Lithium niobate [LiNbO3]

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CPC
H01L2924/1068

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1068Lithium niobate [LiNbO3]

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip high speed components with underfill
- Patent number 10,811,279
- Issue date Oct 20, 2020
- Ciena Corporation
- Francois Pelletier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting a plurality of unpackaged substrates
- Patent number 9,165,905
- Issue date Oct 20, 2015
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFOR
- Publication number 20230207307
- Publication date Jun 29, 2023
- Shin-Etsu Chemical Co., Ltd.
- Shoji AKIYAMA
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for Connecting a Plurality of Unpackaged Substrates
- Publication number 20120159778
- Publication date Jun 28, 2012
- EPCOS AG
- Hans Krueger
- B81 - MICRO-STRUCTURAL TECHNOLOGY