Local interconnects; Local pads, as exemplified by patent document EP0896365

Industry

CPC
H01L21/76895

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76895Local interconnects; Local pads, as exemplified by patent document EP0896365

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory devices, methods for fabricating the same and...
- Patent number 12,199,043
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Geun Won Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned gate endcap (SAGE) architecture having gate contacts
- Patent number 12,199,101
- Issue date Jan 14, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard and engineering change order (ECO) cell regions and semico...
- Patent number 12,199,037
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chun Tien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a metal-oxide-semiconductor field-effect tr...
- Patent number 12,191,196
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device structure with metal-semico...
- Patent number 12,183,793
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 12,183,700
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 12,183,680
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for high pressure anneal
- Patent number 12,183,573
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-silicon via and method of fo...
- Patent number 12,183,660
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Jeonil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom lateral expansion of contact plugs through implantation
- Patent number 12,183,632
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,290
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Sungyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with buried power rail, integrated circuit...
- Patent number 12,165,927
- Issue date Dec 10, 2024
- Mediatek Inc.
- Po-Chao Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device including a through-via stru...
- Patent number 12,165,976
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 12,154,823
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Katsuhiko Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tiered-profile contact for semiconductor
- Patent number 12,148,663
- Issue date Nov 19, 2024
- International Business Machines Corporation
- Kisik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having a semiconductor material that is semimetal in bulk a...
- Patent number 12,148,816
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including a trench having a high aspect rat...
- Patent number 12,148,654
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transistor local interconnects
- Patent number 12,148,702
- Issue date Nov 19, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mahbub Rashed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming stacked trench contacts and structures formed the...
- Patent number 12,142,566
- Issue date Nov 12, 2024
- Intel Corporation
- Bernhard Sell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure having air gap and method of...
- Patent number 12,142,520
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement contact process
- Patent number 12,142,534
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Sankuei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp ring and method of using clamp ring
- Patent number 12,142,514
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different via configurations for different via interface requirements
- Patent number 12,142,565
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Che Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating pedestal based memory devices using pocket in...
- Patent number 12,142,310
- Issue date Nov 12, 2024
- Kepler Computing Inc.
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure for memory device
- Patent number 12,137,558
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 12,137,567
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,132,001
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Yong Kong Siew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and forming method thereof
- Patent number 12,125,896
- Issue date Oct 22, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and electronic systems including the same
- Patent number 12,125,791
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS
- Publication number 20250022881
- Publication date Jan 16, 2025
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Of Integrated Circuits
- Publication number 20250022802
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu Pei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FO...
- Publication number 20250014993
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250015162
- Publication date Jan 9, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20250017019
- Publication date Jan 9, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006641
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Yoon Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...
- Publication number 20240429171
- Publication date Dec 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Publication number 20240421090
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Seo Woo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...
- Publication number 20240412975
- Publication date Dec 12, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...
- Publication number 20240413009
- Publication date Dec 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ling XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS
- Publication number 20240413016
- Publication date Dec 12, 2024
- Intel Corporation
- Sridhar GOVINDARAJU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...
- Publication number 20240413162
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240404876
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kan-Ju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240395605
- Publication date Nov 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Janbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395701
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...
- Publication number 20240395618
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY
- Publication number 20240395711
- Publication date Nov 28, 2024
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices Having a Semiconductor Material That Is Semimetal in Bulk a...
- Publication number 20240387711
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jean-Pierre Colinge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thereof
- Publication number 20240387664
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240387372
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL
- Publication number 20240387369
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Hung SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP RING AND METHOD OF USING CLAMP RING
- Publication number 20240387233
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION WINDOW ENLARGEMENT
- Publication number 20240387180
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Han Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION
- Publication number 20240387656
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Chih HSIUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT FORMATION METHOD AND RELATED STRUCTURE
- Publication number 20240379432
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Che LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379431
- Publication date Nov 14, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chia-Hao CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Structures
- Publication number 20240379546
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS

Local interconnects; Local pads, as exemplified by patent document EP0896365

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory devices, methods for fabricating the same and...

Self-aligned gate endcap (SAGE) architecture having gate contacts

Standard and engineering change order (ECO) cell regions and semico...

Method of manufacturing a metal-oxide-semiconductor field-effect tr...

Method for forming semiconductor device structure with metal-semico...

Semiconductor device package and method of manufacture

Semiconductor memory device including wiring contact plugs

Device and method for high pressure anneal

Semiconductor device including through-silicon via and method of fo...

Bottom lateral expansion of contact plugs through implantation

Semiconductor device

Semiconductor structure with buried power rail, integrated circuit...

Three-dimensional semiconductor device including a through-via stru...

Semiconductor devices and method for forming the same

Semiconductor device and a method of manufacturing the same

Tiered-profile contact for semiconductor

Devices having a semiconductor material that is semimetal in bulk a...

Semiconductor structure including a trench having a high aspect rat...

Semiconductor device with transistor local interconnects

Method of forming stacked trench contacts and structures formed the...

Middle-of-line interconnect structure having air gap and method of...

Replacement contact process

Clamp ring and method of using clamp ring

Different via configurations for different via interface requirements

Method of fabricating pedestal based memory devices using pocket in...

Staircase structure for memory device

Interconnect structure of three-dimensional memory device

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device and forming method thereof

Semiconductor devices and electronic systems including the same

Patents Applicationslast 30 patents

SELF-ALIGNED GATE ENDCAP (SAGE) ARCHITECTURE HAVING GATE CONTACTS

Conductive Structures Of Integrated Circuits

BACKSIDE CONNECTION STRUCTURES FOR NANOSTRUCTURES AND METHODS OF FO...

SEMICONDUCTOR DEVICE

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PROTECTION LINERS AND AIR GAPS AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING GATE SPACER PR...

BARRIER LAYERS FOR WORD LINE CONTACTS IN A THREE-DIMENSIONAL NAND M...

TECHNIQUES AND CONFIGURATIONS TO REDUCE TRANSISTOR GATE SHORT DEFECTS

CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ALL-TUNGSTEN SCHEME FOR SOURCE/DRAIN CONTACT, SOURCE/DRAIN VIA, AND...

SPLIT BACKSIDE POWER RAIL FOR ISOLATED SUPPLY

Devices Having a Semiconductor Material That Is Semimetal in Bulk a...

Semiconductor Device and Method of Forming Thereof

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL

CLAMP RING AND METHOD OF USING CLAMP RING

DEPOSITION WINDOW ENLARGEMENT

SEMICONDUCTOR DEVICE INTERCONNECTS AND METHODS OF FORMATION

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

CONTACT FORMATION METHOD AND RELATED STRUCTURE

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

SEMICONDUCTOR DEVICE

Via Structures