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H05K2201/09109

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09109Locally detached layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a carrier arrangement
- Patent number 12,273,993
- Issue date Apr 8, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device having circuit members between overlapping sealing members
- Patent number 11,800,654
- Issue date Oct 24, 2023
- Japan Aviation Electronics Industry, Limited
- Shinji Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective film of conductive adhesive, circuit board, and method f...
- Patent number 10,993,316
- Issue date Apr 27, 2021
- BOE (Hebei) Mobile Display Technology Co., Ltd.
- Lei Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper-respondent assemblies with bond protection
- Patent number 10,624,202
- Issue date Apr 14, 2020
- International Business Machines Corporation
- William L. Brodsky
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 10,609,819
- Issue date Mar 31, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deformable apparatus and method
- Patent number 10,435,289
- Issue date Oct 8, 2019
- Nokia Technoloiges Oy
- Darryl Cotton
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pocket connector
- Patent number 10,374,344
- Issue date Aug 6, 2019
- New Cable Corporation Oy
- Tommi Rintala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Orthogonally polarized dual frequency co-axially stacked phased-arr...
- Patent number 10,347,991
- Issue date Jul 9, 2019
- TUBIS TECHNOLOGY, INC.
- Ce Zhang
- G02 - OPTICS
Information Patent Grant
Orthogonally polarized dual frequency co-axially stacked phased-arr...
- Patent number 10,297,918
- Issue date May 21, 2019
- Ce Zhang
- G02 - OPTICS
Information Patent Grant
Self-decap cavity fabrication process and structure
- Patent number 9,999,134
- Issue date Jun 12, 2018
- Multek Technologies Limited
- Mark Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuits with bend retention structures
- Patent number 9,769,920
- Issue date Sep 19, 2017
- Apple Inc.
- Colin M. Ely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit cables with service loops and overbending...
- Patent number 9,658,648
- Issue date May 23, 2017
- Apple Inc.
- Benjamin M. Rappoport
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer microwave corrugated printed circuit board and method
- Patent number 9,491,854
- Issue date Nov 8, 2016
- Raytheon Company
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant printed flexible circuit
- Patent number 9,414,500
- Issue date Aug 9, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compact rigid-flexible printed circuit board and method for manufac...
- Patent number 9,210,811
- Issue date Dec 8, 2015
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Biao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and method for manufacturing same
- Patent number 9,131,633
- Issue date Sep 8, 2015
- Kabushiki Kaisha Toshiba
- Kentaro Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with flexible region and method for production thereof
- Patent number 9,035,189
- Issue date May 19, 2015
- EPCOS AC
- Wolfgang Pahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Deformable apparatus and method
- Patent number 8,895,864
- Issue date Nov 25, 2014
- Nokia Corporation
- Darryl Cotton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave connector substrate, method of manufacturing the same, meas...
- Patent number 8,839,513
- Issue date Sep 23, 2014
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-chip flex module
- Patent number 8,559,181
- Issue date Oct 15, 2013
- Microelectronics Assembly Technologies, Inc.
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concave connector substrate, method of manufacturing the same, meas...
- Patent number 8,535,623
- Issue date Sep 17, 2013
- Hitachi Chemical Company, Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing interleaved-dielectric joining of multi-layer laminates
- Patent number 8,491,739
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Philip R. Germann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board, multilayered flexible printed wiring...
- Patent number 8,383,230
- Issue date Feb 26, 2013
- Arisawa Mfg. Co., Ltd.
- Kazuhide Kita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin multi-chip flex module
- Patent number 8,345,431
- Issue date Jan 1, 2013
- Microelectronics Assembly Technologies, Inc.
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device
- Patent number 8,279,612
- Issue date Oct 2, 2012
- Aisin Aw Co., Ltd.
- Naotaka Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible flat circuit cable with gapped section
- Patent number 8,273,990
- Issue date Sep 25, 2012
- Advanced Flexible Circuits Co., Ltd.
- Gwun-Jin Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tape for heat dissipating member, chip on film type semiconductor p...
- Patent number 8,222,089
- Issue date Jul 17, 2012
- Samsung Electronics Co., Ltd.
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, a method of manufacturing printed wiring boar...
- Patent number 8,193,628
- Issue date Jun 5, 2012
- Ricoh Company, Ltd.
- Toshihiko Makino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning methods for stretchable structures
- Patent number 8,187,795
- Issue date May 29, 2012
- The Board of Trustees of the University of Illinois
- Kanti Jain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid structure of multi-layer substrates and manufacture method t...
- Patent number 8,111,519
- Issue date Feb 7, 2012
- Princo Corp.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20240224417
- Publication date Jul 4, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE
- Publication number 20220322518
- Publication date Oct 6, 2022
- Japan Aviation Electronics Industry, Limited
- Shinji UEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ARRANGEMENT AND METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20220095450
- Publication date Mar 24, 2022
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Orthogonally polarized dual frequency co-axially stacked phased-arr...
- Publication number 20170352960
- Publication date Dec 7, 2017
- TUBIS TECHNOLOGY, INC.
- Ce Zhang
- G02 - OPTICS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME M...
- Publication number 20150131253
- Publication date May 14, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20140305683
- Publication date Oct 16, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
- Publication number 20130319732
- Publication date Dec 5, 2013
- Raytheon Company
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEAS...
- Publication number 20130318786
- Publication date Dec 5, 2013
- Hitachi Chemical Company, Ltd.
- Hidehiro NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
Deformable Apparatus and Method
- Publication number 20130256004
- Publication date Oct 3, 2013
- Nokia Corporation
- Darryl COTTON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING INTERLEAVED-DIELECTRIC JOINING OF MULTI-LAYER LAMINATES
- Publication number 20130221068
- Publication date Aug 29, 2013
- International Business Machines Corporation
- Philip R. Germann
- B32 - LAYERED PRODUCTS
Information Patent Application
Implementing Interleaved-Dielectric Joining of Multi-Layer Laminates
- Publication number 20120061023
- Publication date Mar 15, 2012
- International Business Machines Corporation
- Philip R. Germann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT PRINTED FLEXIBLE CIRCUIT
- Publication number 20120055702
- Publication date Mar 8, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board with Flexible Region and Method for Production Thereof
- Publication number 20110214905
- Publication date Sep 8, 2011
- EPCOS AG
- Wolfgang Pahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...
- Publication number 20110143625
- Publication date Jun 16, 2011
- Kyoung-sei Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20110139329
- Publication date Jun 16, 2011
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20110138617
- Publication date Jun 16, 2011
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD T...
- Publication number 20110124155
- Publication date May 26, 2011
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD T...
- Publication number 20110124154
- Publication date May 26, 2011
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin multi-chip flex module
- Publication number 20110116244
- Publication date May 19, 2011
- James E. Clayton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE FLAT CIRCUIT CABLE WITH GAPPED SECTION
- Publication number 20110094790
- Publication date Apr 28, 2011
- ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- GWUN-JIN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD
- Publication number 20110024160
- Publication date Feb 3, 2011
- Clifton Quan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEX CIRCUIT BOARD, AND THE RIGID-FLE...
- Publication number 20110005811
- Publication date Jan 13, 2011
- SUMITOMO BAKELITE CO., LTD.
- Hajime Yamato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vertical probe intrface system
- Publication number 20100330830
- Publication date Dec 30, 2010
- Corad Technology Inc.
- Ka Ng Chui
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD
- Publication number 20100282497
- Publication date Nov 11, 2010
- SUMITOMO BAKELITE CO., LTD.
- Hiroaki Hashido
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concave connector substrate, method of manufacturing the same, meas...
- Publication number 20100263462
- Publication date Oct 21, 2010
- Hidehiro NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC CIRCUIT DEVICE
- Publication number 20100232115
- Publication date Sep 16, 2010
- AISIN AW CO., LTD.
- Naotaka Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR FIXING FLEXIBLE WIRING BOARD
- Publication number 20100202119
- Publication date Aug 12, 2010
- Mitsubishi Electric Corporation
- Tetsuro Nagami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING METHODS FOR STRETCHABLE STRUCTURES
- Publication number 20100143848
- Publication date Jun 10, 2010
- Kanti Jain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, A METHOD OF MANUFACTURING PRINTED WIRING BOAR...
- Publication number 20100084727
- Publication date Apr 8, 2010
- Toshihiko MAKINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20100051326
- Publication date Mar 4, 2010
- IBIDEN CO., LTD.
- Katsumi Sagisaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Locally detached layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a carrier arrangement

Device having circuit members between overlapping sealing members

Protective film of conductive adhesive, circuit board, and method f...

Tamper-respondent assemblies with bond protection

Hybrid printed circuit assembly with low density main core and embe...

Deformable apparatus and method

Pocket connector

Orthogonally polarized dual frequency co-axially stacked phased-arr...

Orthogonally polarized dual frequency co-axially stacked phased-arr...

Self-decap cavity fabrication process and structure

Flexible printed circuits with bend retention structures

Flexible printed circuit cables with service loops and overbending...

Multi-layer microwave corrugated printed circuit board and method

Compliant printed flexible circuit

Compact rigid-flexible printed circuit board and method for manufac...

Display device and method for manufacturing same

Circuit board with flexible region and method for production thereof

Deformable apparatus and method

Concave connector substrate, method of manufacturing the same, meas...

Thin multi-chip flex module

Concave connector substrate, method of manufacturing the same, meas...

Implementing interleaved-dielectric joining of multi-layer laminates

Flexible printed wiring board, multilayered flexible printed wiring...

Thin multi-chip flex module

Electronic circuit device

Flexible flat circuit cable with gapped section

Tape for heat dissipating member, chip on film type semiconductor p...

Printed wiring board, a method of manufacturing printed wiring boar...

Patterning methods for stretchable structures

Hybrid structure of multi-layer substrates and manufacture method t...

Patents Applicationslast 30 patents

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

DEVICE

CARRIER ARRANGEMENT AND METHOD FOR PRODUCING A CARRIER ARRANGEMENT

Orthogonally polarized dual frequency co-axially stacked phased-arr...

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME M...

COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

CONCAVE CONNECTOR SUBSTRATE, METHOD OF MANUFACTURING THE SAME, MEAS...

Deformable Apparatus and Method

IMPLEMENTING INTERLEAVED-DIELECTRIC JOINING OF MULTI-LAYER LAMINATES

Implementing Interleaved-Dielectric Joining of Multi-Layer Laminates

COMPLIANT PRINTED FLEXIBLE CIRCUIT

Circuit Board with Flexible Region and Method for Production Thereof

TAPE FOR HEAT DISSIPATING MEMBER, CHIP ON FILM TYPE SEMICONDUCTOR P...

Thin multi-chip flex module

Thin multi-chip flex module

HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD T...

HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD T...

Thin multi-chip flex module

FLEXIBLE FLAT CIRCUIT CABLE WITH GAPPED SECTION

MULTI-LAYER MICROWAVE CORRUGATED PRINTED CIRCUIT BOARD AND METHOD

METHOD OF MANUFACTURING RIGID-FLEX CIRCUIT BOARD, AND THE RIGID-FLE...

Vertical probe intrface system

CIRCUIT BOARD

Concave connector substrate, method of manufacturing the same, meas...

ELECTRONIC CIRCUIT DEVICE

STRUCTURE FOR FIXING FLEXIBLE WIRING BOARD

PATTERNING METHODS FOR STRETCHABLE STRUCTURES

PRINTED WIRING BOARD, A METHOD OF MANUFACTURING PRINTED WIRING BOAR...

FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE