Local interconnects; Local pads, as exemplified by patent document EP0896365

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/76895Local interconnects; Local pads, as exemplified by patent document EP0896365

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Patents Grantslast 30 patents

Information Patent Grant
Deposition window enlargement
- Patent number 12,300,496
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and formation method thereof
- Patent number 12,302,599
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching compositions and methods for fabricating semiconductor devi...
- Patent number 12,297,385
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Min Hyung Cho
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,302,580
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Sanghun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contact formation methods and devices
- Patent number 12,300,539
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry composition and method for polishing and integrated circuit
- Patent number 12,297,375
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Memory device including staircase structure having conductive pads
- Patent number 12,300,616
- Issue date May 13, 2025
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressed gas energy storage system
- Patent number 12,292,037
- Issue date May 6, 2025
- Hydrostor Inc.
- Cameron Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Gap patterning for metal-to-source/drain plugs in a semiconductor d...
- Patent number 12,293,947
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with silicide portion between conduc...
- Patent number 12,288,748
- Issue date Apr 29, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for three-dimensional memory devices and methods...
- Patent number 12,283,547
- Issue date Apr 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 12,283,521
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 12,284,808
- Issue date Apr 22, 2025
- SK hynix Inc.
- Jang Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacture
- Patent number 12,283,532
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method for forming the same
- Patent number 12,283,546
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,279,458
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Joong Gun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate contact structure over active gate and method to fabricate same
- Patent number 12,278,144
- Issue date Apr 15, 2025
- Intel Corporation
- Abhijit Jayant Pethe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,278,141
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,278,140
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tzu-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,278,188
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source resistor
- Patent number 12,272,640
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Zeng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact features of semiconductor device and method of forming same
- Patent number 12,272,600
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature of a semiconductor device
- Patent number 12,272,598
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- U-Ting Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a memory array comprising strings of memory c...
- Patent number 12,266,569
- Issue date Apr 1, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with a nitrided capping layer
- Patent number 12,261,082
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-end-of-line strap for standard cell
- Patent number 12,261,113
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Hung Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of memory device using mask patterns
- Patent number 12,249,516
- Issue date Mar 11, 2025
- SK hynix Inc.
- Kyung Min Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line structure of three-dimensional memory device
- Patent number 12,232,320
- Issue date Feb 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Qiang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,230,538
- Issue date Feb 18, 2025
- Kioxia Corporation
- Shinya Okuda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149447
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PUNCH THROUGH STOPPER IN BULK FINFET DEVICE
- Publication number 20250142855
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Veeraraghavan S. Basker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Device and Methods of Manufacture
- Publication number 20250140610
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...
- Publication number 20250132258
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118596
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND RELATED APPARATUS FOR REDUCING GATE-INDUCED DRAIN LEAKAG...
- Publication number 20250120153
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT
- Publication number 20250118674
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250105057
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...
- Publication number 20250105155
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Geun Won Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105176
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Teppei TSUKAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS
- Publication number 20250096141
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Yonghyeok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION
- Publication number 20250096041
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250098283
- Publication date Mar 20, 2025
- MEDIATEK INC.
- Po-Chao TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250096038
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh SINGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays and Methods Used in Forming a Memory Array Comprising...
- Publication number 20250096042
- Publication date Mar 20, 2025
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING
- Publication number 20250087527
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Prabudhya Roy Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250079297
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Ilsup Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of Manufacture
- Publication number 20250079368
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL
- Publication number 20250079162
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF
- Publication number 20250081604
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20250062193
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...
- Publication number 20250054812
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Qihao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL
- Publication number 20250046719
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD
- Publication number 20250038047
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Anthony J. Villalon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS
- Publication number 20250038111
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS

Local interconnects; Local pads, as exemplified by patent document EP0896365

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deposition window enlargement

Semiconductor device and formation method thereof

Etching compositions and methods for fabricating semiconductor devi...

Semiconductor devices and data storage systems including the same

Source/drain contact formation methods and devices

Slurry composition and method for polishing and integrated circuit

Memory device including staircase structure having conductive pads

Compressed gas energy storage system

Gap patterning for metal-to-source/drain plugs in a semiconductor d...

Semiconductor device structure with silicide portion between conduc...

Contact structures for three-dimensional memory devices and methods...

Methods of forming spacers for semiconductor devices including back...

Three-dimensional semiconductor memory device

Semiconductor structure and method of manufacture

Integrated circuit and method for forming the same

Semiconductor device

Gate contact structure over active gate and method to fabricate same

Semiconductor devices and methods of manufacture

Semiconductor device with composite conductive features and method...

Different via configurations for different via interface requirements

Semiconductor device with source resistor

Contact features of semiconductor device and method of forming same

Conductive feature of a semiconductor device

Integrated circuitry, a memory array comprising strings of memory c...

Semiconductor devices with a nitrided capping layer

Middle-end-of-line strap for standard cell

Manufacturing method of memory device using mask patterns

Offset pads over TSV

Word line structure of three-dimensional memory device

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PUNCH THROUGH STOPPER IN BULK FINFET DEVICE

System, Device and Methods of Manufacture

PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND RELATED APPARATUS FOR REDUCING GATE-INDUCED DRAIN LEAKAG...

STANDARD-CELL LAYOUT STRUCTURE WITH HORN POWER AND SMART METAL CUT

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS

BOTTOM LATERAL EXPANSION OF CONTACT PLUGS THROUGH IMPLANTATION

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Memory Arrays and Methods Used in Forming a Memory Array Comprising...

HANDLER WAFER WITH LOW OVERLAY RESIDUAL BACKSIDE PATTERNING

SEMICONDUCTOR DEVICES

Semiconductor Device Package and Method of Manufacture

DEVICE AND METHOD FOR HIGH PRESSURE ANNEAL

THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SELECTIVE BOTTOM-UP METAL FILL/CAP ON JUNCTION SILICIDE BY SELECTIV...

METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD

SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

STAIRCASE STRUCTURE FOR MEMORY DEVICE