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Y10S438/951

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

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Y10S438/951Lift-off

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Patents Grantslast 30 patents

Information Patent Grant
Self-aligned multi-dielectric-layer lift off process for laser diod...
- Patent number 8,728,842
- Issue date May 20, 2014
- Soraa Laser Diode, Inc.
- James W. Raring
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of patterning transparent conductive film, thin film transis...
- Patent number 8,373,339
- Issue date Feb 12, 2013
- LG Display Co., Ltd.
- Byung Chul Ahn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating lED chip comprising reduced mask count
- Patent number 8,178,377
- Issue date May 15, 2012
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating LED chip comprising reduced mask count and l...
- Patent number 8,178,376
- Issue date May 15, 2012
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating LED chip comprising reduced mask count and l...
- Patent number 8,173,468
- Issue date May 8, 2012
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating LED chip comprising reduced mask count and l...
- Patent number 8,173,466
- Issue date May 8, 2012
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating LED chip comprising reduced mask count and l...
- Patent number 8,173,465
- Issue date May 8, 2012
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating LED chip comprising reduced mask count and l...
- Patent number 8,173,467
- Issue date May 8, 2012
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-aligned multi-dielectric-layer lift off process for laser diod...
- Patent number 8,143,148
- Issue date Mar 27, 2012
- Soraa, Inc.
- James W. Raring
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device with mushroom electrode and manufacture method...
- Patent number 8,133,775
- Issue date Mar 13, 2012
- Fujitsu Limited
- Kozo Makiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of a semiconductor device and a semiconductor de...
- Patent number 8,124,523
- Issue date Feb 28, 2012
- Tokyo Electron Limited
- Kohei Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating LED chip comprising reduced mask count and l...
- Patent number 7,927,901
- Issue date Apr 19, 2011
- Lextar Electronics Corp.
- Kuo-Lung Fang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin film transistor array panel and manufacturing method thereof
- Patent number 7,915,074
- Issue date Mar 29, 2011
- Samsung Electronics Co., Ltd.
- Soo-Wan Yoon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device with mushroom electrode and manufacture method...
- Patent number 7,888,193
- Issue date Feb 15, 2011
- Fujitsu Limited
- Kozo Makiyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of patterning transparent conductive film, thin film transis...
- Patent number 7,887,710
- Issue date Feb 15, 2011
- LG Display Co., Ltd.
- Byung Chul Ahn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin-film transistor substrate and method of fabricating the same
- Patent number 7,858,412
- Issue date Dec 28, 2010
- Samsung Electronics Co., Ltd.
- Joo-Han Kim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation of interconnects through lift-off processing
- Patent number 7,790,605
- Issue date Sep 7, 2010
- Dongbu Electronics Co., Ltd.
- Jae-Won Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with mushroom electrode and manufacture method...
- Patent number 7,709,310
- Issue date May 4, 2010
- Fujitsu Limited
- Kozo Markiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods of metal wire, electrode and TFT array substrate
- Patent number 7,696,088
- Issue date Apr 13, 2010
- Beijing BOE Optoelectronics Technology Co., Ltd
- Chunping Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Refurbishing a wafer having a low-k dielectric layer
- Patent number 7,695,982
- Issue date Apr 13, 2010
- Applied Matreials, Inc.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of redistribution circuit structure
- Patent number 7,648,902
- Issue date Jan 19, 2010
- Chipmos Technologies (Bermuda) Ltd.
- Xuan-Feng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display device and fabricating method thereof
- Patent number 7,626,206
- Issue date Dec 1, 2009
- LG Display Co., Ltd.
- Byung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stencil and method for depositing material onto a substrate
- Patent number 7,588,965
- Issue date Sep 15, 2009
- Intel Corporation
- Jeffrey R. Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming solder bump with reduced surface defects
- Patent number 7,553,751
- Issue date Jun 30, 2009
- Samsung Electronics Co., Ltd.
- Se-Young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an array substrate including forming a transpare...
- Patent number 7,547,590
- Issue date Jun 16, 2009
- AU Optronics Corp.
- Chih-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution circuit structure
- Patent number 7,498,251
- Issue date Mar 3, 2009
- Chipmos Technologies (Bermuda) Ltd.
- Xuan-Feng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with mushroom electrode and manufacture method...
- Patent number 7,335,542
- Issue date Feb 26, 2008
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning transparent conductive film, thin film transis...
- Patent number 7,316,784
- Issue date Jan 8, 2008
- LG.Philips LCD Co., Ltd.
- Byung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display device and method of fabricating the same
- Patent number 7,315,344
- Issue date Jan 1, 2008
- LG.Philips LCD Co., Ltd.
- Byoung Ho Lim
- G02 - OPTICS
Information Patent Grant
Semiconductor device with mushroom electrode and manufacture method...
- Patent number 7,223,645
- Issue date May 29, 2007
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Self-Aligned Multi-Dielectric-Layer Lift Off Process for Laser Diod...
- Publication number 20120178198
- Publication date Jul 12, 2012
- SORAA, INC.
- James W. Raring
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method for Fabricating LED Chip Comprising Reduced Mask Count and L...
- Publication number 20110165705
- Publication date Jul 7, 2011
- LEXTAR ELECTRONICS CORP.
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating LED Chip Comprising Reduced Mask Count and L...
- Publication number 20110165706
- Publication date Jul 7, 2011
- LEXTAR ELECTRONICS CORP.
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating LED Chip Comprising Reduced Mask Count and L...
- Publication number 20110159613
- Publication date Jun 30, 2011
- LEXTAR ELECTRONICS CORP.
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating LED Chip Comprising Reduced Mask Count and L...
- Publication number 20110159614
- Publication date Jun 30, 2011
- LEXTAR ELECTRONICS CORP.
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating LED Chip Comprising Reduced Mask Count and L...
- Publication number 20110159623
- Publication date Jun 30, 2011
- LEXTAR ELECTRONICS CORP.
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating LED Chip Comprising Reduced Mask Count and L...
- Publication number 20110159612
- Publication date Jun 30, 2011
- LEXTAR ELECTRONICS CORP.
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING TRANSPARENT CONDUCTIVE FILM, THIN FILM TRANSIS...
- Publication number 20110096270
- Publication date Apr 28, 2011
- Byung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD...
- Publication number 20110097886
- Publication date Apr 28, 2011
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD...
- Publication number 20100173486
- Publication date Jul 8, 2010
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DE...
- Publication number 20100025856
- Publication date Feb 4, 2010
- TOKYO ELECTRON LIMITED
- Kohei Kawamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING LIGHT EMITTING DIODE CHIP
- Publication number 20100015742
- Publication date Jan 21, 2010
- AU OPTRONICS CORPORATION
- Kuo-Lung Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20100001275
- Publication date Jan 7, 2010
- Samsung Electronics Co., Ltd.
- Joo-Han KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF REDISTRIBUTION CIRCUIT STRUCTURE
- Publication number 20090130839
- Publication date May 21, 2009
- CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
- Xuan-Feng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20080169558
- Publication date Jul 17, 2008
- CHIPMOS TECHNOLOGIES (BERMUDA) LTD.
- Xuan-Feng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS OF METAL WIRE, ELECTRODE AND TFT ARRAY SUBSTRATE
- Publication number 20080166838
- Publication date Jul 10, 2008
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Chunping Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of patterning transparent conductive film, thin film transis...
- Publication number 20080164472
- Publication date Jul 10, 2008
- LG. Philips LCD Co., Ltd.
- Byung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with mushroom electrode and manufacture method...
- Publication number 20080113499
- Publication date May 15, 2008
- Fujitsu Limited
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ARRAY SUBSTRATE
- Publication number 20080044953
- Publication date Feb 21, 2008
- AU Optronics Corp.
- Chih-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF
- Publication number 20070252142
- Publication date Nov 1, 2007
- Samsung Electronics Co., Ltd.
- Soo-Wan YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid crystal display device and fabricating method thereof
- Publication number 20070205422
- Publication date Sep 6, 2007
- Byung Chul Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER BY CHEMICAL MECHANIC...
- Publication number 20070190791
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER
- Publication number 20070190798
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE GRINDING A LOW-K DIELECTRIC LAYER OFF A WAFER
- Publication number 20070190790
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFURBISHING A WAFER HAVING A LOW-K DIELECTRIC LAYER
- Publication number 20070190799
- Publication date Aug 16, 2007
- APPLIED MATERIALS, INC.
- Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with mushroom electrode and manufacture method...
- Publication number 20070161220
- Publication date Jul 12, 2007
- FUJITSU LIMITED
- Kozo Makiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20070152337
- Publication date Jul 5, 2007
- Dongbu Electronics Co., Ltd.
- Jae-Won Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming solder bump with reduced surface defects
- Publication number 20070020913
- Publication date Jan 25, 2007
- Se-Young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stencil and method for depositing material onto a substrate
- Publication number 20060249858
- Publication date Nov 9, 2006
- Jeffrey R. Watson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for patterning dielectric material, and methods for alignin...
- Publication number 20060183331
- Publication date Aug 17, 2006
- James J. Hofmann
- B82 - NANO-TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Self-aligned multi-dielectric-layer lift off process for laser diod...

Method of patterning transparent conductive film, thin film transis...

Method for fabricating lED chip comprising reduced mask count

Method for fabricating LED chip comprising reduced mask count and l...

Method for fabricating LED chip comprising reduced mask count and l...

Method for fabricating LED chip comprising reduced mask count and l...

Method for fabricating LED chip comprising reduced mask count and l...

Method for fabricating LED chip comprising reduced mask count and l...

Self-aligned multi-dielectric-layer lift off process for laser diod...

Semiconductor device with mushroom electrode and manufacture method...

Fabrication method of a semiconductor device and a semiconductor de...

Method for fabricating LED chip comprising reduced mask count and l...

Thin film transistor array panel and manufacturing method thereof

Semiconductor device with mushroom electrode and manufacture method...

Method of patterning transparent conductive film, thin film transis...

Thin-film transistor substrate and method of fabricating the same

Formation of interconnects through lift-off processing

Semiconductor device with mushroom electrode and manufacture method...

Manufacturing methods of metal wire, electrode and TFT array substrate

Refurbishing a wafer having a low-k dielectric layer

Manufacturing method of redistribution circuit structure

Liquid crystal display device and fabricating method thereof

Stencil and method for depositing material onto a substrate

Method of forming solder bump with reduced surface defects

Method for forming an array substrate including forming a transpare...

Redistribution circuit structure

Semiconductor device with mushroom electrode and manufacture method...

Method of patterning transparent conductive film, thin film transis...

Liquid crystal display device and method of fabricating the same

Semiconductor device with mushroom electrode and manufacture method...

Patents Applicationslast 30 patents

Self-Aligned Multi-Dielectric-Layer Lift Off Process for Laser Diod...

Method for Fabricating LED Chip Comprising Reduced Mask Count and L...

Method for Fabricating LED Chip Comprising Reduced Mask Count and L...

Method for Fabricating LED Chip Comprising Reduced Mask Count and L...

Method for Fabricating LED Chip Comprising Reduced Mask Count and L...

Method for Fabricating LED Chip Comprising Reduced Mask Count and L...

Method for Fabricating LED Chip Comprising Reduced Mask Count and L...

METHOD OF PATTERNING TRANSPARENT CONDUCTIVE FILM, THIN FILM TRANSIS...

SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD...

SEMICONDUCTOR DEVICE WITH MUSHROOM ELECTRODE AND MANUFACTURE METHOD...

FABRICATION METHOD OF A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DE...

METHOD FOR FABRICATING LIGHT EMITTING DIODE CHIP

THIN-FILM TRANSISTOR SUBSTRATE AND METHOD OF FABRICATING THE SAME

MANUFACTURING METHOD OF REDISTRIBUTION CIRCUIT STRUCTURE

REDISTRIBUTION CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHODS OF METAL WIRE, ELECTRODE AND TFT ARRAY SUBSTRATE

Method of patterning transparent conductive film, thin film transis...

Semiconductor device with mushroom electrode and manufacture method...

METHOD FOR FORMING AN ARRAY SUBSTRATE

THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD THEREOF

Liquid crystal display device and fabricating method thereof

REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER BY CHEMICAL MECHANIC...

REMOVING A LOW-K DIELECTRIC LAYER FROM A WAFER

FINE GRINDING A LOW-K DIELECTRIC LAYER OFF A WAFER

REFURBISHING A WAFER HAVING A LOW-K DIELECTRIC LAYER

Semiconductor device with mushroom electrode and manufacture method...

Semiconductor device and manufacturing method therefor

Method of forming solder bump with reduced surface defects

Stencil and method for depositing material onto a substrate

Methods for patterning dielectric material, and methods for alignin...