Locally and permanently deformed areas including dielectric material

Industry

CPC
H05K2201/091

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/091Locally and permanently deformed areas including dielectric material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure between printed circuit board and terminal blo...
- Patent number 11,955,739
- Issue date Apr 9, 2024
- Daikin Industries, Ltd.
- Kazunari Fukagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic printed circuit board
- Patent number 11,945,500
- Issue date Apr 2, 2024
- ThyssenKrupp Presta AG
- Robert Galehr
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate unit and substrate assembly, and camera module using same
- Patent number 11,937,382
- Issue date Mar 19, 2024
- LG Innotek Co., Ltd
- Hyun Woo Ryou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing device
- Patent number 11,917,784
- Issue date Feb 27, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge connector, circuit board, and connector component
- Patent number 11,909,134
- Issue date Feb 20, 2024
- Huawei Technologies Co., Ltd.
- Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible connectors for expansion board
- Patent number 11,881,646
- Issue date Jan 23, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Marco Assale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surge protection device
- Patent number 11,877,407
- Issue date Jan 16, 2024
- EATON INTELLIGENT POWER LIMITED
- Ramesh Shivaji Powar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,842,939
- Issue date Dec 12, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having circuit members between overlapping sealing members
- Patent number 11,800,654
- Issue date Oct 24, 2023
- Japan Aviation Electronics Industry, Limited
- Shinji Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device for connection with a circuit element
- Patent number 11,800,249
- Issue date Oct 24, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuta Momiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate
- Patent number 11,792,927
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Rie Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier for arranging electrical components on a circuit...
- Patent number 11,770,896
- Issue date Sep 26, 2023
- HARTING AG
- Thomas Hess
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor device and electronic apparatus
- Patent number 11,709,079
- Issue date Jul 25, 2023
- Seiko Epson Corporation
- Masayasu Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory system
- Patent number 11,705,444
- Issue date Jul 18, 2023
- Kioxia Corporation
- Hayato Masubuchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Encapsulated printed circuit board assembly
- Patent number 11,683,880
- Issue date Jun 20, 2023
- 3M Innovative Properties Company
- Gunther A. J. Stollwerck
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of circuit carrier board structure
- Patent number 11,678,441
- Issue date Jun 13, 2023
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,676,878
- Issue date Jun 13, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery pack
- Patent number 11,677,116
- Issue date Jun 13, 2023
- Makita Corporation
- Tatsuya Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making smart functional leather
- Patent number 11,665,830
- Issue date May 30, 2023
- Honda Motor Co., Ltd.
- Zainab I. Ali
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical support within moulded chip package
- Patent number 11,659,663
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Kimmo Kaija
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a three-dimensional liquid crystal polymer multil...
- Patent number 11,657,989
- Issue date May 23, 2023
- Harris Corporation
- Louis Joseph Rendek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES
- Publication number 20240107669
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LATCHING SYSTEM FOR ESTABLISHING A LATCHING CONNECTION BETWEEN A PR...
- Publication number 20240064909
- Publication date Feb 22, 2024
- HELLA GmbH & Co. KGaA
- Alexander HANSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240049388
- Publication date Feb 8, 2024
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
- Publication number 20240032190
- Publication date Jan 25, 2024
- Canon Kabushiki Kaisha
- KOICHI ODAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR REVERSIBLE CONNECTION OF INTERCHANGABLE COMPO...
- Publication number 20240032194
- Publication date Jan 25, 2024
- Dell Products L.P.
- EDUARDO ESCAMILLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Prototyping
- Publication number 20240008174
- Publication date Jan 4, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward HODGES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER
- Publication number 20230422403
- Publication date Dec 28, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wen Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20230307433
- Publication date Sep 28, 2023
- Kioxia Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230199961
- Publication date Jun 22, 2023
- Industrial Technology Research Institute
- Yu-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20230189429
- Publication date Jun 15, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230189452
- Publication date Jun 15, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Woo Seok YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTHERBOARD COMPRISING A PLANAR TRANSFORMER EQUIPPED WITH COMPONENT...
- Publication number 20230170128
- Publication date Jun 1, 2023
- MBDA FRANCE
- Charlotte GAZZANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME
- Publication number 20230171899
- Publication date Jun 1, 2023
- LG Innotek Co., Ltd.
- HYUN WOO RYOU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD ASSEMLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230164919
- Publication date May 25, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- SHI-JIE ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD
- Publication number 20230100232
- Publication date Mar 30, 2023
- 3M Innovative Properties Company
- YunLong Qiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIXING DEVICE
- Publication number 20230081766
- Publication date Mar 16, 2023
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Yu HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230072239
- Publication date Mar 9, 2023
- SHENNAN CIRCUITS CO.,LTD.
- ZHICHENG YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...
- Publication number 20230061125
- Publication date Mar 2, 2023
- HARTING AG
- Thomas HESS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STIFFENER RING AND SURFACE PACKAGING ASSEMBLY
- Publication number 20230066053
- Publication date Mar 2, 2023
- Huawei Technologies Co., Ltd
- Chuncheng GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT SUBSTRATE
- Publication number 20230054390
- Publication date Feb 23, 2023
- Shinko Electric Industries Co., Ltd.
- Rie MIZUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...
- Publication number 20230007781
- Publication date Jan 5, 2023
- FUJIKURA LTD.
- Kazutoshi Koshimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT
- Publication number 20220418078
- Publication date Dec 29, 2022
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...
- Publication number 20220386463
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE WITH CASTELLATED BOARD
- Publication number 20220377901
- Publication date Nov 24, 2022
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE, IN PARTICULAR INVERTER OR CONVERTER
- Publication number 20220377892
- Publication date Nov 24, 2022
- SEW-EURODRIVE GMBH & CO. KG
- Werner GROß
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220338346
- Publication date Oct 20, 2022
- LG Innotek Co., Ltd.
- Il Sik NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL JUNCTION BOX
- Publication number 20220330440
- Publication date Oct 13, 2022
- YAZAKI CORPORATION
- Hitoshi Tsugane
- H01 - BASIC ELECTRIC ELEMENTS

Locally and permanently deformed areas including dielectric material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated circuit board

Electronic component

Vacuum-assisted BGA joint formation

Packaged semiconductor device

Connection structure between printed circuit board and terminal blo...

Electronic printed circuit board

Sensor interposer employing castellated through-vias

Thermally enhanced semiconductor package with at least one heat ext...

Substrate unit and substrate assembly, and camera module using same

Fixing device

Edge connector, circuit board, and connector component

Flexible connectors for expansion board

Electronic component, electric device including the same

Surge protection device

Thermally enhanced semiconductor package with at least one heat ext...

Device having circuit members between overlapping sealing members

Imaging device for connection with a circuit element

Interconnect substrate

Component carrier for arranging electrical components on a circuit...

Method for manufacturing a circuit having a lamination layer using...

Sensor device and electronic apparatus

Semiconductor memory system

Encapsulated printed circuit board assembly

Manufacturing method of circuit carrier board structure

Thermally enhanced semiconductor package with at least one heat ext...

Battery pack

Method of making smart functional leather

Adapter board and method for making adapter board

Mechanical support within moulded chip package

Method for making a three-dimensional liquid crystal polymer multil...

Patents Applicationslast 30 patents

INTERLOCKED CIRCUIT BOARD ELEMENTS AND ASSEMBLIES

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

LATCHING SYSTEM FOR ESTABLISHING A LATCHING CONNECTION BETWEEN A PR...

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE

SYSTEM AND METHOD FOR REVERSIBLE CONNECTION OF INTERCHANGABLE COMPO...

Electronic Prototyping

METHODS AND SYSTEMS FOR IMPROVING SURFACE MOUNT JOINDER

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

SEMICONDUCTOR MEMORY SYSTEM

ELECTRONIC APPARATUS

MODULE

PRINTED CIRCUIT BOARD

MOTHERBOARD COMPRISING A PLANAR TRANSFORMER EQUIPPED WITH COMPONENT...

SUBSTRATE UNIT AND SUBSTRATE ASSEMBLY, AND CAMERA MODULE USING SAME

CIRCUIT BOARD ASSEMLY AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER CIRCUIT BOARD

FIXING DEVICE

COMPOSITE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

COMPONENT CARRIER FOR ARRANGING ELECTRICAL COMPONENTS ON A CIRCUIT...

STIFFENER RING AND SURFACE PACKAGING ASSEMBLY

INTERCONNECT SUBSTRATE

METHOD FOR MANUFACTURING WIRING BOARD, WIRING BOARD, METHOD FOR MAN...

FLEXIBLE PRINTED CIRCUIT COPPER OVERLAY FOR TEMPERATURE MANAGEMENT

WIRING CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND WIRING CIRCUIT...

ELECTRONIC DEVICE WITH CASTELLATED BOARD

ELECTRICAL DEVICE, IN PARTICULAR INVERTER OR CONVERTER

PRINTED CIRCUIT BOARD

ELECTRICAL JUNCTION BOX