Load or pressure adjusting means

Industry

CPC
H01L2224/7892

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7892Load or pressure adjusting means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,935,864
- Issue date Mar 19, 2024
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Force sensor in an ultrasonic wire bonding device
- Patent number 11,798,911
- Issue date Oct 24, 2023
- ASMPT SINGAPORE PTE. LTD.
- Hing Leung Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,515,285
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,462,506
- Issue date Oct 4, 2022
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for calibrating wire clamp device
- Patent number 11,257,781
- Issue date Feb 22, 2022
- Shinkawa Ltd.
- Noboru Fujino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 11,011,492
- Issue date May 18, 2021
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic transducer systems including tuned resonators, equipment...
- Patent number 10,381,321
- Issue date Aug 13, 2019
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 9,978,713
- Issue date May 22, 2018
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of adjusting ultrasonic bonding energy on wire bonding mach...
- Patent number 9,153,554
- Issue date Oct 6, 2015
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad assessment for wire bonding
- Patent number 8,657,180
- Issue date Feb 25, 2014
- ASM Technology Singapore Pte. Ltd.
- Ming Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for measuring the amplitude of a freely oscillati...
- Patent number 6,691,574
- Issue date Feb 17, 2004
- ESEC Trading SA
- Peter Hess
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20230154888
- Publication date May 18, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...
- Publication number 20230039460
- Publication date Feb 9, 2023
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...
- Publication number 20210305199
- Publication date Sep 30, 2021
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20210272927
- Publication date Sep 2, 2021
- SHINKAWA LTD.
- Nobuyuki AOYAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...
- Publication number 20190319005
- Publication date Oct 17, 2019
- KULICKE AND SOFFA INDUSTRIES, INC.
- Dominick A. DeAngelis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Producing Wire Bond Connection And Arrangement For Imple...
- Publication number 20180218996
- Publication date Aug 2, 2018
- F&K Delvotec Bondtechnik GmbH
- Franz Schlicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20180151532
- Publication date May 31, 2018
- KAIJO CORPORATION
- Riki JINDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20160351535
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DETECTING WIRE BONDING FAILURES
- Publication number 20140131425
- Publication date May 15, 2014
- ASM Technology Singapore Pte Ltd
- Wei LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND PAD ASSESSMENT FOR WIRE BONDING
- Publication number 20130327812
- Publication date Dec 12, 2013
- Ming LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF ADJUSTING ULTRASONIC BONDING ENERGY ON WIRE BONDING MACH...
- Publication number 20130277414
- Publication date Oct 24, 2013
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for measuring the amplitude of a freely oscillati...
- Publication number 20030159514
- Publication date Aug 28, 2003
- ESEC Trading SA
- Peter Hess
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Load or pressure adjusting means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of optimizing clamping of a semiconductor element against a...

Wire bonding apparatus

Force sensor in an ultrasonic wire bonding device

Methods of optimizing clamping of a semiconductor element against a...

Ultrasonic transducer systems including tuned resonators, equipment...

Method of vertically vibrating a bonding arm

Method for calibrating wire clamp device

Ultrasonic transducer systems including tuned resonators, equipment...

Ultrasonic transducer systems including tuned resonators, equipment...

Method of manufacturing semiconductor device and wire bonding appar...

Methods of adjusting ultrasonic bonding energy on wire bonding mach...

Bond pad assessment for wire bonding

Method and device for measuring the amplitude of a freely oscillati...

Patents Applicationslast 30 patents

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...

METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A...

WIRE BONDING APPARATUS

ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT...

Method For Producing Wire Bond Connection And Arrangement For Imple...

WIRE BONDING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

METHOD OF DETECTING WIRE BONDING FAILURES

BOND PAD ASSESSMENT FOR WIRE BONDING

METHODS OF ADJUSTING ULTRASONIC BONDING ENERGY ON WIRE BONDING MACH...

Method and device for measuring the amplitude of a freely oscillati...