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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/7813
leaving a reusable substrate
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last 30 patents
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Patent Grant
Method for producing GaN layered substrate
Patent number
11,967,530
Issue date
Apr 23, 2024
Shin-Etsu Chemical Co., Ltd.
Sumio Sekiyama
B32 - LAYERED PRODUCTS
Information
Patent Grant
Methods for processing a wide band gap semiconductor wafer using a...
Patent number
11,887,894
Issue date
Jan 30, 2024
Infineon Technologies AG
Francisco Javier Santos Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processed wafer and method of manufacturing chip formation wafer
Patent number
11,881,407
Issue date
Jan 23, 2024
Denso Corporation
Masatake Nagaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for reducing the thickness of solid-state layers provided wi...
Patent number
11,869,810
Issue date
Jan 9, 2024
Siltectra GmbH
Marko Swoboda
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Patterned nanochannel sacrificial layer for semiconductor substrate...
Patent number
11,830,733
Issue date
Nov 28, 2023
Alliance for Sustainable Energy, LLC
John Stanley Mangum
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser lift-off method for separating substrate and semiconductor-ep...
Patent number
11,784,094
Issue date
Oct 10, 2023
SKY TECH INC.
Jing-Cheng Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing gallium nitride semiconductor device
Patent number
11,784,039
Issue date
Oct 10, 2023
Denso Corporation
Jun Kojima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for transferring blocks from a donor substrate onto a receiv...
Patent number
11,776,843
Issue date
Oct 3, 2023
Soitec
Didier Landru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reusable nitride wafer, method of making, and use thereof
Patent number
RE49677
Issue date
Oct 3, 2023
SLT TECHNOLOGIES, INC.
Mark P. D'Evelyn
Information
Patent Grant
Glass substrate, laminated substrate, and laminate
Patent number
11,753,330
Issue date
Sep 12, 2023
AGC Inc.
Yu Hanawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
Patent number
11,742,243
Issue date
Aug 29, 2023
Rohm Co., Ltd.
Masatoshi Aketa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of re-using a silicon carbide substrate
Patent number
11,735,642
Issue date
Aug 22, 2023
Infineon Technologies AG
Hans-Joachim Schulze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Parent substrate, wafer composite and methods of manufacturing crys...
Patent number
11,712,749
Issue date
Aug 1, 2023
Infineon Technologies AG
Ralf Rieske
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Silicon carbide components and methods for producing silicon carbid...
Patent number
11,715,768
Issue date
Aug 1, 2023
Infineon Technologies AG
Roland Rupp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reusable wide bandgap semiconductor substrate
Patent number
11,710,662
Issue date
Jul 25, 2023
United Silicon Carbide, Inc.
Anup Bhalla
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with two-dimensional materials
Patent number
11,688,605
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Tse-An Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing group III nitride semiconductor substrate,...
Patent number
11,680,339
Issue date
Jun 20, 2023
Furukawa Co., Ltd.
Yujiro Ishihara
C01 - INORGANIC CHEMISTRY
Information
Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
Patent number
11,652,000
Issue date
May 16, 2023
Kioxia Corporation
Hidekazu Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Water soluble oxide liftoff layers for GaAs photovoltaics
Patent number
11,621,365
Issue date
Apr 4, 2023
Alliance for Sustainable Energy, LLC
Andrew Gordon Norman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor structure
Patent number
11,587,824
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Yu-Hsiang Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro-LED display device and a manufacturing method thereof
Patent number
11,581,291
Issue date
Feb 14, 2023
GoerTek Inc.
Peixuan Chen
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Wafer separating method
Patent number
11,551,934
Issue date
Jan 10, 2023
Kioxia Corporation
Sho Kawadahara
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Method for producing a detachment area in a solid body
Patent number
11,527,441
Issue date
Dec 13, 2022
Siltectra GmbH
Christian Beyer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of removing a substrate with a cleaving technique
Patent number
11,508,620
Issue date
Nov 22, 2022
The Regents of the University of California
Takeshi Kamikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a layer by cyclic epitaxy
Patent number
11,424,121
Issue date
Aug 23, 2022
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Vincent Mazzocchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
IR assisted fan-out wafer level packaging using silicon handler
Patent number
11,348,833
Issue date
May 31, 2022
International Business Machines Corporation
Bing Dang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional memory device including III-V compound semiconduc...
Patent number
11,302,713
Issue date
Apr 12, 2022
SanDisk Technologies LLC
Ashish Kumar Baraskar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and wafer-attached structure
Patent number
11,264,280
Issue date
Mar 1, 2022
Rohm Co., Ltd.
Masatoshi Aketa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor substrate, semiconductor element and method for produ...
Patent number
11,264,241
Issue date
Mar 1, 2022
Tamura Corporation
Akito Kuramata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser lift off systems and methods
Patent number
11,239,116
Issue date
Feb 1, 2022
IPG Photonics Corporation
Jeffrey P. Sercel
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
LIFT-OFF METHOD
Publication number
20240038591
Publication date
Feb 1, 2024
Disco Corporation
Masato TERAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wide Band Gap Semiconductor Process, Device, and Method
Publication number
20240006242
Publication date
Jan 4, 2024
ThinSiC Inc.
Tirunelveli Subramaniam Ravi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Exfoliation Method
Publication number
20240006243
Publication date
Jan 4, 2024
ThinSiC Inc.
Tirunelveli Subramaniam Ravi
C30 - CRYSTAL GROWTH
Information
Patent Application
COUPON WAFER AND METHOD OF PREPARATION THEREOF
Publication number
20230420305
Publication date
Dec 28, 2023
ROCKLEY PHOTONICS LIMITED
Ludovic CARO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING A STRAINED SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
Publication number
20230411205
Publication date
Dec 21, 2023
SOITEC
Didier Landru
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WAFER-ATTACHED STRUCTURE
Publication number
20230377973
Publication date
Nov 23, 2023
ROHM CO., LTD.
Masatoshi AKETA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods of Forming Semiconductor Devices in a Layer of Epitaxial Si...
Publication number
20230361196
Publication date
Nov 9, 2023
Infineon Techmologies AG
Hans-Joachim Schulze
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Parent Substrate, Wafer Composite and Methods of Manufacturing Crys...
Publication number
20230330769
Publication date
Oct 19, 2023
INFINEON TECHNOLOGIES AG
Ralf Rieske
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING PROCESS INCLUDING FORMING A BOND...
Publication number
20230335441
Publication date
Oct 19, 2023
SANDISK TECHNOLOGIES LLC
Takuya MAEHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH TWO-DIMENSIONAL MATERIALS
Publication number
20230307234
Publication date
Sep 28, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Tse-An CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP BONDING SYSTEM AND CHIP BONDING METHOD
Publication number
20230307284
Publication date
Sep 28, 2023
BONDTECH CO., LTD.
Akira YAMAUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES AND METHODS FOR PRODUCING AN OPTOELECTRONIC DEVICE
Publication number
20230275173
Publication date
Aug 31, 2023
Antora Energy, Inc.
Andrew Joseph PONEC
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...
Publication number
20230260841
Publication date
Aug 17, 2023
SOITEC
Ionut Radu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
Publication number
20230245927
Publication date
Aug 3, 2023
Kioxia Corporation
Hidekazu HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230238308
Publication date
Jul 27, 2023
Vanguard International Semiconductor Corporation
Hsiu-Mei YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSFER OF WIDE AND ULTRAWIDE BANDGAP LAYERS TO ENGINEERED SUBSTRATE
Publication number
20230230851
Publication date
Jul 20, 2023
University of South Carolina
ASIF KHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE WAFER AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230203709
Publication date
Jun 29, 2023
DENSO CORPORATION
HIROAKI FUJIBAYASHI
C30 - CRYSTAL GROWTH
Information
Patent Application
METHOD FOR SEPARATING A SOLID BODY
Publication number
20230106978
Publication date
Apr 6, 2023
SILTECTRA GMBH
Christian Beyer
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AN...
Publication number
20230096632
Publication date
Mar 30, 2023
KIOXIA Corporation
Shunsuke OKADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CONTINUOUS ARRAY LAYER
Publication number
20230101190
Publication date
Mar 30, 2023
Chen-Fu CHU
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
METHOD OF REMOVING A SUBSTRATE WITH A CLEAVING TECHNIQUE
Publication number
20230005793
Publication date
Jan 5, 2023
The Regents of the University of California
Takeshi Kamikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE FOR THIN-FILM FABRICATION
Publication number
20220367275
Publication date
Nov 17, 2022
Jani Oksanen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220352027
Publication date
Nov 3, 2022
DENSO CORPORATION
Shinichi Hoshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEPARATING DEVICE AND METHOD OF SEPARATION
Publication number
20220344208
Publication date
Oct 27, 2022
Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Kaijun WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PATTERNED NANOCHANNEL SACRIFICIAL LAYER FOR SEMICONDUCTOR SUBSTRATE...
Publication number
20220310389
Publication date
Sep 29, 2022
ALLIANCE FOR SUSTAINABLE ENERGY, LLC
John Stanley MANGUM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER LIFT-OFF METHOD FOR SEPARATING SUBSTRATE AND SEMICONDUCTOR-EP...
Publication number
20220285218
Publication date
Sep 8, 2022
SKY TECH INC.
JING-CHENG LIN
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR CHIP, PROCESSED WAFER, AND METHOD FOR MANUFACTURING S...
Publication number
20220285219
Publication date
Sep 8, 2022
DENSO CORPORATION
MASATAKE NAGAYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER SUBSTRATE AND ELEMENT TRANSFER METHOD USING THE SAME
Publication number
20220270927
Publication date
Aug 25, 2022
Center for Advanced Meta-Materials
Jae Hyun KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CRYSTAL EFFICIENT SIC DEVICE WAFER PRODUCTION
Publication number
20220223476
Publication date
Jul 14, 2022
ASCATRON AB
Adolf SCHÖNER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REMOVING A BAR OF ONE OR MORE DEVICES USING SUPPORTING P...
Publication number
20220181210
Publication date
Jun 9, 2022
The Regents of the University of California
Takeshi Kamikawa
H01 - BASIC ELECTRIC ELEMENTS