Local interconnects; Local pads, as exemplified by patent document EP0896365

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H01L21/76895

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76895Local interconnects; Local pads, as exemplified by patent document EP0896365

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device and electronic system including the same
- Patent number 11,973,035
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Ha-Min Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating microelectronic devices with contacts to co...
- Patent number 11,967,556
- Issue date Apr 23, 2024
- Biow Hiem Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,967,557
- Issue date Apr 23, 2024
- Kioxia Corporation
- Tomoya Inden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 11,963,362
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Seonghun Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned metal gate for multigate device and method of forming...
- Patent number 11,961,763
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for semiconductor interconnect
- Patent number 11,961,731
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ru-Shang Hsiao
- B08 - CLEANING
Information Patent Grant
Integrated circuits having cross-couple constructs and semiconducto...
- Patent number 11,955,471
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jung-Ho Do
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 11,955,430
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,948,889
- Issue date Apr 2, 2024
- Kioxia Corporation
- Go Oike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, structures and devices for intra-connection structures
- Patent number 11,943,908
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pedestal-based pocket integration process for embedded memory
- Patent number 11,942,133
- Issue date Mar 26, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and method of making thereof using...
- Patent number 11,942,429
- Issue date Mar 26, 2024
- SanDisk Technologies LLC
- Tatsuya Hinoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,935,835
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Hyo-Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate endcap (SAGE) architecture having gate contacts
- Patent number 11,935,892
- Issue date Mar 19, 2024
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing oxidation by etching sacrificial and protection layer sepa...
- Patent number 11,929,281
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,930,641
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching platinum-containing thin film using protective cap layer
- Patent number 11,929,423
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Sebastian Meier
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 11,915,972
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including an oxide material between adjacen...
- Patent number 11,917,825
- Issue date Feb 27, 2024
- Andrew Bicksler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, a memory array comprising strings of memory c...
- Patent number 11,915,974
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and manufacturing method of semiconductor device
- Patent number 11,908,701
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christine Y Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for designing three dimensional metal lines for enhanced dev...
- Patent number 11,908,747
- Issue date Feb 20, 2024
- Tokyo Electron Limited
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor having a source/drain contact with a single inner spacer
- Patent number 11,901,434
- Issue date Feb 13, 2024
- QUALCOMM Incorporated
- Junjing Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,901,228
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 11,901,297
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures of three-dimensional memory devices
- Patent number 11,903,204
- Issue date Feb 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a microelectronic device including stair step st...
- Patent number 11,903,211
- Issue date Feb 13, 2024
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect strucutre with protective etch-stop
- Patent number 11,901,221
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture design and process for manufacturing monolithically in...
- Patent number 11,901,360
- Issue date Feb 13, 2024
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,903,201
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Gordon A. Haller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
- Publication number 20240145477
- Publication date May 2, 2024
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240145304
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240147727
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP
- Publication number 20240136221
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NAND FLASH BLOCK ARCHITECTURE ENHANCEMENT TO PREVENT BLOCK LIFTING
- Publication number 20240128207
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Martin Jared Barclay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER WITH ON-DIE POWER SWITCHES
- Publication number 20240128192
- Publication date Apr 18, 2024
- ADVANCED MICRO DEVICES, INC.
- Suphachai Sutanthavibul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120279
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Jeong Hyuk YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20240114687
- Publication date Apr 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT LANDING ON A METAL CIRCUIT
- Publication number 20240112954
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240114681
- Publication date Apr 4, 2024
- SK HYNIX INC.
- Sung Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...
- Publication number 20240105584
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING
- Publication number 20240105640
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Aya MURAYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA-DOPED TRENCHES FOR MEMORY
- Publication number 20240105510
- Publication date Mar 28, 2024
- Micron Technology, Inc.
- Yiping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096806
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHAO-HSUAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN CONTACT HAVING HEIGHT B...
- Publication number 20240096867
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Charles Chew-Yuen YOUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20240096697
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT ELECTRICAL CONNECTION THAT CAN BE USED TO FORM AN SRAM CELL...
- Publication number 20240098960
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- YU-KUAN LIN
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID CONDUCTIVE STRUCTURES
- Publication number 20240096998
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BACKSIDE CONTACT IN NANOSHEET WITHOUT BDI
- Publication number 20240096699
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Chen Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088045
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jun Hyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Standard Cell Layout for Better Routability
- Publication number 20240088046
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tigran Zohrabyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TSV AS PAD
- Publication number 20240088101
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240088031
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Lifang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
- Publication number 20240087960
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240088236
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Wen HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED M...
- Publication number 20240079322
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20240081066
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Kang Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER REWIRING DOUBLE VERIFICATION STRUCTURE, AND MANUFACTURING MET...
- Publication number 20240079271
- Publication date Mar 7, 2024
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Wenjie HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...
- Publication number 20240079321
- Publication date Mar 7, 2024
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071816
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS

Local interconnects; Local pads, as exemplified by patent document EP0896365

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device and electronic system including the same

Methods for fabricating microelectronic devices with contacts to co...

Semiconductor device and manufacturing method thereof

Semiconductor devices and data storage systems including the same

Self-aligned metal gate for multigate device and method of forming...

Method and structure for semiconductor interconnect

Integrated circuits having cross-couple constructs and semiconducto...

Method of manufacturing semiconductor device and semiconductor devices

Semiconductor memory device

Method, structures and devices for intra-connection structures

Pedestal-based pocket integration process for embedded memory

Three-dimensional memory device and method of making thereof using...

Methods of manufacturing semiconductor devices

Self-aligned gate endcap (SAGE) architecture having gate contacts

Reducing oxidation by etching sacrificial and protection layer sepa...

Semiconductor devices

Etching platinum-containing thin film using protective cap layer

Methods of forming spacers for semiconductor devices including back...

Microelectronic devices including an oxide material between adjacen...

Integrated circuitry, a memory array comprising strings of memory c...

Patterning method and manufacturing method of semiconductor device

Method for designing three dimensional metal lines for enhanced dev...

Semiconductor having a source/drain contact with a single inner spacer

Self-aligned scheme for semiconductor device and method of forming...

Semiconductor memory device including wiring contact plugs

Interconnect structures of three-dimensional memory devices

Methods of forming a microelectronic device including stair step st...

Interconnect strucutre with protective etch-stop

Architecture design and process for manufacturing monolithically in...

Integrated assemblies, and methods of forming integrated assemblies

Patents Applicationslast 30 patents

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

INTERCONNECT STRUCUTRE WITH PROTECTIVE ETCH-STOP

NAND FLASH BLOCK ARCHITECTURE ENHANCEMENT TO PREVENT BLOCK LIFTING

BACKSIDE POWER WITH ON-DIE POWER SWITCHES

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES

SELF-ALIGNED CONTACT LANDING ON A METAL CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

PLASMA-DOPED TRENCHES FOR MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING SOURCE/DRAIN CONTACT HAVING HEIGHT B...

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

COMPACT ELECTRICAL CONNECTION THAT CAN BE USED TO FORM AN SRAM CELL...

HYBRID CONDUCTIVE STRUCTURES

SELF-ALIGNED BACKSIDE CONTACT IN NANOSHEET WITHOUT BDI

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Standard Cell Layout for Better Routability

TSV AS PAD

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES INCLUDING CONTACT STRUCTURES, AND RELATED M...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

WAFER REWIRING DOUBLE VERIFICATION STRUCTURE, AND MANUFACTURING MET...

SEMICONDUCTOR DEVICE WITH METAL SPACERS AND METHOD FOR FABRICATING...

STAIRCASE FORMATION IN A MEMORY ARRAY