Local interconnects; Local pads, as exemplified by patent document EP0896365

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H01L21/76895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76895Local interconnects; Local pads, as exemplified by patent document EP0896365

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Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor memory device including an ex...
- Patent number 12,218,062
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, device and methods of manufacture
- Patent number 12,218,006
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including self-aligned conductive contacts
- Patent number 12,218,008
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure above a stairc...
- Patent number 12,218,081
- Issue date Feb 4, 2025
- Lodestar Licensing Group LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal spacers and method for fabricating...
- Patent number 12,218,053
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,219,762
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,219,763
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Jisung Cheon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming contact metal
- Patent number 12,211,747
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,211,738
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods used in forming a memory array comprising strings of memory...
- Patent number 12,211,746
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard-cell layout structure with horn power and smart metal cut
- Patent number 12,211,793
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ni-Wan Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and related apparatus for reducing gate-induced drain leakag...
- Patent number 12,211,926
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices, methods for fabricating the same and...
- Patent number 12,199,043
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Geun Won Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate endcap (SAGE) architecture having gate contacts
- Patent number 12,199,101
- Issue date Jan 14, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard and engineering change order (ECO) cell regions and semico...
- Patent number 12,199,037
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chun Tien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a metal-oxide-semiconductor field-effect tr...
- Patent number 12,191,196
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 12,183,700
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with metal-semico...
- Patent number 12,183,793
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 12,183,680
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-silicon via and method of fo...
- Patent number 12,183,660
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for high pressure anneal
- Patent number 12,183,573
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device including a through-via stru...
- Patent number 12,165,976
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL
- Publication number 20250046719
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung-Chan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250046653
- Publication date Feb 6, 2025
- RENESAS ELECTRONICS CORPORATION
- Katsuhiko HOTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD
- Publication number 20250038047
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Anthony J. Villalon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS
- Publication number 20250038111
- Publication date Jan 30, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
- Publication number 20250022881
- Publication date Jan 16, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FO...
- Publication number 20250014993
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015162
- Publication date Jan 9, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250017019
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...
- Publication number 20240413009
- Publication date Dec 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ling XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...
- Publication number 20240413162
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240404876
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY
- Publication number 20240395711
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thereof
- Publication number 20240387664
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20240387369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS

Local interconnects; Local pads, as exemplified by patent document EP0896365

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a semiconductor memory device including an ex...

Backside contact to improve thermal dissipation away from semicondu...

System, device and methods of manufacture

Memory device including self-aligned conductive contacts

Microelectronic devices with a polysilicon structure above a stairc...

Semiconductor device with metal spacers and method for fabricating...

Memory arrays comprising strings of memory cells and methods used i...

Integrated circuit device

Method of forming contact metal

Semiconductor structure and manufacturing method thereof

Methods used in forming a memory array comprising strings of memory...

Standard-cell layout structure with horn power and smart metal cut

Method and related apparatus for reducing gate-induced drain leakag...

TSV as pad

Three-dimensional memory device having staircase structure and meth...

Plasma-damage-resistant interconnect structure and methods for form...

Semiconductor memory devices, methods for fabricating the same and...

Self-aligned gate endcap (SAGE) architecture having gate contacts

Standard and engineering change order (ECO) cell regions and semico...

Method of manufacturing a metal-oxide-semiconductor field-effect tr...

Semiconductor device package and method of manufacture

Method for forming semiconductor device structure with metal-semico...

Semiconductor memory device including wiring contact plugs

Semiconductor device including through-silicon via and method of fo...

Device and method for high pressure anneal

Bottom lateral expansion of contact plugs through implantation

Semiconductor device

Three-dimensional semiconductor device including a through-via stru...

Semiconductor structure with buried power rail, integrated circuit...

Semiconductor devices and method for forming the same

Patents Applicationslast 30 patents

METHOD OF MAKING A SEMICONDUCTOR DEVICE WITH V2V RAIL

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

CAVITY WITH NEGATIVE SLOPED SIDEWALL OVER GATE AND RELATED METHOD

SEMICONDUCTOR DEVICE WITH TRANSISTOR LOCAL INTERCONNECTS

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

STAIRCASE STRUCTURE FOR MEMORY DEVICE

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS

Conductive Structures Of Integrated Circuits

BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FO...

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

Semiconductor Device and Method of Forming Thereof

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL

DEPOSITION WINDOW ENLARGEMENT