Load or pressure adjusting means

Industry

CPC
H01L2224/7592

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7592Load or pressure adjusting means

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device manufacturing device and manufacturing method
- Patent number 12,176,317
- Issue date Dec 24, 2024
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding head for mounting components and die bonder with such a bon...
- Patent number 12,046,490
- Issue date Jul 23, 2024
- Besi Switzerland AG
- Rene Kroehnert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for enhanced microelectronic device handling
- Patent number 11,911,904
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and film supply apparatus
- Patent number 11,848,219
- Issue date Dec 19, 2023
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, control method and control device of semiconductor packa...
- Patent number 11,774,935
- Issue date Oct 3, 2023
- CAPCON LIMITED
- Hong Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering press and method for sintering electronic components on a...
- Patent number 11,380,647
- Issue date Jul 5, 2022
- AMX—AUTOMATRIX S.R.L.
- Nicola Schivalocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 11,315,901
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser reflow apparatus and method for electronic components with mi...
- Patent number 11,276,665
- Issue date Mar 15, 2022
- LASERSSEL CO., LTD.
- Nam Seong Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for setting conditions for heating semiconductor chip during...
- Patent number 11,201,132
- Issue date Dec 14, 2021
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method
- Patent number 11,201,133
- Issue date Dec 14, 2021
- Samsung Display Co., Ltd.
- Joo Nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus incorporating variable force distribution
- Patent number 11,121,113
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element bonding apparatus and semiconductor element b...
- Patent number 11,037,901
- Issue date Jun 15, 2021
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Operating method for an ultrasonic wire bonder with active and pass...
- Patent number 10,960,488
- Issue date Mar 30, 2021
- Hesse GmbH
- Matthias Hunstig
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatuses of bonding substrates and methods of bonding substrates
- Patent number 10,833,047
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Hoe Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for correcting a parallelism between a bonding head and a...
- Patent number 10,692,833
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding apparatus and wafer bonding system including the same
- Patent number 10,639,875
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Tae-yeong Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for stacking semiconductor chips in a semiconductor package
- Patent number 10,483,150
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Gun-Ah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component bonding device and electronic component mounter
- Patent number 10,462,950
- Issue date Oct 29, 2019
- FUJI CORPORATION
- Masaki Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing apparatus and method
- Patent number 10,347,603
- Issue date Jul 9, 2019
- TOSHIBA MEMORY CORPORATION
- Masayuki Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using plasma gas
- Patent number 10,297,567
- Issue date May 21, 2019
- Intel Corporation
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 10,199,349
- Issue date Feb 5, 2019
- Toray Engineering Co., Ltd.
- Katsumi Terada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus
- Patent number 10,181,451
- Issue date Jan 15, 2019
- Shinkawa Ltd.
- Akira Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 10,022,859
- Issue date Jul 17, 2018
- Apple Inc.
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Component mounting apparatus
- Patent number 9,842,824
- Issue date Dec 12, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Akira Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic assembling system
- Patent number 9,750,170
- Issue date Aug 29, 2017
- TE Connectivity Corporation
- Lvhai Hu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of operating bonding machines for bonding semiconductor ele...
- Patent number 9,478,516
- Issue date Oct 25, 2016
- Kulicke and Soffa Industries, Inc.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip bonder and method of correcting flatness and deformation...
- Patent number 9,406,640
- Issue date Aug 2, 2016
- Shinkawa Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...
- Publication number 20240421118
- Publication date Dec 19, 2024
- MB Automation GmbH & Co. KG
- Benjamin Holzner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...
- Publication number 20240170450
- Publication date May 23, 2024
- SAFRAN ELECTRONICS & DEFENSE
- Jean-Christophe RIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES
- Publication number 20240139940
- Publication date May 2, 2024
- Micron Technology, Inc.
- Kuan Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20230230853
- Publication date Jul 20, 2023
- SHINKAWA LTD.
- Daisuke TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20220173068
- Publication date Jun 2, 2022
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser reflow apparatus and method for electronic components with mi...
- Publication number 20220157768
- Publication date May 19, 2022
- LASERSSEL CO., LTD.
- Nam Seong KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING APPARATUS AND FILM SUPPLY APPARATUS
- Publication number 20210242051
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION
- Publication number 20210225800
- Publication date Jul 22, 2021
- ASM Technology Singapore Pte Ltd
- Ming Yeung WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...
- Publication number 20200286854
- Publication date Sep 10, 2020
- SHINKAWA LTD.
- Tomonori NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...
- Publication number 20200241498
- Publication date Jul 30, 2020
- CAPCON LIMITED
- Hong Gang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...
- Publication number 20200235071
- Publication date Jul 23, 2020
- Toyota Jidosha Kabushiki Kaisha
- Hideyuki MURAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING SUBSTRATES
- Publication number 20200168580
- Publication date May 28, 2020
- EV GROUP E. THALLNER GMBH
- Dominik ZINNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD
- Publication number 20200168581
- Publication date May 28, 2020
- SAMSUNG DISPLAY CO., LTD.
- Joo Nyung JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES OF BONDING SUBSTRATES AND METHODS OF BONDING SUBSTRATES
- Publication number 20200152596
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Hoe Chul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser reflow apparatus and method for electronic components with mi...
- Publication number 20200091108
- Publication date Mar 19, 2020
- LASERSSEL CO., LTD.
- Nam Seong KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...
- Publication number 20190326250
- Publication date Oct 24, 2019
- AMX - AUTOMATRIX S.R.L.
- Nicola SCHIVALOCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A...
- Publication number 20180102340
- Publication date Apr 12, 2018
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20180019223
- Publication date Jan 18, 2018
- TORAY ENGINEERING CO., LTD.
- Katsumi TERADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING A SEMICONDUCTOR CHIP AND METHOD OF FORMING A...
- Publication number 20170352642
- Publication date Dec 7, 2017
- SK HYNIX INC.
- Byung Chul KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING USING PLASMA GAS
- Publication number 20170179070
- Publication date Jun 22, 2017
- Donglai David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS
- Publication number 20170154865
- Publication date Jun 1, 2017
- SHINKAWA LTD.
- Akira SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD
- Publication number 20160336291
- Publication date Nov 17, 2016
- Kabushiki Kaisha Toshiba
- Masayuki MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDER AND METHOD OF CORRECTING FLATNESS AND DEFORMATION...
- Publication number 20160043053
- Publication date Feb 11, 2016
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...
- Publication number 20160005709
- Publication date Jan 7, 2016
- KULICKE AND SOFFA INDUSTRIES, INC.
- Matthew B. Wasserman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...
- Publication number 20150380379
- Publication date Dec 31, 2015
- MRSI Systems, LLC
- Cyriac Devasia
- H01 - BASIC ELECTRIC ELEMENTS

Load or pressure adjusting means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device manufacturing device and manufacturing method

Bonding head for mounting components and die bonder with such a bon...

Apparatus and methods for enhanced microelectronic device handling

Mounting apparatus and film supply apparatus

Apparatus, control method and control device of semiconductor packa...

Sintering press and method for sintering electronic components on a...

Method for bonding substrates

Die features for self-alignment during die bonding

Laser reflow apparatus and method for electronic components with mi...

Method for setting conditions for heating semiconductor chip during...

Bonding apparatus and method

Bonding apparatus incorporating variable force distribution

Semiconductor element bonding apparatus and semiconductor element b...

Operating method for an ultrasonic wire bonder with active and pass...

Apparatuses of bonding substrates and methods of bonding substrates

Apparatus for correcting a parallelism between a bonding head and a...

Wafer bonding apparatus and wafer bonding system including the same

Method for bonding substrates together, and substrate bonding device

Apparatus for stacking semiconductor chips in a semiconductor package

Electronic component bonding device and electronic component mounter

Semiconductor device manufacturing apparatus and method

Thermocompression bonding using plasma gas

Mounting device and mounting method

Electronic component mounting apparatus

Apparatus and method for manufacturing semiconductor device

Mass transfer tool manipulator assembly

Component mounting apparatus

Automatic assembling system

Methods of operating bonding machines for bonding semiconductor ele...

Flip chip bonder and method of correcting flatness and deformation...

Patents Applicationslast 30 patents

THERMOCOMPRESSION APPARATUS AND METHOD FOR BONDING ELECTRICAL COMPO...

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ONTO A SUBSTRATE BY MEA...

APPARATUSES FOR HANDLING MICROELECTRONIC DEVICES

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

APPARATUS AND METHOD FOR BONDING SUBSTRATES

Laser reflow apparatus and method for electronic components with mi...

MOUNTING APPARATUS AND FILM SUPPLY APPARATUS

BONDING APPARATUS INCORPORATING VARIABLE FORCE DISTRIBUTION

METHOD FOR SETTING CONDITIONS FOR HEATING SEMICONDUCTOR CHIP DURING...

APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...

SEMICONDUCTOR ELEMENT BONDING APPARATUS AND SEMICONDUCTOR ELEMENT B...

APPARATUS AND METHOD FOR BONDING SUBSTRATES

BONDING APPARATUS AND METHOD

APPARATUSES OF BONDING SUBSTRATES AND METHODS OF BONDING SUBSTRATES

Laser reflow apparatus and method for electronic components with mi...

SINTERING PRESS AND METHOD FOR SINTERING ELECTRONIC COMPONENTS ON A...

APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A...

MOUNTING DEVICE AND MOUNTING METHOD

APPARATUS FOR BONDING A SEMICONDUCTOR CHIP AND METHOD OF FORMING A...

THERMOCOMPRESSION BONDING USING PLASMA GAS

ELECTRONIC COMPONENT MOUNTING APPARATUS

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

FLIP CHIP BONDER AND METHOD OF CORRECTING FLATNESS AND DEFORMATION...

METHODS OF OPERATING BONDING MACHINES FOR BONDING SEMICONDUCTOR ELE...

SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...