Locally and permanently deformed areas including dielectric material

Industry

CPC
H05K2201/091

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/091Locally and permanently deformed areas including dielectric material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart connector and method of manufacturing same using an applicati...
- Patent number 12,176,659
- Issue date Dec 24, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lighting strip
- Patent number 12,169,059
- Issue date Dec 17, 2024
- SIGNIFY HOLDING, B.V.
- Andrew Christanto
- F21 - LIGHTING
Information Patent Grant
Component carrier with embedded interposer laterally between electr...
- Patent number 12,165,964
- Issue date Dec 10, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Minwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board
- Patent number 12,137,521
- Issue date Nov 5, 2024
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded article, electrical product and method for producing molded...
- Patent number 12,122,078
- Issue date Oct 22, 2024
- Nissha Co., Ltd.
- Seiichi Yamazaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composite circuit board and method of manufacturing the same
- Patent number 12,114,436
- Issue date Oct 8, 2024
- SHENNAN CIRCUITS CO., LTD.
- Zhicheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory system
- Patent number 12,094,866
- Issue date Sep 17, 2024
- Kioxia Corporation
- Hayato Masubuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image forming apparatus including a printed circuit board connectab...
- Patent number 12,085,868
- Issue date Sep 10, 2024
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical junction box
- Patent number 12,048,105
- Issue date Jul 23, 2024
- Yazaki Corporation
- Hitoshi Tsugane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a top plane connection in an electro-optic device
- Patent number 12,038,666
- Issue date Jul 16, 2024
- E Ink Corporation
- Matthew Joseph Kayal
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sensor device and electronic apparatus
- Patent number 12,031,847
- Issue date Jul 9, 2024
- Seiko Epson Corporation
- Masayasu Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,010,795
- Issue date Jun 11, 2024
- LG Innotek Co., Ltd
- Il Sik Nam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,997,801
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure between printed circuit board and terminal blo...
- Patent number 11,955,739
- Issue date Apr 9, 2024
- Daikin Industries, Ltd.
- Kazunari Fukagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic printed circuit board
- Patent number 11,945,500
- Issue date Apr 2, 2024
- ThyssenKrupp Presta AG
- Robert Galehr
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate unit and substrate assembly, and camera module using same
- Patent number 11,937,382
- Issue date Mar 19, 2024
- LG Innotek Co., Ltd
- Hyun Woo Ryou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20240389239
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE FORMING APPARATUS
- Publication number 20240369951
- Publication date Nov 7, 2024
- Canon Kabushiki Kaisha
- SHINSUKE SERIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME
- Publication number 20240364291
- Publication date Oct 31, 2024
- TDK Corporation
- Toshiyuki ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240349428
- Publication date Oct 17, 2024
- U-BLOX AG
- Anthony Gergis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT
- Publication number 20240324109
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Device And Electronic Apparatus
- Publication number 20240302191
- Publication date Sep 12, 2024
- SEIKO EPSON CORPORATION
- Masayasu SAKUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240292534
- Publication date Aug 29, 2024
- LG Innotek Co., Ltd.
- Il Sik NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional Wired Circuit Board Structure
- Publication number 20240292538
- Publication date Aug 29, 2024
- Guangzhou Kanglong Electronics Co., Ltd.
- Tielong KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB
- Publication number 20240291181
- Publication date Aug 29, 2024
- GUANGZHOU KANGLONG ELECTRONICS CO., LTD.
- Tielong KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240276656
- Publication date Aug 15, 2024
- ACTRON TECHNOLOGY CORPORATION
- Hsin-Chang Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20240224417
- Publication date Jul 4, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240206074
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240188221
- Publication date Jun 6, 2024
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME
- Publication number 20240188229
- Publication date Jun 6, 2024
- LG Innotek Co., Ltd.
- HYUN WOO RYOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DATA THROUGHPUT USING A METAL BRACKET
- Publication number 20240172398
- Publication date May 23, 2024
- Micron Technology, Inc.
- Deepu Narasimiah Subhash
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES
- Publication number 20240107669
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LATCHING SYSTEM FOR ESTABLISHING A LATCHING CONNECTION BETWEEN A PR...
- Publication number 20240064909
- Publication date Feb 22, 2024
- HELLA GmbH & Co. KGaA
- Alexander HANSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240049388
- Publication date Feb 8, 2024
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS

Locally and permanently deformed areas including dielectric material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Beveled overburden for vias and method of making the same

Smart connector and method of manufacturing same using an applicati...

Lighting strip

Component carrier with embedded interposer laterally between electr...

Wiring circuit board, producing method thereof, and wiring circuit...

Multilayer circuit board

Patterned article including electrically conductive elements

Molded article, electrical product and method for producing molded...

Composite circuit board and method of manufacturing the same

Semiconductor memory system

Reciprocal PCB manufacturing process

Image forming apparatus including a printed circuit board connectab...

Through-hole electrode substrate

Heat sink integrated insulating circuit board

Devices and methods related to metallization of ceramic substrates...

Electrical junction box

Patterned conductive article

Method of forming a top plane connection in an electro-optic device

Sensor device and electronic apparatus

Printed circuit board

Printed circuit board

Laminated circuit board

Electronic component

Vacuum-assisted BGA joint formation

Packaged semiconductor device

Connection structure between printed circuit board and terminal blo...

Electronic printed circuit board

Sensor interposer employing castellated through-vias

Thermally enhanced semiconductor package with at least one heat ext...

Substrate unit and substrate assembly, and camera module using same

Patents Applicationslast 30 patents

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

THROUGH-HOLE ELECTRODE SUBSTRATE

SEMICONDUCTOR MEMORY SYSTEM

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

IMAGE FORMING APPARATUS

CIRCUIT BOARD AND CONNECTOR DEVICE HAVING THE SAME

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD

HEAT SPREADER FOR MODIFIED EDGE COOLING

SOLDER BARRIER CONTACT FOR AN INTEGRATED CIRCUIT

Ultra-Thin Sandwich Component

CIRCUIT STRUCTURE

Sensor Device And Electronic Apparatus

PATTERNED CONDUCTIVE ARTICLE

PRINTED CIRCUIT BOARD

Three-Dimensional Wired Circuit Board Structure

BOARD-TO-BOARD CONNECTION STRUCTURE FOR PCB

CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

SEMICONDUCTOR STORAGE DEVICE

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME

DATA THROUGHPUT USING A METAL BRACKET

INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

LATCHING SYSTEM FOR ESTABLISHING A LATCHING CONNECTION BETWEEN A PR...

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE