVING TECHNIQUE
- Publication number 20230005793
- Publication date Jan 5, 2023
- The Regents of the University of California
- Takeshi Kamikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR THIN-FILM FABRICATION
- Publication number 20220367275
- Publication date Nov 17, 2022
- Jani Oksanen
- H01 - BASIC ELECTRIC ELEMENTS

leaving a reusable substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and structure for thin-film fabrication

Method for producing wafers with modification lines of defined orie...

Semiconductor device manufacturing method and wafer-attached structure

Semiconductor device, method of manufacturing semiconductor device,...

Nonpolar or semipolar group III-nitride substrates

Method for transferring blocks from a donor substrate onto a receiv...

Transferring large-area group III-nitride semiconductor material an...

Method for separating a solid body

Crystal efficient SiC device wafer production

Method for producing GaN layered substrate

Methods for processing a wide band gap semiconductor wafer using a...

Processed wafer and method of manufacturing chip formation wafer

Method for reducing the thickness of solid-state layers provided wi...

Patterned nanochannel sacrificial layer for semiconductor substrate...

Laser lift-off method for separating substrate and semiconductor-ep...

Method for manufacturing gallium nitride semiconductor device

Method for transferring blocks from a donor substrate onto a receiv...

Reusable nitride wafer, method of making, and use thereof

Glass substrate, laminated substrate, and laminate

Semiconductor device manufacturing method and wafer-attached structure

Methods of re-using a silicon carbide substrate

Parent substrate, wafer composite and methods of manufacturing crys...

Silicon carbide components and methods for producing silicon carbid...

Reusable wide bandgap semiconductor substrate

Semiconductor device with two-dimensional materials

Method of manufacturing group III nitride semiconductor substrate,...

Semiconductor device, method of manufacturing semiconductor device,...

Water soluble oxide liftoff layers for GaAs photovoltaics

Method for manufacturing semiconductor structure

Micro-LED display device and a manufacturing method thereof

Patents Applicationslast 30 patents

Process for the Pulsed Laser Ejection of Multiple Epitaxial Structu...

METHOD FOR REMOVING EPITAXIAL LAYER AND RESPECTIVE SEMICONDUCTOR ST...

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF SUBSTRATE UNIT, AND SUBSTRATE UNIT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...

CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

LIFT-OFF METHOD

Wide Band Gap Semiconductor Process, Device, and Method

Semiconductor Exfoliation Method

COUPON WAFER AND METHOD OF PREPARATION THEREOF

METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE

Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...

Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...

SEMICONDUCTOR DEVICE MANUFACTURING PROCESS INCLUDING FORMING A BOND...

SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS

CHIP BONDING SYSTEM AND CHIP BONDING METHOD

STRUCTURES AND METHODS FOR PRODUCING AN OPTOELECTRONIC DEVICE

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE

SILICON CARBIDE WAFER AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR SEPARATING A SOLID BODY

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...

SEMICONDUCTOR CONTINUOUS ARRAY LAYER

METHOD OF REMOVING A SUBSTRATE WITH A CLEAVING TECHNIQUE

METHOD AND STRUCTURE FOR THIN-FILM FABRICATION